Self adaptive lead-free solder component and preparation method thereof

A lead-free solder, self-adaptive technology, used in welding equipment, welding/cutting media/materials, welding media, etc., can solve the problems of poor wettability, increased cost, and small effect, and achieve the effect of tight bonding

Inactive Publication Date: 2007-05-16
TIANJIN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to the poor wettability between the nickel-titanium shape memory alloy particles and the solder and the substrate, it is very difficult to successfully compound the nickel-titanium s

Method used

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  • Self adaptive lead-free solder component and preparation method thereof
  • Self adaptive lead-free solder component and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0015] The tin, silver and zinc with a purity of 99.99% are heated to 1200°C in a vacuum melting furnace under the protection of argon in a mass ratio of 95.4:3.7:0.9, and are magnetically stirred at the same time to make the alloy composition uniform, and then water-cooled and solidified . Then turn the alloy over and reheat to 1200°C to melt, while magnetic stirring and water cooling. This is repeated at least five times to obtain a button-shaped tin-silver-zinc lead-free solder with a diameter of about 3.0-3.5cm; put the tin-silver-zinc lead-free solder into a crucible under vacuum protection and heat it to 230°C, and quickly pass it through Water quenching can generate silver-zinc thermoelastic martensite in the solder, so that it has a two-way shape memory effect between 20°C and 100°C, and a tin-silver-zinc self-adaptive lead-free solder with shape memory performance is obtained. The micrometallography of the self-adaptive lead-free solder obtained after preparation is ...

Embodiment 2

[0017] Heat tin, silver, zinc and indium with a purity of 99.99% in a mass ratio of 94.9:3.7:0.9:0.5 in a vacuum melting furnace under the protection of argon to 1300°C for melting, and at the same time add magnetic stirring to make the alloy composition uniform , and then freezes. Then turn the alloy over and reheat to 1300°C to melt, while magnetic stirring and water cooling. This is repeated at least five times to obtain a button-shaped tin-silver-zinc lead-free solder with a diameter of about 3.0-3.5cm; put the tin-silver-zinc lead-free solder into a crucible under vacuum protection and heat it to 250°C, and quickly pass it through Water quenching can generate silver-zinc thermoelastic martensite in the solder, so that it has a two-way shape memory effect between 30°C and 110°C, and a tin-silver-zinc self-adaptive lead-free solder with shape memory performance is obtained. The micrometallography of the self-adaptive lead-free solder obtained after preparation is shown in ...

Embodiment 3

[0019] The tin, silver and zinc with a purity of 99.99% are heated to 1350°C in a vacuum melting furnace under the protection of argon in a mass ratio of 96.1:3.4:0.5, and magnetically stirred at the same time to make the alloy composition uniform, and then water-cooled and solidified . Then turn the alloy over and reheat to 1350°C to melt, while magnetic stirring and water cooling. This is repeated at least five times to obtain a button-shaped tin-silver-zinc lead-free solder with a diameter of about 3.0-3.5cm; put the tin-silver-zinc lead-free solder into a crucible under vacuum protection and heat it to 255°C, and quickly pass it through Water quenching can generate silver-zinc thermoelastic martensite in the solder, so that it has a two-way shape memory effect between 35°C and 115°C, and a tin-silver-zinc self-adaptive lead-free solder with shape memory performance is obtained. The micrometallography of the self-adaptive lead-free solder obtained after preparation is show...

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Abstract

The invention relates to a tin-silver-zinc self-adapt leadless solder with shape memory function and relative preparation, wherein in the tin-silver-zinc leadless solder whose purity is 99.99% and mass percentages are 96.5-93: 3.0-4.5: 0.5-2.5, there is silver-zinc metal phase with shape memory function; then it adds 0-2.5 gallium and 0-4 indium to improve humidity. The invention uses the silver-zinc thermoelasticity martensite of solder to obtain shape memory function. And it has compact combination and uniform distribution, compared with nickel-titanium alloy leadless solder.

Description

technical field [0001] The invention relates to a tin-silver-zinc self-adaptive lead-free solder composition and a preparation method with shape memory performance, belonging to the lead-free solder technology. Background technique [0002] Emphasizing environmental protection and advocating green products are the general trend of world economic development. The use of traditional lead-tin solder has a history of about two thousand years, and it is widely used in the modern electronic assembly industry. However, due to the damage of lead to the human nervous system and the harm to human health that cannot be ignored, the problem of lead pollution has been paid more and more attention by people, so that there is a high demand for lead-free electronic products in the world. Waste of Electrical and Electronic Equipment (WEEE), led by the European Union, called for an end to the use of lead-containing materials in the electronics assembly industry in 2006. The National Electro...

Claims

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Application Information

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IPC IPC(8): B23K35/26C22C1/02C22F1/00
Inventor 韦晨刘永长
Owner TIANJIN UNIV
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