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Microcrystalline-to-amorphous gold alloy and plated film, and plating solution for those, and plated film formation method

a technology of amorphous gold alloy and amorphous gold alloy, which is applied in the direction of cell components, printing, basic electric elements, etc., can solve the problem of not being able to achieve the same degree of durability, and achieve the effect of high electrical conductivity and resistance to cracking

Inactive Publication Date: 2012-02-09
WASEDA UNIV +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The present invention relates to a mixed microcrystalline-amorphous gold alloy plated film that has improved hardness and abrasion resistance while maintaining good electrical conductivity and chemical stability. The invention also provides an electroplating solution for forming this plated film and an electroplating method using the solution. The technical effect of the invention is to provide a plated film that can be used as a terminal of an electronic equipment component and has improved hardness and abrasion resistance while maintaining good electrical conductivity and chemical stability.

Problems solved by technology

Furthermore, it is thought that, in the near future, the size of a contact will become close to the size of the above-mentioned microcrystals of the hard gold plated film; when a hard gold plated film like the one mentioned above is formed on such a fine contact, since the absolute number of microcrystals forming a film becomes small, it is predicted that it will not be possible to obtain the same degree of durability as is the case when a hard gold plated film is formed on the order of size of contact that is currently used.

Method used

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  • Microcrystalline-to-amorphous gold alloy and plated film, and plating solution for those, and plated film formation method
  • Microcrystalline-to-amorphous gold alloy and plated film, and plating solution for those, and plated film formation method
  • Microcrystalline-to-amorphous gold alloy and plated film, and plating solution for those, and plated film formation method

Examples

Experimental program
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Effect test

example 1

[0063]A mixed microcrystalline-amorphous gold alloy plated film (film thickness 1 μm) was formed on a copper plate having a purity of 99.96% at a temperature of 70° C. and a current density of 10 mA / cm2 using an electroplating solution containing 0.035 mol / dm3 of KAu(CN)2, 0.076 mol / dm3 of NiSO4.6H2O, and 0.21 mol / dm3 of triammonium citrate and having a pH adjusted to 6 with KOH and sulfuric acid. As the anode, a platinum-coated titanium electrode (mesh form) was used, and the plating bath was vigorously stirred during plating.

[0064]The mixed microcrystalline-amorphous gold alloy plated film thus obtained was analyzed by XRD, TEM, and THEED. An XRD pattern is shown in FIG. 1, and TEM images and a THEED pattern are shown in FIGS. 2 to 4. A broad peak having a peak half-width of 1 degree or greater, which is characteristic of being microcrystalline or amorphous, was observed in the XRD pattern at around 2θ=40 degrees. Furthermore, in the TEM image a state in which crystal fringes char...

example 2

[0065]Plating was carried out in the same way as for Example 1 except that n-propanol was added at 20 vol %, and the plated film thus obtained was subjected to XRD, TEM, and THEED analyses. An XRD pattern is shown in FIG. 1, and TEM images and a THEED pattern are shown in FIGS. 5 to 7. A broad peak having a peak half-width of 1 degree or greater, which is characteristic of being microcrystalline or amorphous, was observed in the XRD pattern at around 2θ=40 degrees. Furthermore, in the TEM image a state in which crystal fringes characteristic of being crystalline and an irregular structure characteristic of being amorphous are mixed could be observed. In the THEED pattern, a state in which a diffraction spot characteristic of being crystalline and a halo ring characteristic of being amorphous are mixed could be observed. From these results, it can be seen that the plated film obtained had a mixed microcrystalline-amorphous structure. Furthermore, as a result of examining the TEM imag...

example 3

[0066]Plating was carried out in the same way as for Example 1 except for a concentration of citric acid of 0.143 mol / dm3, a concentration of ammonia of 1.2 mol / dm3, and electroplating being carried out alternatingly at current densities of 1 mA / cm2 (application time 50 sec) and 10 mA / cm2(application time 5 sec) without a gap, and the plated film thus obtained was subjected to XRD, TEM, and THEED analyses. An XRD pattern is shown in FIG. 1, and TEM images and a THEED pattern are shown in FIGS. 8 to 10. A broad peak having a peak half-width of 1 degree or greater, which is characteristic of being microcrystalline or amorphous, was observed in the XRD pattern at around 2θ=40 degrees. Furthermore, in the TEM image a state in which crystal fringes characteristic of being crystalline and an irregular structure characteristic of being amorphous are mixed could be observed. In the TREED pattern, a state in which a diffraction spot characteristic of being crystalline and a halo ring charact...

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Abstract

Disclosed is a microcrystalline-to-amorphous gold alloy-plated film having excellent electrical properties and excellent mechanical properties. Physical properties including both the advantageous properties of a crystalline structure and the advantageous properties of an amorphous structure can be obtained by allowing a microcrystalline phase and an amorphous phase to exist in a mixed state at a specific ratio. The average particle diameter of the microcrystals is 30 nm or smaller, the volume fraction of the microcrystals is 10 to 90%, the knoop hardness is Hk 180 or more, the specific resistivity is 200 μΩ-cm or less. In the film, hardness and abrasion resistance can be improved while maintaining a good specific resistivity value and chemical stability both inherent to gold at practically insignificant levels. Therefore, the film is useful as a material for connecting an electric or electronic component such as a connector and a relay.

Description

TECHNICAL FIELD[0001]The present invention relates to a mixed microcrystalline-amorphous gold alloy plated film that is useful as a plated film for a terminal of an electronic equipment component and has excellent electrical properties and mechanical properties, an electroplating solution that can form this mixed microcrystalline-amorphous gold alloy plated film, and an electroplating method employing this electroplating solution.BACKGROUND ART[0002]As an electrical contact material for, in particular, parts where high reliability is required in an electrical / electronic component connector, a miniature electromechanical relay, a printed wiring board, etc., a gold plated film called a hard gold plated film is currently widely used. The hard gold plated film has cobalt, nickel, etc. added to gold, and its film hardness is improved without reducing the intrinsically good electrical conductivity and chemical stability of gold. This hard gold plated film has a fine structure in which gol...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): C25D3/48C25D7/00
CPCC25D3/62C25D7/00C25D5/615
Inventor OSAKA, TETSUYAOKINAKA, YUTAKASENDA, KAZUTAKAIWAI, RYOTAKATO, MASARU
Owner WASEDA UNIV