Adhesive compositions for bonding and filling large assemblies

a technology of polymerizable vinyl adhesive and composition, which is applied in the direction of ester polymer adhesive, organic non-macromolecular adhesive, adhesives, etc., can solve the problems of introducing unwanted negative factors or compromises in the application or performance characteristics of the composition, and affecting the adhesion effect. , to achieve the effect of reducing the tendency to gas or boil, and better control of exothermic curing and dimensional changes

a technology of polymerizable vinyl adhesive and composition, which is applied in the direction of ester polymer adhesive, organic non-macromolecular adhesive, adhesives, etc., can solve the problems of introducing unwanted negative factors or compromises in the application or performance characteristics of the composition, and affecting the adhesion effect. , to achieve the effect of reducing the tendency to gas or boil, and better control of exothermic curing and dimensional changes

US20050014901A1Inactive Publication Date: 2005-01-20IPS STRUCTURAL ADHESIVES
39 Cites 45 Cited by

Examples

Experimental program
Comparison scheme
Effect test

examples

Materials and Components Utilized in Examples

Trade name orDescriptionSourceDesignationor Functionor SupplierNeoprenePolychloroprene elastomerDuPont Dow ElastomersNipol ®Nitrile elastomerZeon ChemicalsMMAMethyl methacrylate monomerLucitePARALOID ®MBS impact modifierRohm & Haas Co.BTA 753MAAMethacrylic acid monomerLuciteDMPTN,N-Dimethyl-p-toluidineFirst ChemicalHETHydroxyethyl toluidineBayer AG55% BPO PasteBenzoyl peroxide (55%) inElf Atochemproprietary plasticizer mixtureAkzo NobelDerakane ®Vinyl ester (VE) resinDow ChemicalVamac ®Ethylene acrylic elastomerduPontLMALauryl methacrylate monomerSartomerTyrin ®Chlorinated polyethyleneDuPont Dow ElastomersHycar ®Reactive liquid BD / AN polymerNoveon, Inc.Kraton ®Styrene / butadiene blockKraton PolymerscopolymerHyTemp ®Polyacrylate elastomerZeon ChemicalsHypalon ®Chlorosulfonated polyethyleneDuPont Dow ElastomersNOVA NAS-30Styrene acrylic copolymerNOVA ChemicalsChemigum ®Crosslinked nitrile rubberEliochemHycar ®Liquid nitrile polymerNoveonR...

examples 1-2

Examples 1 and 2 are comparative examples for inventive examples 3-7 and 8-12, respectively. They illustrate that when the respective inventive examples are formulated without the addition of a vinyl ester resin, they undergo significant gassing and boiling, even though they effectively bond open molded FRP composite in normally thin bonded (0.125 inch) cross sections.

TABLE 1EXAMPLE12MMA Monomer68.6065.60Neoprene AD-1020.00—Nipol DN 4555—10.00BTA 753—18.00Lauryl5.005.00MethacrylateHET0.400.40Methacrylic Acid1.001.00Dibutyl Phthalate2.00—Dow Derakane——Vinyl Ester ResinFumed Silica3.003.0055% BPO Paste1.801.80RESULTSPeak Exotherm39-Gram MassTime to peak, min.30.344.4Temperature, ° F.288275Thick Cast BeadCure Observations8 in × 2 in × 1.5 inQualitative Cure Rank(1 = Best, 4 = Worst)Surface BoilExcessiveYesSurface Boil Rank43Hardness, Shore Dnot tested30-35 (porous)Center of Beadn.t.50-55 (porous)Lap ShearStrength, PSIOpen Molded FRPn.t.569Failure Moden.t.100% FT

examples 3-7

Examples 3-7 illustrate the effectiveness of a preferred vinyl ester resin in improving the curing performance of methacrylate formulations containing a range of elastomeric polymers. Unlike the Comparative Example 1, the inventive compositions do not boil or gas to cause expansion and undesirable voids in the thick cast bead that simulates a thick bonded cross section.

TABLE 2EXAMPLE34567MMA Monomer58.6058.6058.6058.6058.60Nipol DN 455520.00————Vamac D—20.00———Kraton D 1102——20.00——Neoprene AD-10———20.00—Tyrin 3615P————12.00BTA 753————8.00Lauryl5.005.005.005.005.00MethacrylateHET0.400.400.400.400.40MAA1.001.001.001.001.00DBP2.002.002.002.002.00Dow Derakane10.0010.0010.0010.0010.00VE Resin 411-350Fumed Silica3.003.003.003.003.0055% BPO Paste1.801.801.801.801.80RESULTSPeak Exotherm39 Gram MassMin. to peak62.59.524.223.524.8Temperature, ° F.253303319317304Thick Cast BeadCure Observations8 in × 2 in × 1.5 inQualitative Cure Rank(1 = Best, 4 = Worst)Surface BoilNoneNoneNoneNoneNoneSur...

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Abstract

Adhesive composition for bonding and filling large assemblies, including a mixture of about 5 percent to about 75 percent by weight of a thermoplastic polymer, about 0.5 percent to about 35 percent by weight of a polyester resin or vinyl ester resin, and about 20 percent to about 80 percent by weight of an alkyl acrylate or methacrylate monomer.

Description

BACKGROUND OF INVENTION 1. Field of Invention This invention relates to polymerizable vinyl adhesive or filling compositions that are useful for a variety of adhesive, coating, filling, repair and related applications. More particularly, this invention relates to two-part room-temperature curing polymerizable vinyl adhesive compositions comprising mixtures of free-radical polymerizable monomers and additives that generate heat and undergo expansion and contraction during the polymerization process. The improved compositions comprise mixtures of elastomers, thermoplastic resins, acrylate, methacrylate and styrenic monomers, and polyester or vinyl ester resins that can be applied in large masses or thick cross sections without gassing and void formation from the exothermic cure reaction. It also relates to improvements in the ability of adhesives based on the compositions to bond thermoplastic and thermoset materials, and to bond such materials with a reduced tendency to cause “read...

Claims

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Application Information

Patent Timeline
20 Jan 2005
Publication
US20050014901A1
IPC
C08F263/00; C08F283/01; C08F291/00; C08L51/00; C08L55/02; C08L101/00; C09J4/06; C09J167/06
CPC
C08F263/00; C08F279/02; C09J167/06; C09J133/08; C08F283/01; C08F291/00; C08L23/0869; C08L23/286
Inventors
OSAE, SAMUEL B.; BRIGGS, PAUL C.