Welding agent for braze, braze method and printing substrate

A flux and brazing technology, used in brazing methods, printed circuit boards, and flux fields, can solve the problems of short circuit, reduction of solder joint strength, insulation resistance, reliability damage of brazing and printed circuit boards, etc. Greatly reduce and improve the effect of stability

Active Publication Date: 2006-02-22
HARIMA CHEM INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] However, when the flux containing a predetermined amount of metal salt as described above is stored for a long period of time, problems such as a significant decrease in the joint strength of the solder and the insulation resistance of the soldered area occur compared with the flux immediately after production.
If the insulation resistance of the soldering area is reduced, for example, a short circuit is likely to occur in the soldering area, which will damage the reliability of soldering and printed circuit boards

Method used

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Examples

Experimental program
Comparison scheme
Effect test

experiment example 1～8 and comparative example 1～7

[0046] [Choice of Copper Salt and Active Agent]

[0047] As the metal salt, the following are selected.

[0048] A:(C 17 h 35 COO) 2 Cu

[0049] B:(C 7 h 15 COO) 2 Cu

[0050] C:(C 21 h 43 COO) 2 Cu

[0051] D:(C 17 h 35 COO) 2 Pb

[0052] As the active agent, the following substances were selected.

[0053] E: C 7 h 15 COOH

[0054] F: C 17 h 35 COOH

[0055] G: C 21 h 43 COOH

[0056] H:(CH 3 ) 2 CHNH 2 ·HCl

[0057] Here, the order of acidity is H>E>F>G.

[0058] [Preparation of Rosin Flux]

[0059] WW grade Toichiru rosin 70 parts by weight

[0060] 25 parts by weight of hexyl carbitol

[0061] 5 parts by weight of hydrogenated castor oil

[0062] Mix the materials according to the above formula, heat to 120°C to melt, cool to room temperature, and prepare viscous flux.

[0063] [Preparation of acrylic flux] 50 parts by weight of acrylic resin (Pararoid B-48N manufactured by Rom And Haus Co., Ltd.)

[0064] 45 parts by weight of hexyl car...

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PUM

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Abstract

The present invention provides a flux which contains a resin having film forming ability, an activator and a solvent and is used when soldering is performed on the printed board to which electroless nickel plating is applied. The flux contains organic acid metallic salt of 0.1-20 wt.% to the total amount of the flux and, the activator is the same organic acid as an organic acid which comprises the organic acid metallic salt or an organic acid which is lower than it in acidity. Thus, the stability of the organic acid metallic salt is increased and high joining strength is maintained for a long term.

Description

technical field [0001] The present invention relates to a soldering flux used when soldering various electronic components to a printed circuit board, in particular to a flux, a soldering method and a printing process used for soldering on a copper pad of a printed circuit board subjected to electroless nickel plating. substrate. Background technique [0002] Conventionally, when soldering an electronic component to a printed circuit board, tin-lead alloy solder or lead-free solder is used for soldering on copper lands formed on the printed circuit board. In order to prevent oxidation of copper, electroless nickel plating is often performed on the surface of the above-mentioned pad. [0003] However, since hypophosphite is used as a reducing agent when electroless nickel plating is performed on the above-mentioned pads, a trace amount of phosphide remains in the nickel plating layer. [0004] Therefore, when a solder alloy is used for brazing on an electroless nickel-plate...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/36B23K1/00H05K3/34
CPCB23K35/0244B23K35/24B23K35/36B23K2101/42
Inventor 池田一辉入江久夫岛俊典穴田隆昭石川俊辅
Owner HARIMA CHEM INC
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