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Thermally conductive adhesive composition and process for device attachment

An adhesive and composition technology, which is used in the field of materials in device production and adhesives for semiconductor chip connection, can solve the problems of devices whose thermal conductivity is not suitable for dissipating a large amount of heat, temperature rise, poor mechanical properties, etc.

Inactive Publication Date: 2006-05-03
AGUILA TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the thermal conductivity of this prior art adhesive is not suitable for devices that dissipate large amounts of heat
Additionally, prior art adhesives often have poor mechanical properties
Another disadvantage is that some prior art adhesives contain solvents to keep the viscosity low
Another difficulty is that the solder will remelt if it is heated to raise the temperature, and the electronic manufacturing process (such as the process of assembling components into the printed circuit board) needs to be heated
This re-melting of the solder between components within the circuit can cause parts to separate and subsequently fail

Method used

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Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0089] Preparation of the adhesive composition

[0090] In the preparation of the thermally conductive adhesive composition, the low and high melting point metal powders are first mixed to ensure a homogeneous mixture. For the preferred metal powders, mixing is performed in air at room temperature. Powder mixing in an inert gas such as nitrogen has the potential to reduce oxidation. Suitable methods of powder mixing, such as shell blending, are known to those skilled in the art.

[0091] To this powder mixture is added a thermally curable adhesive flux composition. High shear mixing is required to ensure uniformity in the resulting paste. A method of high shear mixing known in the art is double planetary mixing. Preferably, the concentration of metal powder in the final adhesive is about 80-93% by weight of the total adhesive composition, but more preferably 85-92% by weight. The remainder of the adhesive composition consists of the thermally curable adhesive flux composi...

Embodiment 1

[0101] Example 1: Die attach composition of the present invention

[0102] component

weight

weight%

Mono-2-(methacryloyloxy)ethyl succinate

0.65g

1.69％

Hexahydrophthalic anhydride

0.85g

2.21％

Bisphenol A diglycidyl ether

1.5g

3.90％

1,6-Hexylene Diacrylate Diacrylate

0.26g

0.68％

Azobiscyclohexanenitrile

0.0011g

0.003％

silver flakes

8.1g

21.06％

copper powder

9.5g

24.70％

58Bi42Sn solder powder

17.6g

45.76％

[0103] Hexahydrophthalic anhydride is dissolved in bisphenol A diglycidyl ether by raising the temperature of the mixture of hexahydrophthalic anhydride and bisphenol A diglycidyl ether to 40-50°C. After stirring to form a homogeneous mixture, the mixture was cooled to room temperature. Then mono-2-(methacryloyloxy)ethyl succinate, 1,6-hexamethylene diacrylate, and azobiscyclohexanenitrile were added ...

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Abstract

The present invention provides a thermally conductive, sinterable, non-volatile solvent-free adhesive composition comprising a powder of a metal or metal alloy with a relatively high melting point, a powder of a metal or metal alloy with a relatively low melting point, and a A thermally curable adhesive flux composition comprising (i) a polymerizable flux; (ii) an inert agent that reacts with the flux to render it inert after elevated temperature agent. The fluxing agent preferably comprises a compound of formula RCOOH, wherein R comprises a moiety having one or more polymerizable carbon-carbon double bonds. Optionally, the composition of the present invention further comprises (a) a diluent capable of polymerizing with the polymerizable carbon-carbon double bonds of the flux; (b) a free radical initiator; (c) a curable resin; and ( d) Cross-linking agents and accelerators. The composition can be applied directly on the surface of a device to be connected mechanically and / or electrically, and is ideally suited for the connection of semiconductor chips. During heating, the flux facilitates the wetting of the high melting point powder by the molten low melting point powder, thereby causing liquid phase sintering of the powder. The flux also facilitates the wetting of the metal plating on the chip and substrate by the molten eutectic alloy, thereby improving thermal conductivity. At the same time, the flux itself cross-links to further bond mechanically to the bonding surface. The absence of volatile solvents produces a non-porous bond.

Description

technical field [0001] The present invention relates to the use of conductive adhesives in the production of electronic components. More particularly, the present invention relates to materials, methods and assemblies in the production of devices containing electronics that require cooling with heat dissipation. The present invention also relates to adhesives for semiconductor chip attachment that improve heat dissipation. Background technique [0002] For a thermally conductive adhesive composition to be used in the production of semiconductor devices, it must meet certain performance, reliability, and production specifications dictated by a particular application. Such performance properties include adhesive strength, coefficient of thermal expansion, flexibility, temperature stability, moisture resistance, electrical and thermal conductivity, and more. Thermal conductivity is particularly important in the electronics industry. With the trend toward miniaturization and ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08K3/08C09J4/00C09J4/02C09J163/00C09J163/02H01L23/373H05K1/02H05K3/30H05K3/32
CPCC08F220/26C08K3/08C08K5/0025C08L63/00C09J4/00C09J9/00C09J11/04C08F222/102H01L23/3737H01L2924/0002H05K1/0203H05K3/305H05K3/321H05K2201/0215H05K2201/0272H05K2203/0425Y02P70/50C08F220/10H01L2924/00C09J5/06C09J133/06C09J143/00
Inventor 米格尔·艾伯特·卡波特艾伦·格里夫
Owner AGUILA TECH