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Magnetoresistance effect element, magnetic memory, and magnetic device

Active Publication Date: 2019-04-11
TDK CORPARATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The present invention aims to provide a magnetoresistance effect element, magnetic memory, and magnetic device that are easy to manufacture, have good electrical characteristics, and are less likely to deteriorate due to heat generation.

Problems solved by technology

Heat generation facilitates magnetization reversal of a ferromagnetic layer, whereas a failure occurs due to deterioration of a non-magnetic layer and the melting of a wiring layer formed of a low melting point metal and characteristic deteriorations such as instability in the magnetization of a fixed layer are caused.
However, this sidewall includes boron nitride as a main component, does not have sufficient insulation properties, and is not easily manufactured by applying a general semiconductor process.
Furthermore, boron nitride synthesized at a low temperature or through a vapor phase method is likely to have a disordered laminated structure and boron nitride is grain-grown.
Thus, gaps are generated between grains of boron nitride and thus the sidewall containing boron nitride does not have sufficient insulation properties.
Furthermore, in order to manufacture dense boron nitride, a method of causing boron trichloride (BCl3) and ammonia to react with each other at a high temperature is known, but this reaction causes the magnetic characteristics of a magnetoresistance effect element to deteriorate.
Particularly, in a TMR element, when a non-magnetic tunnel barrier layer which generates a tunnel current is chemically influenced, there is a problem of significant deterioration of output characteristics.

Method used

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  • Magnetoresistance effect element, magnetic memory, and magnetic device
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  • Magnetoresistance effect element, magnetic memory, and magnetic device

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first embodiment

(Constitution of Magnetoresistance Effect Element)

[0016]FIG. 1 is a cross-sectional view schematically showing a constitution of a magnetoresistance effect element 100 according to a first embodiment of this disclosure. The magnetoresistance effect element 100 has a structure in which a first ferromagnetic layer 101, a non-magnetic layer 102, and a second ferromagnetic layer 103 are sequentially laminated. Description will be provided below using the first ferromagnetic layer 101 as a fixed layer whose magnetization direction is fixed and using the second ferromagnetic layer 103 as a free layer whose magnetization direction can be changed.

[0017]The first ferromagnetic metal layer 101 and the second ferromagnetic metal layer 103 are made of a known material having ferromagnetic properties (preferably, a soft magnetic material), for example, a metal selected from the group consisting of Cr, Mn, Co, Fe, and Ni, a ferromagnetic alloy which contains at least one of these metals, and the ...

modified example 1

[0049]FIG. 4 is a cross-sectional view schematically showing a constitution of a magnetoresistance effect element 110 according to Modified Example 1 of this embodiment. In the magnetoresistance effect element 110, a surface portion of the first insulating film 114 opposite to a non-magnetic layer 112 is covered with a second insulating film 117 containing an oxide, a nitride, or an oxynitride. An oxide, nitride, or oxynitride film can be manufactured relatively easily by applying a general semiconductor process. In this case, since the first insulating film 114 narrows by an extent that the second insulating film 117 is formed, it is possible to reduce a size of an injection region of boron nitride or aluminum nitride. Therefore, it is possible to reduce a time and costs required for the injection of boron nitride or aluminum nitride. A constitution other than the second insulating film 117 is the same as the constitution of the magnetoresistance effect element 100 according to the...

modified example 2

[0050]FIG. 5 is a cross-sectional view schematically showing a constitution of a magnetoresistance effect element 120 according to Modified Example 2 of this embodiment. In the magnetoresistance effect element 120, a third insulating film 128 containing an oxide, a nitride, or an oxynitride is provided between a non-magnetic layer 122 and a first insulating film 124. As illustrated in FIG. 5, the third insulating film 128 may be formed not only between the first insulating film 124 and the non-magnetic layer 122, but also between the first insulating film 124 and other layers 121, 123, 125, and 126.

[0051]In this case, since the third insulating film 128 functions as a heat sink and absorbs heat generated inside a magnetoresistance element, it is possible to reduce damage caused by heat generated by layers formed as functional units such as a first ferromagnetic layer, a non-magnetic layer, and a second ferromagnetic layer. A constitution other than the third insulating film 128 is t...

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Abstract

A magnetoresistance effect element has a structure in which a first ferromagnetic layer, a non-magnetic layer, and a second ferromagnetic layer are subsequently laminated and outer circumferential portions of the first ferromagnetic layer, the non-magnetic layer, and the second ferromagnetic layer are covered with a first insulating film which contains silicon nitride as a main component and contains further boron nitride or aluminum nitride.

Description

BACKGROUND OF THE INVENTIONField of the Invention[0001]The present invention relates to a magnetoresistance effect element, a magnetic memory, and a magnetic device.[0002]Priority is claimed on Japanese Patent Application Nos. 2017-169734 and 2018-158487, filed Sep. 4, 2017 and Aug. 27, 2018, the content of which is incorporated herein by reference.Description of Related Art[0003]A giant magnetoresistance (GMR) element formed of a multilayer film such as a ferromagnetic layer and a non-magnetic layer and a tunneling magnetoresistance (TMR) element using an insulating layer (tunnel barrier layer or barrier layer) as a non-magnetic layer are known. Generally, a TMR element has an electrical resistance higher than that of a GMR element and a magnetoresistance (MR) ratio thereof is larger than that of a GMR element. For this reason, TMR elements are attracting attention as elements for magnetic sensors, high frequency components, magnetic heads, and nonvolatile random access memories (M...

Claims

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Application Information

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IPC IPC(8): G11C11/14G11C11/16H01L43/08H01L43/12G01R33/09
CPCG11C11/14G11C11/161G01R33/093H01L43/12H01L43/08G01R33/098H10N50/01H10N50/10
Inventor SASAKI, TOMOYUKISHIOKAWA, YOHEIYOSHINARI, JIRO
Owner TDK CORPARATION