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Modified epoxy resin by organic silicon and its electronic packag material and preparation process thereof

A technology of epoxy resin and phenolic epoxy resin, applied in chemical instruments and methods, other chemical processes, etc., can solve the problems of difficult to form uniformity, low water absorption, poor compatibility, etc.

Inactive Publication Date: 2005-01-05
GUANGZHOU INST OF GEOCHEMISTRY - CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The compatibility between organosiloxane and epoxy resin is poor, and it is difficult to form a uniform blend before curing. At present, silicones with reactive groups such as carboxyl and amino groups are generally used to react with epoxy groups at home and abroad to improve the phase. Capacitance, as a result, although the purpose of toughening can be achieved, and the water absorption rate is also reduced to a certain extent, it is still difficult to meet the relevant technical requirements

Method used

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  • Modified epoxy resin by organic silicon and its electronic packag material and preparation process thereof
  • Modified epoxy resin by organic silicon and its electronic packag material and preparation process thereof
  • Modified epoxy resin by organic silicon and its electronic packag material and preparation process thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0070] Take 60g of E-44 epoxy resin (epoxy value 0.44mol / 100g), dissolve it with toluene, and place it in a three-necked bottle; take 7.8g of triethylamine, also add it to the three-necked bottle, and stir at a high speed. Take 5g of dichlorodimethylsilane, dilute it with toluene, add it into a three-necked bottle, and react. After the reaction was completed, the resulting mixed solution was transferred into a separatory funnel, washed with distilled water, and stopped when the pH value of the solution was neutral. The solution was distilled under reduced pressure to remove the toluene to obtain a modified resin mixture. Then add 40g of tetrabromobisphenol A epoxy resin (epoxy value 0.245mol / 100g) and mix evenly, and the resulting resin mixture is solidified into a mold with DDM (100g resin~21gDDM), and its impact strength is measured to be 2.86MPa, tensile The tensile strength was 36.78 MPa, the elongation at break was 29%, the Tg was 201° C., and the water absorption was 0....

Embodiment 2

[0072] Take 50g of E-32 (epoxy value 0.32mol / 100g), dissolve it in toluene, and put it in a three-necked bottle; take 0.3g of triethylamine, also add it into the three-necked bottle, and stir at a high speed. Take 10.2 g of monochloro-terminated polydimethylsiloxane (molecular weight about 8000), dissolve it in toluene, put it into a three-necked bottle, and react. After the reaction was completed, the resulting mixed solution was transferred into a separatory funnel, washed with distilled water, and stopped when the pH value of the solution was neutral. The solution was distilled under reduced pressure to remove the toluene to obtain a modified resin mixture. Gained resin is mixed with 30g o-cresol novolak epoxy resin (epoxy value 0.51mol / 100g) at last and is solidified into a mold with phenolic resin curing agent (100g resin~40g phenolic resin), and its impact strength recorded is 2.93MPa, The tensile strength was 46.52 MPa, the elongation at break was 32%, the Tg was 194°C...

Embodiment 3

[0074] Take 40g of E-44 (epoxy value is 0.44mol / 100g), dissolve it in toluene, put it in a three-necked bottle, take 0.3g of triethylamine, also add it into the three-necked bottle, and stir at high speed at the same time. Take 10.2 g of dichloro-terminated polydimethylsiloxane (molecular weight about 8000), dissolve it in toluene, put it into a three-necked bottle, and react. After the reaction was completed, the resulting mixed solution was transferred into a separatory funnel, washed with distilled water, and stopped when the pH value of the solution was neutral. The solution was distilled under reduced pressure to remove the toluene to obtain a modified resin mixture. Finally the gained resin is mixed with 30g o-cresol novolac epoxy resin (epoxy value 0.51mol / 100g), 30g bis(3-glycidyl) phenyl phosphonate (epoxy value 0.24mol / 100g) The DDS curing agent (100g resin ~ 24gDDS) was cured into a mold. The measured impact strength was 1.76MPa, tensile strength was 35.78MPa, elon...

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Abstract

The invention relates to an organic modified epoxy resin and its preparing method as well as electronic packaging material made from it and the preparing method of this packaging material. At normal temperature and normal pressure, using 100 share biphenol A epoxy resin to react with 0-20 share alkyl silicon and 0-100 share chloride terminated polysiloxane in an organic solvent in weight share, after completing reaction, washing out quaternary ammonium salts, then making vacuum distillation to eliminate the organic solvent, and obtaining the product modified resin; in weight share, mixing the obtained modified resin with 0-200 share phenol aldehyde epoxy resin, 0-100 share bromic epoxy resin and 0-100 share phosphoric epoxy resin, using 0-80 share high-temperature solidifying agent so as to obtain more excellent performance electronic packaging epoxy resin material, which has high Tg, high flexibility, low water absorption ratio, and other properties, beneficial to large-scale spread and application as well as industrialization.

Description

technical field [0001] The invention relates to a silicone-modified epoxy resin and a preparation method thereof, an electronic packaging material made from it, and a preparation method of the electronic packaging material. technical background [0002] Epoxy resin has excellent physical and mechanical properties and electrical properties, and is widely used in coatings, adhesives, and electronic packaging materials. One of the most important uses of epoxy resins is as an electronic packaging material. The development of contemporary electronic technology puts forward higher requirements on the performance of epoxy resin, especially its heat resistance, moisture resistance and mechanical properties. At present, the most commonly used heat-resistant epoxy in epoxy resin packaging materials, such as o-cresol novolac epoxy resin, has the advantage of excellent heat resistance, but with the increase of glass transition temperature, the brittleness and water absorption rate also...

Claims

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Application Information

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IPC IPC(8): C08G59/14C09K3/10
Inventor 刘伟区黎艳
Owner GUANGZHOU INST OF GEOCHEMISTRY - CHINESE ACAD OF SCI
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