Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Electric field assisted perpendicular stt-mram

a technology of perpendicular spin and magnetic random access, applied in the manufacture/treatment of galvano-magnetic devices, electrical apparatus, magnetic field-controlled resistors, etc., can solve the problems of element unrecordable, information readout errors increase, value change, etc., to reduce the perpendicular anisotropy strength of the recording layer, the effect of reducing the perpendicular anisotropy strength

Inactive Publication Date: 2016-06-09
T3MEMORY
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0014]An exemplary embodiment includes method of operating a perpendicular spin-transfer-torque magnetoresistive memory including a circuitry coupled to the bit line positioned adjacent to selected ones of the plurality of magnetoresistive memory elements to supply a reading current or bi-directional spin-transfer recording current, and coupled to the digital line configured to generate an electric field pointing a way from the top surface of the functional layer and accordingly to decrease the perpendicular anisotropy strength of the recording layer. Thus magnetization of a recording layer can be readily switched or reversed to the direction in accordance with a direction of a current across the MTJ stack by applying a low spin transfer current.
[0015]Another exemplary embodiment includes a recording layer consisting of one or more nonmagnetic insertion layers and magnetic sub-layers and includes method of operating a perpendicular spin-transfer-torque magnetoresistive memory including a circuitry coupled to the bit line positioned adjacent to selected ones of the plurality of magnetoresistive memory elements to supply a reading current or bi-directional spin-transfer recording current, and coupled to the digital line configured to generate an electric field pointing away from the top surface of the functional layer, decreasing the perpendicular anisotropy strength and rotating the magnetization of the bottom sub-layer in a recording layer in a film plane, accordingly generating an in-plane demag bias field acting on the top sub-layer magnetization of the recording layer. Thus a low write current is readily achieved while maintaining a high thermal stability and improving margins among reading, recording voltage and breakdown voltage.

Problems solved by technology

More, even when the tunnel barrier does not immediately break down, if recording operations are repeated, the element may still become nonfunctional such that the resistance value changes (decreases) and information readout errors increase, making the element un-recordable.
Furthermore, recording is not performed unless a sufficient voltage or sufficient spin current is applied.
Accordingly, problems with insufficient recording arise before possible tunnel barrier breaks down.
However, patterning of small MTJ element leads to increasing variability in MTJ resistance and sustaining relatively high switching current or recording voltage variation in a STT-MRAM.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Electric field assisted perpendicular stt-mram
  • Electric field assisted perpendicular stt-mram
  • Electric field assisted perpendicular stt-mram

Examples

Experimental program
Comparison scheme
Effect test

first embodiment

[0048]FIG. 2 illustrates a memory element, according to the The recording layer is made of a single ferromagnetic layer having a perpendicular anisotropy and magnetization, or a multilayer with ferromagnetic sub-layers strongly coupled across thin nonmagnetic insertion sub-layer(s) having a perpendicular anisotropy and magnetization. During a recording operation, a spin transfer current is first tuned on to flow across the MTJ stack, then a positive bias voltage pulse through the digital line is tuned on to generate an electric field pointing upward on a dielectric functional layer. As a result, the perpendicular anisotropy is decreased and the magnetization in the recording layer is readily switched to the direction in accordance with a direction of a spin transfer current across the MTJ stack. As the bias voltage on the digital is tuned off, the magnetization of the recording layer maintains along the recorded perpendicular direction. At last, the spin transfer current is tuned o...

second embodiment

[0049]FIG. 3 illustrates a memory element, having a nonmagnetic insertion sub-layer between two ferromagnetic sub-layers in a recording layer. These two ferromagnetic sub-layers are decoupled due to the relatively thick insertion layer, except that there is only magneto-static interaction between these sub-layers. During a recording operation, a positive bias voltage pulse through the digital line is tuned on to generate an upward electric field on a dielectric functional layer. As a result, the perpendicular anisotropy is decreased to be smaller than a film demag field, and the magnetization in the bottom sub-layer in the recording layer rotates to the film plane to generate an in-plane magnetic bias field acting on the upper sub-layer in the recording layer. Then a spin transfer current is tuned on to flow across the MTJ stack, the spin transfer recording current reverses the recording layer magnetization to the direction in accordance with a direction of a current between the bi...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

Present invention discloses a perpendicular STT-MRAM, a method of operating, and a method of manufacturing the same and a plurality of magnetoresistive memory elements having a recording layer which has an interface interaction with an underneath dielectric functional layer. The energy switch barrier of the recording layer is reduced under an electric field applying along a perpendicular direction of the functional with a proper voltage on a digital line from a control circuitry; accordingly, the perpendicular magnetization of the recording layer is readily reversible in a low spin-transfer switching current.

Description

RELATED APPLICATIONS[0001]This application is a divisional application due to a restriction requirement on application Ser. No. 14 / 159,116. This application seeks priority to U.S. Utility patent application Ser. No. 14 / 159,116 filed on 2014 Jan. 20 and U.S. Provisional Patent Application No. 61,754,923 filed on 2013 Jan. 21; the entire contents of each of which are incorporated herein by reference.BACKGROUND OF THE INVENTION[0002]1. Field of the Invention[0003]This invention relates generally to a perpendicular spin-transfer-torque magnetic-random-access memory (MRAM) element and a method of manufacturing the same magnetoresistive element, more particularly to structures and methods of reading and programming a spin-torque magnetoresistive random access memory (MRAM) element having an electric field assisted recording.[0004]2. Description of the Related Art[0005]In recent years, magnetic random access memories (hereinafter referred to as MRAMs) using the magnetoresistive effect of f...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(United States)
IPC IPC(8): H01L43/12H01L43/02H01L43/08
CPCH01L43/12H01L43/02H01L43/08H10B61/22H10N50/01H10N50/10H10B51/30H10N50/80
Inventor GUO, YIMIN
Owner T3MEMORY
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products