Copper-in-tin electromagnetic screen textile and method for preparing same

A technology of electromagnetic shielding and textiles, applied in the field of electromagnetic shielding textiles and its preparation, can solve the problems of poor conductivity, difficulty in brazing, and inability to maintain textiles, etc., and achieve the effect of good conductivity and easy brazing

Active Publication Date: 2005-06-01
DONGHUA UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] At present, there have been researches on electroless copper plating and nickel plating textiles at home and abroad, but the specific application of electroless copper plating and nickel plating textiles has certain limitations. Maintain the original style of textiles, such as softness, breathability, and strong elongation

Method used

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  • Copper-in-tin electromagnetic screen textile and method for preparing same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0057] In this example, nylon 66 textile "RIPSTOP" is used as the base material, and the preparation steps are as follows:

[0058] The first step, pretreatment, desizing and refining with sodium hydroxide solution to clean the surface of the substrate fiber and remove the dirt on the fiber surface;

[0059] In the second step, sensitization and activation, the base fiber is immersed in an aqueous solution of palladium chloride with a weight concentration of 0.53g / l to form an extremely thin metal catalytic layer on the surface of the fiber, and then dried by a heat setting machine MONFORTS 328;

[0060] Working fluid formula: (total 1800L)

[0061] PdCl2 0.53g / l

[0062] HCl(35%) 10ml / l

[0063] SBR Latex 60g / l

[0064] Liquid retention rate 65%

[0065] 180℃, 9min

[0066] The third step is strengthening, soaking with 40% formaldehyde solution to strengthen the surface structure of the fiber;

[0067] The fourth step, electroless copper plating process

[0068] Plating ...

Embodiment 2

[0105] In this embodiment, polyester taffeta is used as the base material, and the preparation steps are as follows:

[0106] Other preparation steps remain unchanged, and the plating solution formula of the fourth step electroless copper plating process is changed as follows accordingly:

[0107] Copper sulfate CuSO4·5H2O 16g / L

[0108] Sodium Potassium Tartrate NaKC4H4O6 4H2O 15g / L

[0109] EDTA Tetrasodium Salt 25g / L

[0110] Alkaline agent such as NaOH 20g / L

[0111] Formaldehyde HCHO (concentration 37-40%) 20g / L

[0112] Tin chloride NiCl2 6H2O 1g / L

[0113] α,α'-bipyridine 20mg / L

[0114] Potassium cyanide 8mg / L

[0115] Penetrant JFC (isobutylphenol polyoxyethylene ether) 2g / L

[0116] pH value 12~13

[0117] The temperature is 47°C.

[0118] The plating solution of the above formula is prepared separately by two groups of A and B, mixed before use, and finally added with a stabilizer to adjust the pH value.

[0119] Group A includes copper sulfate and formald...

Embodiment 3

[0143] In this embodiment, polyester taffeta is used as the base material, and the preparation steps are as follows:

[0144] Other preparation steps remain unchanged, and the plating solution formula of the fourth step electroless copper plating process is changed as follows accordingly:

[0145] Copper sulfate CuSO4·5H2O 16g / L

[0146] Sodium Potassium Tartrate NaKC4H4O6 4H2O 15g / L

[0147] EDTA Tetrasodium Salt 25g / L

[0148] Alkaline agent such as NaOH 20g / L

[0149] Formaldehyde HCHO (concentration 37-40%) 20g / L

[0150] Tin chloride NiCl2 6H2O 1g / L

[0151] α,α'-bipyridine 20mg / L

[0152] Potassium cyanide KCN 8mg / L

[0153] Potassium thiocyanate (KSCN) 12mg / L

[0154] Penetrant JFC 2g / L

[0155] pH value 12~13

[0156] Temperature 47°C

[0157] The plating solution of the above formula is prepared separately by two groups of A and B, mixed before use, and finally added with a stabilizer to adjust the pH value.

[0158] Group A includes copper sulfate and form...

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Abstract

The present invention is one kind of copper-in-tin electromagnetic shielding fabric and its preparation process. Onto the surface of non-metal fabric base fiber, metal copper is first plated chemically and tin is then electroplated to form composite conducting copper-tin film to obtain electromagnetic shielding fabric. The base fiber may be nylon, Dacron or orlon. The electromagnetic shielding fabric has high conducting performance, is weldble, flexible and ventilative, and can isolates sulfur in insulating material.

Description

technical field [0001] The invention provides an electromagnetic shielding textile which is completely harmless to the human body by covering the fiber surface of the non-metallic fiber textile with a metal tin-copper composite conductive layer and enables the textile to produce a shielding effect and a preparation method thereof. Background technique [0002] With the rapid development and increasing popularity of telecommunications, computers, microwave ovens, etc., the energy density of electromagnetic radiation in the environment is increasing year by year. Electromagnetic environmental pollution has become the fourth largest pollution after air, water quality and noise, and it has attracted more and more attention. [0003] Electroless metal-plated textile is a good electromagnetic shielding material. It has both the conductive and electromagnetic shielding properties of metal and the soft and breathable properties of textiles. It is very suitable for making protective ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): D06M11/83H05K9/00
Inventor 王炜朱美芳孙宾李成新潘仁昌
Owner DONGHUA UNIV
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