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Photocuring resinoid compsn. and printed circuit board using same

A resin composition, photocurable technology, applied in printed circuits, secondary treatment of printed circuits, epoxy resin coatings, etc., can solve problems such as reduced thixotropy, increased affinity, and xylene content, and achieves a defective rate. reduced effect

Active Publication Date: 2005-08-31
TAIYO HLDG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, inorganic fillers and ultrafine silica have a problem that their affinity with organic solvents and resins increases over time and their thixotropy decreases.
In addition, organic bentonite has little change over time, but when used in a large amount, there is also a problem of lowering electrical insulation
In addition, waxes also have the problem of containing harmful organic solvents such as xylene

Method used

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  • Photocuring resinoid compsn. and printed circuit board using same

Examples

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Embodiment

[0058] The following examples and comparative examples are given to describe the present invention in detail, but the present invention is not limited to the following examples. The following "parts" mean "parts by mass" unless otherwise specified.

Synthetic example

[0060] 215 parts of cresol novolac type epoxy resin N-680 (manufactured by Dainippon Ink Chemical Industry Co., Ltd., epoxy equivalent=215) are packed into a four-necked flask with a stirrer and a reflux cooler, and propylene glycol monomethyl ether ethyl ether is added. 196 parts of acid ester, dissolved by heating. Then, 0.46 parts of methylhydroquinone as a polymerization inhibitor and 1.38 parts of triphenylphosphine as a reaction catalyst were added. This mixture was heated to 95-105 degreeC, and 72.0 parts (1.0 equivalent) of acrylic acid was dripped gradually, and it was made to react for about 32 hours, and the reaction product with an acid value of 0.9 mgKOH / g was obtained. The reaction product (hydroxyl group: 1 equivalent) was cooled to 80-90° C., 76.0 parts (0.5 equivalent) of tetrahydrophthalic anhydride was added, reacted for about 8 hours, and taken out after cooling. The carboxyl group-containing resin (A) prepared in this way had a non-volatile content of 65%...

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Abstract

To provide a photosetting / thermosetting resin composition for a printed wiring board which exhibits temporally stable coating properties in screen printing, curtain coating, spray coating, roll coating and in other methods and is superior in heat resistance, adhesion and electrical insulation, and to provide a printed wiring board which uses the same. The photosetting / thermosetting resin composition comprises (A) a carboxylic resin, having one or more carboxyl groups in one molecule, (B) a photopolymerization initiator, (C) a polyhydroxycarboxylic ester additive, (D) a diluent, (E) a filler and (F) an epoxy resin, wherein the polyhydroxycarboxylic ester additive (C) is preferably xylene-free.

Description

technical field [0001] The present invention relates to a photocurable / thermosetting resin composition useful for the manufacture of printed wiring boards, and more specifically, to a printed wiring having excellent coating properties over time and excellent heat resistance, adhesion, and electrical properties A photocurable / thermosetting resin composition for a board and a printed wiring board using the same. Background technique [0002] Due to the recent rapid progress of semiconductor components, there is a tendency for electronic equipment to be smaller, lighter, more functional, and more functional. In line with these trends, the density of printed circuit boards is constantly increasing. As the solder resist used for this printed wiring board, a liquid developing type solder resist is used which is subjected to pattern exposure and development with ultraviolet rays to form an image, and secondary curing (finishing cure, main curing) by heat and light irradiation. In ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/004C08G59/62C08K3/36C08K5/00C08L63/00C09D163/00C09D201/08G03F7/027H05K1/00H05K3/28H05K3/46
CPCH01Q1/24H04H2201/11H04N5/64
Inventor 植田千穗栗原弘司
Owner TAIYO HLDG CO LTD
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