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Thermal spray coating, member for semiconductor manufacturing equipment, feedstock material for thermal spray, and method for producing thermal spray coating

a technology of semiconductor manufacturing equipment and thermal spray coating, which is applied in the direction of molten spray coating, anti-corrosion paint, coating, etc., can solve the problems of not knowing if a thermal spray coating can be obtained, and the corrosion resistance of the thermal spray coating has not been determined, so as to achieve high corrosion resistance and improve the corrosion resistance of the member

Inactive Publication Date: 2016-12-29
NGK INSULATORS LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The MgO—AlN solid solution coating exhibits superior corrosion resistance and moisture resistance, improving durability and reducing water absorption, making it suitable for semiconductor manufacturing equipment components like electrostatic chucks and heaters.

Problems solved by technology

However, regarding the ceramic material of PTL 1, no studies have been conducted on thermal spray coatings.
It is not known if a thermal spray coating can be obtained, and corrosion resistance thereof has not been determined.
Furthermore, for pure magnesium oxide, which is a material having corrosion resistance equivalent to the ceramic material, it is very difficult to select thermal spray conditions which permit melting while not permitting volatilization.
Moreover, since magnesium oxide is hygroscopic and water-absorbing, when it is used for members which are to be subjected to a vacuum or reduced pressure, the generation of water may pose a problem.

Method used

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  • Thermal spray coating, member for semiconductor manufacturing equipment, feedstock material for thermal spray, and method for producing thermal spray coating
  • Thermal spray coating, member for semiconductor manufacturing equipment, feedstock material for thermal spray, and method for producing thermal spray coating
  • Thermal spray coating, member for semiconductor manufacturing equipment, feedstock material for thermal spray, and method for producing thermal spray coating

Examples

Experimental program
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examples

[0035]Regarding feedstock materials for thermal spray, Experimental Examples 1 to 3 and 2a correspond to examples, and Experimental Example 4 corresponds to a comparative example. Furthermore, regarding thermal spray coatings, Experimental Examples 1-1, 1-2, and 1-3, Experimental Examples 2-1, 2-2, and 2-3, and Experimental Examples 3-1 and 3-2 correspond to examples, and Experimental Examples 4-1, 4-2, and 4-3 correspond to comparative examples.

experimental examples 1 to 3 and 2a

[0036]In Experimental Examples 1 to 3 and 2a, commercially available MgO material (purity 99.9% by mass or more, average particle size 3 μm), Al2O3 material (purity 99.9% by mass or more, average particle size 0.5 μm), and AlN material (purity 99.9% by mass or more, average particle size 1 μm or less) were used. The AlN material unavoidably contains about 1% by mass of oxygen, and therefore, in the purity of the AlN material, impurity elements exclude oxygen.

[0037](Production of Feedstock Material for Thermal Spray)

[0038]Feedstock materials for thermal spray were produced by the method described below.

[0039]Preparation Step

[0040]The MgO material, Al2O3 material, and AlN material were each weighed so as to satisfy the mass % shown in Table 1, and wet mixing was performed for 4 hours, using isopropyl alcohol as a solvent, in a nylon pot, using nylon balls, with a diameter of 20 mm, having an iron core, as milling balls. After the mixing, a slurry was taken out, dried under nitrogen st...

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Abstract

A thermal spray coating according to the present invention contains mainly magnesium, aluminum, oxygen, and nitrogen and has, as a main phase, a crystal phase of a MgO—AlN solid solution in which aluminum nitride is dissolved with magnesium oxide. The thermal spray coating is obtained by thermal spray of powder of a ceramic material containing mainly magnesium, aluminum, oxygen, and nitrogen and having, as a main phase, a crystal phase of a MgO—AlN solid solution in which aluminum nitride is dissolved with magnesium oxide.

Description

CROSS-REFERENCE TO RELATED APPLICATION[0001]This application is a Divisional of U.S. application Ser. No. 14 / 557,801, filed Dec. 2, 2014, the entirety of which is incorporated herein by reference, and claims the benefit under 35 USC §119(a)-(d) of Japanese Patent Application No. 2013-252766, filed on Dec. 6, 2013 and Japanese Patent Application No. 2014-109328, filed on May 27, 2014.BACKGROUND OF THE INVENTION[0002]1. Field of the Invention[0003]The present invention relates to a thermal spray coating, a member for semiconductor manufacturing equipment, a feedstock material for thermal spray, and a method for producing a thermal spray coating.[0004]2. Description of the Related Art[0005]In semiconductor manufacturing equipment used for dry processes, plasma coating, and the like in semiconductor manufacturing, a halogen-based plasma, such as F or Cl, having high reactivity and corrosiveness is used for etching and cleaning. Members assembled into such semiconductor manufacturing equ...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): C04B35/04H01L21/02C09D5/08C04B35/622C09D1/00
CPCC04B35/04C04B35/62222C09D1/00C09D5/084C04B2235/9669C04B2235/3206C04B2235/3865C04B2235/80H01L21/02194C04B35/053C04B35/645C23C4/10C04B2235/3217C04B2235/3222C04B2235/3869C04B2235/6567C04B2235/6586C04B2235/76C09D7/61
Inventor SATO, YOSUKEINOUE, KATSUHIROKATSUDA, YUJI
Owner NGK INSULATORS LTD