Replacing chamber components in a vacuum environment

Abstract

An apparatus and method are provided for replacing parts in a vacuum chamber without venting the vacuum. A transfer system is used to transfer a removably mounted component from a processing module that is attached to a transfer system and replacing the component with another component from a maintenance system that is connected through an isolation assembly to a transfer module. The maintenance system may include a supply of replacement parts and receive expended or otherwise serviceable items that are to be replaced. These serviceable items may include chamber component that has a tendency to degrade during processes being performed in the processing module. Typically, such items are etched or eroded away or accumulate coatings, requiring occasional removal and replacement. Focus rings, chamber shields, dark space shields, insulators, deposition baffles and adaptors are some of the items requiring periodic replacement. Such items are installed in the process module in a way that permits their removal and replacement by a transfer arm or other transfer mechanism of the transfer system or otherwise by robotic mechanisms. The processing module may be an etching, deposition, ALD, patterning, developing, metrology, thermal processing, cleaning or other module used in a vacuum process, particularly for processing of semiconductor wafers.

Description

FIELD OF THE INVENTION [0001] The invention relates to a system and method for replacing chamber components, and more particularly to a system and method for replacing chamber components in a vacuum environment. BACKGROUND OF THE INVENTION [0002] It is common in the routine maintenance of a vacuum chamber to require venting of a vacuum chamber in order to replace parts, which have been consumed or damaged in the normal operation of the chamber. Venting of these chambers typically has a negative effect on the operation of the vacuum chamber and causes the owners time and money to return the system to a normal state. If other methods could be used to perform these activities it would be advantageous to system owners. [0003] One solution to this problem was addressed to a degree by Hurwitt in U.S. Pat. No. 5,620,578, owned by applicant's assignee. Hurwitt proposes replacing a fixture or such other device that accumulates an undesired coating in a deposition module of a cluster tool by ...

AI Technical Summary

Benefits of technology

[0007] In accordance with the invention, the transfer system of the processing system is used to transfer parts or components of the processing system to and from the processing module for service or replacement. The parts are moved without excessive motions or special actions being performed by the transfer arm and without the kind of manipulation of mounting structure and fastening elements that can cause particle generation that can contaminate the chamber. Rather, the parts to be replaced are configured to be picked up by the normal motions of a transfer arm that are used in the handling of wafers to be processed, and actuators necessary to release and present the parts in a condition to be picked up by the transfer arm are provided in the process module. In many embodiments, a generic transfer module and transfer mechanism, such as a standard fork type end effector, can be used. In other embodiments, a modified end effector can be used, or a transfer arm or transfer module with minimal modification. In alternative embodiments, a separate transfer arm may be used for maintenance items that require a different end effector than is on the wafer transfer arm or the transfer arm that is configured to transfer wafers and other maintenance items. In addition, more than one transfer arm can be used to increase throughput.

[0008] In one described embodiment of the invention, a lift pin system is provided to raise an upwardly facing focus ring or peripheral deposition shield from around the perimeter of a wafer on a wafer support in an etching module or a deposition module. In another embodiment, actuators lower and release a deposition shield in a deposition module from the sputtering cathode assembly. In both cases, the part is moved into a position where it can be engaged at a peripheral edge configured for pick up by a wafer transfer arm. The part release features are provided without requiring mechanical or structural modification of the tool beyond the modules that are being provided.

Problems solved by technology

Venting of these chambers typically has a negative effect on the operation of the vacuum chamber and causes the owners time and money to return the system to a normal state.

Manipulating parts with a transfer arm to lock and unlock them can produce unacceptable contamination.

Further, modification of the wafer handling components of a processing tool, such as a transfer arm mechanism or wafer handler, cannot as a practical matter be required of the owner of the tool to accommodate the service of a module that is but one of many of which the tool owner may purchase.

This limits the actions that a transfer arm can execute when removing and reattaching a part.

Images