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Adhesive tape

A technology of adhesive tape and adhesive, applied in the direction of adhesive type, ester copolymer adhesive, acid copolymer adhesive, etc., can solve the problem of residual slurry, etc., and achieve good pick-up and slicing characteristics Excellent, the effect of suppressing the increase of adhesive force

Inactive Publication Date: 2005-05-25
NITTO BELGIUM NV +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, there is also the problem of residual slurry under long-term storage

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0048] (support body)

[0049] A soft PVC film containing 27 parts by weight of DOP with respect to 100 parts by weight of PVC having a degree of polymerization of 1050 and having a thickness of 70 μm was used.

[0050] (Preparation of Adhesive Layer)

[0051] 85 parts by weight of butyl acrylate, 15 parts by weight of acrylonitrile, and 2.5 parts by weight of acrylic acid were copolymerized by emulsion polymerization to obtain a solution containing an acrylic copolymer having a weight average molecular weight of 800,000.

[0052] With respect to 100 parts by weight of the polymer solution (solid content), 3 parts by weight of CORONATEL (manufactured by Nippon Polyurethane Co., Ltd.) as an isocyanate-based crosslinking agent and TETRAD-C (manufactured by Mitsubishi Gas Chemical Industry Co., Ltd.) as a glycidylamine-based crosslinking agent were blended. Co., Ltd.) 0.5 parts by weight, 1 part by weight of SUPER BECKAMINE J-82060N (manufactured by Nippon Polyurethane Co., Ltd....

Embodiment 2

[0056] (Preparation of Adhesive)

[0057] In addition to using 5 parts by weight of DESMODUR-L75 (manufactured by BAYER.A.G) as a crosslinking agent as an isocyanate crosslinking agent in Example 1, and TETRAD-C (manufactured by Mitsubishi Gas Chemical Co., Ltd.) as a glycidylamine crosslinking agent A binder solution was produced in the same manner as in Example 1, except for 0.5 parts by weight of Luwipal012 (manufactured by BASF Corporation) as a melamine-based crosslinking agent and 3 parts by weight of Luwipal012 (made by BASF Corporation).

[0058] (Production of Adhesive Tape)

[0059] An adhesive tape was produced in the same manner as in Example 1 except that the adhesive solution prepared above was used in Example 1.

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Abstract

An adhesive tape, which has an adhesive layer formed by an adhesive containing a matrix polymer and a crosslinking agent on one or both sides of a support, is characterized in that the support contains a plasticizer-containing soft Polyvinyl chloride, and at least one side of the adhesive contains an acrylic copolymer having a carboxyl group as a matrix polymer, and contains an isocyanate-based cross-linking agent, a glycidylamine-based cross-linking agent, and a melamine-based cross-linking agent as a cross-linking agent. joint agent. According to the present invention, it is possible to provide an adhesive tape using soft polyvinyl chloride containing a plasticizer as a support, which satisfies the contradictory properties of initial adhesiveness and stable adhesive force over time. , and there are no problems involving surface contamination.

Description

technical field [0001] The present invention relates to a pressure-sensitive adhesive tape. The adhesive tape of the present invention can be used for various purposes. The pressure-sensitive adhesive tape of the present invention has the characteristics of excellent initial adhesiveness and less increase in adhesive force over time, and can be used for the purpose of re-peeling. In addition, the present invention also relates to an adhesive (a pressure-sensitive adhesive agent) used in the above-mentioned adhesive tape. [0002] The adhesive tape of the present invention can be used as an adhesive tape used in a semiconductor wafer slicing step. The adhesive tape used in the above-mentioned dicing process can be used as an adhesive tape for dicing to fix the diced object such as a semiconductor wafer when cutting and separating (slicing) small pieces of components such as a semiconductor wafer, and can also be used as an adhesive tape for dicing. The adhesive tape for semi...

Claims

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Application Information

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IPC IPC(8): C08K5/00C09J7/22C09J7/38C09J133/02C09J133/10C09J133/12C09J161/28C09J163/00C09J175/04H01L21/301
CPCC08K5/0025C09J2203/326C09J2427/006C09J2433/00C09J7/38C09J7/385C09J7/22C08L33/08C09J7/245
Inventor 铃木俊隆安·伊萨里斯埃德温·蒂斯瓦尔特·埃韦尔斯山本昌司
Owner NITTO BELGIUM NV