Gallium nitride high electron mobility transistor having inner field-plate for high power applications
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[0027]Hereinafter, embodiments of the present invention will be described in detail with reference to the attached drawings.
[0028]FIG. 1 is a sectional view schematically showing a High Electron Mobility Transistor (HEMT) according to the present invention, and FIG. 2 is a sectional view schematically showing an HEMT according to an embodiment of the present invention. As shown in the drawings, an HEMT 1 is constructed so that a gallium nitride (GaN) buffer layer 10, doped with Fe through Metal Organic Chemical Vapor Deposition (MOCVD), is formed, and a barrier layer 20 is formed on the buffer layer 10.
[0029]The buffer layer 10 is preferably made of a semi-conducting material and has a thickness of 2 μm, and the barrier layer 20 is preferably made of undoped Al0.27Ga0.73N and has a thickness of 22 nm. To isolate the devices, Remote Ion Beam Etching (RIBE), using Ar-Cl2 gas which has an etch rate of 400 Å / min, is preferably applied to the gallium nitride (GaN) buffer layer 10.
[0030]F...
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