Photosensitive composition and cured products thereof

a technology of composition and cured products, applied in the field of photosensitive compositions, can solve the problems of insufficient internal curability, insufficient physical properties of cured products, and reduced reaction rate, and achieve the effect of excellent photocurability and good adhesion

Active Publication Date: 2006-10-05
ASAHI KASEI CHEM CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0019] The present invention provides a cationic photosensitive composition having excellent photo-curability (surface curability and internal curability) which is not inhibited by oxygen in the air, photo-cured products of the composition exhibiting good adhes

Problems solved by technology

However, they have a problem that the rate of reaction is reduced as polymerization proceeds, resulting in insufficient internal curability and leading to insufficient physical properties of the cured products.
Moreover, there are only a small number of types in the compounds that can be used, and it is difficult to control physical properties of the cured products to be obtained.
However, the glycidyl type epoxy compounds are insufficient in reactivity when they are subjected to photo-cationic curing.
Therefore, some technique must be used such as use of special initiators such as SbF6 and AsF6 which have problems in safety or use of heat curing in combination.
However, also in this case, photo-curability is not sufficient yet as compared with the conventional free-radical system, and it is necessary to further increase sensitivity.
Other than the above, it is known that vinyl ether compounds have high cationic polymerizability, but there is a problem that cured films obtained by homopolymerization of the same have larger shrinkage on curing than those of the above-described epoxy or

Method used

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  • Photosensitive composition and cured products thereof
  • Photosensitive composition and cured products thereof
  • Photosensitive composition and cured products thereof

Examples

Experimental program
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Effect test

example 1

[0097] A photosensitive composition was obtained by thoroughly mixing 100 parts of 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexanecarboxylate as the compound (a) having two or more alicyclic epoxy groups in a molecule, 6 parts of a p-tert-butyl-phenol novolac resin (PAPS series: manufactured by Asahi Organic Chemicals Industry Co., Ltd.) in which the content of a phenol compound having 3 to 5 phenolic aromatic rings is 50 percent by weight as the polynuclear phenol compound (b), and 2 parts of TEPBI-S (trade name: manufactured by Nippon Shokubai Co., Ltd.) of an iodonium salt type as the energy beam-sensitive cationic polymerization initiator (c). The composition was applied using a bar coater on substrates each composed of glass, aluminum, an OPP film and PET to form a film having a thickness of 4 μm. Then, each film was exposed by a 400 W high pressure mercury lamp exposure machine (manufactured by Sen Lights Corporation), and photo-curability of the coated film and physical proper...

example 2

[0098] A photosensitive composition was prepared by further using 14 parts of hydroxyethyl vinyl ether as the hydroxyl group-containing compound (d) in Example 1, and then photo-curability of the photosensitive composition and physical properties of the cured film thereof were evaluated. The results are shown in Table 1.

example 3

[0099] A photosensitive composition was prepared by replacing 2 parts of TEPBI-S with 4 parts of UVI-6990 (about 50 percent solution of propylene carbonate: manufactured by The Dow Chemical Company) of a sulfonium salt type as the component (c) and replacing 14 parts of hydroxyethyl vinyl ether with 18 parts of 4-hydroxybutyl vinyl ether as the compound (d), in Example 2, and then photo-curability of the photosensitive composition and physical properties of the cured film thereof were evaluated. The results are shown in Table 1.

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Abstract

There is provided a photosensitive composition excellent in photo-curability which comprises an epoxy compound having two or more epoxy groups, a polynuclear phenol compound having a specific structure and an energy beam-sensitive cationic polymerization initiator, and optionally a predetermined percentage of a hydroxyl group-containing compound having one or more hydroxyl groups and one or more of at least one of a vinyl ether group and an oxetanyl group in a molecule, and a cured product of the same whose film is excellent in adhesion to various substrates, water resistance and flexibility.

Description

TECHNICAL FIELD [0001] The present invention relates to a photosensitive composition which forms cured films in the air by the irradiation of energy beams, the formed films being useful as coatings, adhesives, inks and film coatings, more specifically, UV inks for ink jet, sealers for display panels such as liquid crystals and organic EL, adhesives for bonding optical disks, materials for forming a surface protective layer of a Blue-ray disk which is a next-generation optical disk, coating materials for forming antireflective films and hard coating materials, and to cured products thereof. BACKGROUND ART [0002] A curing system employing energy beams such as ultraviolet rays has become an important method for improving productivity and solving recent environmental problems. The mainstream of current photo-curing systems is a free radical curing system employing (meth)acrylate materials. However, materials of a cationic curing system employing a material such as epoxy, vinyl ether and...

Claims

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Application Information

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IPC IPC(8): G03C1/00C08G59/62C09D5/00C09D7/12C09D11/00C09D11/322C09D11/328C09D11/38C09D161/06C09D163/00C09J11/06C09J163/00
CPCY10T428/1073C08G59/62C09K2323/055C09D11/30G03F7/0007G03F7/0045
Inventor MIYAZAKI, KUONTAKAHASHI, HIDEAKI
Owner ASAHI KASEI CHEM CORP
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