Systems and methods for forming metal oxides using metal organo-amines and metal organo-oxides

a technology of metal organoamines and metal oxides, which is applied in the direction of coatings, transistors, chemical vapor deposition coatings, etc., can solve the problems of forming an undesirable siosub>2 /sub>interfacial layer, the traditional use of integrated circuit technology is approaching its performance limits, and the layer no longer effectively functions as an insulator
US20050287819A1Inactive Publication Date: 2005-12-29MICRON TECH INC

Patent Information

Authority / Receiving Office
US · United States
Patent Type
Applications(United States)
Current Assignee / Owner
MICRON TECH INC
Publication Date
2005-12-29
Estimated Expiration
Not applicable · inactive patent

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Abstract

A method of forming (and an apparatus for forming) a metal oxide layer on a substrate, particularly a semiconductor substrate or substrate assembly, using a vapor deposit ion process and one or more precursor compounds that include organo-amine ligands and one or more precursor compounds that include organo-oxide ligands.
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Description

FIELD OF THE INVENTION

[0001] This invention relates to methods of forming a metal oxide layer on a substrate using one or more precursor compounds that include one or more organo-amine precursor compounds (e.g., alkylamine or alkylimino-alkylamine precursor compounds) with one or more organo-oxide precursor compounds (e.g., alkoxide or oxo-alkoxide) precursor compounds during a vapor deposition process. The precursor compounds and methods are particularly suitable for the formation of a metal oxide layers on semiconductor substrates or substrate assemblies. BACKGROUND OF THE INVENTION

[0002] The continuous shrinkage of microelectronic devices such as capacitors and gates over the years has led to a situation where the materials traditionally used in integrated circuit technology are approaching their performance limits. Silicon (i.e., doped polysilicon) has generally been the substrate of choice, and silicon dioxide (SiO2) has frequently been used as the dielectric material with si...

Claims

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