Method for metallizing surface of nonmetallic material, and composing structure of surface

Abstract

A process for alloying the surfaces of non-metal material for preventing electromagnetic interference includes vacuum sputtering to form a basic thin metal film on the surface of non-metal material and chemical or electric plating to form an internal emtal layer (Cu) and an external metal layer (Ni, Cr, etc).

Description

technical field [0001] The present invention relates to a method for metallizing the surface of non-metallic materials and its surface composition structure, in particular to a processing method with low pollution, low cost, thick metal surface, uniform wear resistance, good conductivity and good oxidation resistance. method and composition. Background technique [0002] Press, due to the development of science and technology, the precision and sensitivity of various electronic components are constantly improving, so there are extremely strict requirements for the prevention and treatment of electromagnetic interference (EMI), in order to avoid malfunction and damage of electronic components, and in electromagnetic interference (EMI) In the prevention and control of EMI, metal magnetic shield isolation (isolation of electromagnetic waves by metal plates) is a traditional simple and effective application method; however, under the trend of multi-functional, small and exquisit...

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Problems solved by technology

[0003] There are two main processing methods for surface metallization of common non-metallic materials: one is to use vacuum sputtering to attach metal atoms to the plated object (non-metallic material) in a high vacuum environment On the surface, this processing method is non-polluting, meets environmental protection requirements, and has the characteristics of fine metal coating and uniform coating; but there are also disadvantages such as high resistance value of metal coating and thin coating thickness, which affect its conductivity and metallic luster.

It is a processing method of electroless plating, and its main processing flow is as follows figure 1 As shown, at the beginning, a step of "spraying conductive oil" 101 is used to spray conductive oil on the surface of non-metallic materials, after a step of "drying" 102 and a step of "washing" 103, and then a step of "copper plating" 104, to Electroless plating or electroplating is used to plate a layer of metal with better adsorption properties (such as copper) on the surface, and then after a "washing" 105 steps, then "nickel plating" 106 steps are applied to the outer surface by electroless plating or electroplating. Then plate a layer of harder metal (such as: nickel), after a "washing" 107 step, use a "chromic acid passivation" 108 step, use high chromic acid to roughen the surface, and then "wash" 109, " After drying” 110 steps, the processing flow is ended; the above-mentioned processing method is to immerse the object to be plated (non-metallic material) in the solution, and use self-catalyzed electroplating to deposit metal on the surface of the object to be plated, which has a metal coating resistance value However, the use of high chromic acid and conductive oil in the processing process is not only costly, but also causes great pollution to the environment, and the subsequent electroless plating or electroplating takes a long time, which is not economical. benefit

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