The invention discloses a double-
chip packaging
structure based on a double-sided
chip-on-film, and belongs to the field of
semiconductor packaging, the double-
chip packaging
structure based on the double-sided chip-on-film comprises a chip-on-film (Tape), double chips, a
copper through hole, a circuit layer, a
solder mask layer and a glue sealing area, the chip-on-film is of a multi-layer
composite structure and comprises a base material, a conductive layer, an insulating layer and an interlayer
adhesive, the base material is a
thermoplastic PI material; a through hole is formed in the base material, and the manufacturing process of the through hole comprises the steps of forming the through hole through
laser processing, coarsening the wall surface of the through hole through
plasma etching, forming a
copper wall on the wall surface of the through hole through a
chemical plating process, and filling
copper through a plating process to form the copper through hole; the double chips are inversely packaged on the
chip on film through a
wafer bump; through the double-sided
circuit design, the circuit
layout space is doubled, the problem of dense circuits of multi-IC packaging is solved, the manufacturing difficulty and the
short circuit risk are reduced, and meanwhile the production cost is reduced.