Organic blending additive in use for producing ultrathin two-faced bright electrolytic copper foil

A technology of mixing additives and photoelectrolysis, applied in the electrolysis process, electroforming, etc., can solve the problems of rough surface roughness, etc., achieve low production cost, good technical effect, and reduce production cost

Inactive Publication Date: 2007-05-09
SUXI CHINA COPPER FOILS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Solve the technical problem of the large surface roughness of the rough surface of the existing electrolytic copper foil

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0009] Each unit of organic mixed additives is made of the following raw materials: 10 g / L polyethylene glycol, 750 mg / L sodium polydithiodipropane sulfonate, 200 mg / L thiourea, methyl thio Sodium carbamoyl propane sulfonate 50 mg / L.

[0010] Examples of how this organic blend additive can be used are:

[0011] Take the electrolyte solution with a copper content of 85g / l and an acid content of 105g / l and add it to the electrolysis equipment. The flow rate of the electrolyte solution per hour of each electrolysis equipment is 30-60 cubic meters. The dosage is the same, add organic mixed additives to the electrolyte at 400ml / unit before electrolysis, conduct electrolysis at 50-55°C, add organic mixed additives to the electrolyte at 150-250ml / min during electrolysis. The matte surface of the electrolytic copper foil prepared in this example is mirror-like, the crystal grains are layered, and the thickness of the copper foil is not more than 8 μm. After testing, the surface roug...

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Abstract

This invention discloses an organic composite additive for manufacturing ultra-thin double-side-smooth electrodeposited copper foil. The organic composite additive is composed of (per unit): poly(ethylene glycol) 5-20 g / L, sodium polydithio-dipropyl sulfonate 500-1000 mg / L, thiourea 100-500 mg / L, and sodium 3-[[(dimethylamino)thioxomethyl]thio]propanesulfonate 30-70 mg / L. The electrodeposited copper foil manufactured by using the organic composite additive has surface roughness less than 0.25 mums. The individual grain of the electrodeposited copper foil is lamellar crystal, and the surface is mirror-like. The electrodeposited copper foil has high tensile strength and high elongation percentage, and can be used as a substitute for calendered copper foil for application in soft printed circuit board and polymeric Li-ion battery. The method for manufacturing the electrodeposited copper foil is simple and low cost compared with that for manufacturing calendered copper foil. Besides, the costs for manufacturing soft printed circuit board and polymeric Li-ion battery can be largely reduced.

Description

technical field [0001] The invention relates to an additive for producing electrolytic copper foil, in particular to an additive for producing ultra-thin double-sided photoelectrolytic copper foil. Background technique [0002] At present, copper foil products are divided into two types, rolled copper foil and electrolytic copper foil. Both sides of the rolled copper foil are smooth, and it is mainly used for conductive materials of printed circuit flexible boards and polymer lithium-ion batteries. However, since the investment and production cost of producing rolled copper foil are higher than that of electrolytic copper foil, and the limitation of production equipment for rolled copper foil directly affects its product length and width, the unit price of rolled copper foil on the market is at least that of electrolytic copper foil. Three or four times more than the foil. Therefore, the production cost of the printed circuit soft board and the polymer lithium ion battery ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D1/04C25D3/38
Inventor 付强石晨唐斌
Owner SUXI CHINA COPPER FOILS
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