Magnetoresistance effect element, magnetic memory, and magnetic device
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first embodiment
(Constitution of Magnetoresistance Effect Element)
[0016]FIG. 1 is a cross-sectional view schematically showing a constitution of a magnetoresistance effect element 100 according to a first embodiment of this disclosure. The magnetoresistance effect element 100 has a structure in which a first ferromagnetic layer 101, a non-magnetic layer 102, and a second ferromagnetic layer 103 are sequentially laminated. Description will be provided below using the first ferromagnetic layer 101 as a fixed layer whose magnetization direction is fixed and using the second ferromagnetic layer 103 as a free layer whose magnetization direction can be changed.
[0017]The first ferromagnetic metal layer 101 and the second ferromagnetic metal layer 103 are made of a known material having ferromagnetic properties (preferably, a soft magnetic material), for example, a metal selected from the group consisting of Cr, Mn, Co, Fe, and Ni, a ferromagnetic alloy which contains at least one of these metals, and the ...
modified example 1
[0049]FIG. 4 is a cross-sectional view schematically showing a constitution of a magnetoresistance effect element 110 according to Modified Example 1 of this embodiment. In the magnetoresistance effect element 110, a surface portion of the first insulating film 114 opposite to a non-magnetic layer 112 is covered with a second insulating film 117 containing an oxide, a nitride, or an oxynitride. An oxide, nitride, or oxynitride film can be manufactured relatively easily by applying a general semiconductor process. In this case, since the first insulating film 114 narrows by an extent that the second insulating film 117 is formed, it is possible to reduce a size of an injection region of boron nitride or aluminum nitride. Therefore, it is possible to reduce a time and costs required for the injection of boron nitride or aluminum nitride. A constitution other than the second insulating film 117 is the same as the constitution of the magnetoresistance effect element 100 according to the...
modified example 2
[0050]FIG. 5 is a cross-sectional view schematically showing a constitution of a magnetoresistance effect element 120 according to Modified Example 2 of this embodiment. In the magnetoresistance effect element 120, a third insulating film 128 containing an oxide, a nitride, or an oxynitride is provided between a non-magnetic layer 122 and a first insulating film 124. As illustrated in FIG. 5, the third insulating film 128 may be formed not only between the first insulating film 124 and the non-magnetic layer 122, but also between the first insulating film 124 and other layers 121, 123, 125, and 126.
[0051]In this case, since the third insulating film 128 functions as a heat sink and absorbs heat generated inside a magnetoresistance element, it is possible to reduce damage caused by heat generated by layers formed as functional units such as a first ferromagnetic layer, a non-magnetic layer, and a second ferromagnetic layer. A constitution other than the third insulating film 128 is t...
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