Process for Producing Circuit Substrate and Circuit Substrate Obtained in Accordance With the Process
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example 1
(1) Formation of a Silicone-Based Resin Layer on a Glass Substrate for Processing
[0096]To 100 parts by mass of a polyorganosiloxane of the addition type having the siloxane bond as the skeleton structure and containing polyorganosiloxane having vinyl group and polyorganohydrogensiloxane [manufactured by Shin-Etsu Chemical Co., Ltd.; the trade name: “KS-847H”], 10 parts by mass of a silicone resin component [manufactured by Shin-Etsu Chemical Co., Ltd.; the trade name: “KR3700”] and 0.2 parts by mass of a platinum catalyst [manufactured by TORAY DOW CORNING Co., Ltd.; the trade name: “SRX-212”] were added, and a solution of a silicone-based resin having a concentration of solid components of 20% by mass was prepared by adding methyl ethyl ketone.
[0097]The solution of a silicone-based resin prepared above was applied to one face of a glass substrate having a thickness of 0.7 mm [manufactured by Corning Incorporated; the trade name: “1737”] which had been cut to a size of 100 mm×100 mm...
example 2
[0102]A resin sheet having embedded chips was obtained in accordance with the same procedures as those conducted in Example 1 except that a resin composition of the thermosetting type was prepared by adding t-butyl peroxy-3,5,5-trimethylhexanoate [manufactured by Kayaku Akzo Corporation; the trade name: “TRIGONOX 42”] as a thermal polymerization initiator in place of the photopolymerization initiator “DAROCURE 1173” (described above), and the uncured coating layer was cured by the heat treatment at 100° C. for 30 minutes without irradiation with ultraviolet light. The viscosity of the resin composition when the composition was used for the coating was the same as that in Example 1. The result of the evaluation of the property for embedding is shown in Table 1.
example 3
[0103]A resin sheet having embedded chips was obtained in accordance with the same procedures as those conducted in Example 1 except that a resin composition containing 100 parts by mass of a modified epoxy acrylate resin [manufactured by DAICEL-CYTEC Company, Ltd.; the trade name: “Ebecryl 13708”] and 1.5 parts by mass of the photopolymerization initiator “DAROCURE 1173” (described above) was used as the liquid resin composition of the active energy ray curing type, and the composition was used for the solution casting by heating at 60° C. The viscosity of the resin composition of the ultraviolet light curing type was 4,100 mPa·s at 60° C. The result of the evaluation of the property for embedding is shown in Table 1.
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