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Semiconductor device

一种半导体、天线的技术，应用在半导体器件、半导体/固态器件零部件、电固体器件等方向，能够解决产率降低、增加布线连接工序等问题，达到提高产率、防止劣化的效果

Inactive Publication Date: 2007-05-30
SEMICON ENERGY LAB CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0013] In the prior art, it is necessary to store identification information in the ROM in the wireless chip to identify each wireless chip. Therefore, the wiring connection process is increased, resulting in a decrease in yield
In addition, in the wiring connection process, when the antenna is pressure-bonded to the chip, the chip, especially the logic circuit part, may be damaged.

Method used

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Examples

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Embodiment approach 1

[0052] In this embodiment mode, the configuration of a wireless chip having an organic memory will be described. In addition, although the present embodiment only describes the configuration of a wireless chip, wireless communication can be performed by providing antennas on it according to the communication frequency.

[0053] 1A shows a wireless chip 100, in which a storage area 101, a high-frequency circuit unit including an external signal input unit 102 and an RF input unit 103, and a logic circuit unit 104 are provided, and pads 106 are provided on the outside.

[0054] The storage area 101 is an area in which information is written, and is provided with ROM or RAM. In this embodiment, the unique information of the wireless chip is written in the ROM. The ROM cannot be rewritten, that is, the so-called write-once type. Therefore, information that does not need to be rewritten or information that should not be rewritten such as inherent information of the wireless chip ...

Embodiment approach 2

[0063] In this embodiment, a form of a wireless chip including an antenna will be described.

[0064] FIG. 2A shows a method in which an antenna 110 having a coil shape is connected to the wireless chip 100 via pads 106 corresponding to the data transfer method of the electromagnetic induction method. The advantage of the electromagnetic induction method is that the directivity of the antenna is wide and the communication range is large. As the frequency band, a long-wave band such as 135 kHz and a short-wave band such as 13.56 MHz are used. The communication distance is several centimeters to tens of centimeters. The distance between pad 106 and memory region 101 is 500 μm or more, preferably 750 μm or more, expressed in a range of 500 μm to 1 mm inclusive.

[0065] By employing such a structure, it is possible to prevent damage or deformation of the wireless chip, particularly, the memory region when the antenna is bonded under pressure.

[0066] FIG. 2B shows how the dip...

Embodiment approach 3

[0071] In this embodiment, an example of a mask layout of a wireless chip will be described.

[0072] FIG. 11A shows an example of a mask layout of a wireless chip, and FIG. 11B shows a block diagram thereof.

[0073] In the wireless chip, a logic circuit unit 402 occupying the largest area, an RF input unit 401 , and a storage area 404 next to it are provided. An adjustment circuit section 405 and a resistor 407 are provided in a partial area in the storage area 404 , and the adjustment circuit section 405 is provided beside the resistor 407 . The external signal input unit 403 is provided beside the RF input unit 401 . Since the external signal input unit 403 has pads, it is preferably provided in a region in contact with one side of the wireless chip 100 . This is because it is possible to bond with one side of the wireless chip as a reference when connecting the pads.

[0074] At this time, the distance between the pad and the storage region is 500 μm or more, preferabl...

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PUM

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Abstract

An object is to reduce troubles during pressure bonding of an antenna in a wireless chip including a thin film. A wireless chip made from a thin film is formed, in particular a wireless chip including a memory area including an organic compound layer, and a distance between the memory area and a pad is a prescribed value or longer. As a result, data writing can be carried out without being affected by stress or heat during pressure bonding of the antenna. For a substrate over which the wireless chip is provided, a glass substrate or a silicon wafer can be used.

Description

technical field [0001] The present invention relates to a semiconductor device that inputs or outputs information through wireless communication, and in particular, relates to its circuit configuration and wiring connection structure. Background technique [0002] A semiconductor device having a wireless communication function is called an ID tag, an IC tag, an IC chip, an RF (radio frequency) tag, a wireless tag, or an electronic tag according to its use. Among semiconductor devices for such applications, a semiconductor device in which a communication circuit or a memory is formed of a semiconductor integrated circuit is also called a wireless chip. [0003] The structure of the wireless chip includes an interface, a memory, a control unit, and the like. As the memory, a random access memory capable of writing and reading (hereinafter also referred to as RAM) and a read-only read only memory (hereinafter also referred to as ROM) are used, and are used according to purpose...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L27/02H01L23/485H01L23/522G06K19/077
CPCH01L2924/0002H01Q1/38H01Q1/2283H01Q23/00
Inventor 斋藤利彦加藤清佐藤岳尚
Owner SEMICON ENERGY LAB CO LTD
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