Method for metallizing surface of nonmetallic material, and composing structure of surface

A technology of non-metallic materials and surface metals, applied in the direction of metal material coating process, superimposed layer plating, coating, etc., can solve problems such as uneconomic benefits, environmental pollution, thin coating thickness, etc.

Inactive Publication Date: 2005-11-16
吴东兴
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Problems solved by technology

[0003] There are two main processing methods for surface metallization of common non-metallic materials: one is to use vacuum sputtering to attach metal atoms to the plated object (non-metallic material) in a high vacuum environment On the surface, this processing method is non-polluting, meets environmental protection requirements, and has the characteristics of fine metal coating and uniform coating; but there are also disadvantages such as high resistance value of metal coating and thin coating thickness, which affect its conductivity and metallic luster.
It is a processing method of electroless plating, and its main processing flow is as follows figure 1 As shown, at the beginning, a step of "spraying conductive oil" 101 is used to spray conductive oil on the surface of non-metallic materials, after a step of "drying" 102 and a step of "washing" 103, and then a step of "copper plating" 104, to Electroless plating or electroplating is used to plate a layer of metal

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  • Method for metallizing surface of nonmetallic material, and composing structure of surface
  • Method for metallizing surface of nonmetallic material, and composing structure of surface

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[0010] Such as figure 1 As shown, it is a common electroless plating process, and its main disadvantages have been mentioned above, and will not be repeated here.

[0011] figure 2 It is the main processing flow chart of the present invention. It can be clearly seen from this figure that the present invention begins with a "vacuum sputtering" 201 step, using vacuum sputtering on a preset non-metallic material (such as: plastic) The surface is coated with a thin layer of basic metal coating to make the surface of the non-metallic material have proper conductivity. After a step of "washing" 202 to clean the surface, a step of "plating an inner metal layer" 203 is applied to the surface of the non-metallic material. The surface of the basic metal coating is plated with a layer of copper (a metal with better adsorption) by electroless plating or electroplating, and then, after a step of "water washing" 204, the surface is cleaned, and then a step of "coating the outer metal laye...

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Abstract

A process for alloying the surfaces of non-metal material for preventing electromagnetic interference includes vacuum sputtering to form a basic thin metal film on the surface of non-metal material and chemical or electric plating to form an internal emtal layer (Cu) and an external metal layer (Ni, Cr, etc).

Description

technical field [0001] The present invention relates to a method for metallizing the surface of non-metallic materials and its surface composition structure, in particular to a processing method with low pollution, low cost, thick metal surface, uniform wear resistance, good conductivity and good oxidation resistance. method and composition. Background technique [0002] Press, due to the development of science and technology, the precision and sensitivity of various electronic components are constantly improving, so there are extremely strict requirements for the prevention and treatment of electromagnetic interference (EMI), in order to avoid malfunction and damage of electronic components, and in electromagnetic interference (EMI) In the prevention and control of EMI, metal magnetic shield isolation (isolation of electromagnetic waves by metal plates) is a traditional simple and effective application method; however, under the trend of multi-functional, small and exquisit...

Claims

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Application Information

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IPC IPC(8): C23C28/02
Inventor 吴东兴
Owner 吴东兴
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