Highly integrated multi-channel optical transceiver module and active optical cable based on silicon photonic chip

Abstract

A highly integrated multi-channel optical transceiver module based on silicon photonic chip technology includes an integrated silicon photonic chip, an integrated circuit chip, and a printed circuit board assembly. The integrated silicon photonic chip and the integrated circuit chip are both integrated on silicon substrates and are furthered bonded on printed circuit board assembly. The integrated silicon photonic chip includes a silicon photonic transmitter chip and a silicon photonic receiver chip that both connected to optical fiber connectors through the optical fiber patch cord jumpers. The integrated circuit chip includes an integrated circuit transmitter chip that connected to the silicon photonic transmitter chip through a wire bonding, and an integrated circuit receiver chip that connected to the silicon photonic receiver chip through a wire bonding. The present invention provides a high-data-rate, low-power-consumption, and cost-effective solution for optical transceiver modules and active optical cables based on silicon photonic chip technology.

Description

BACKGROUND OF THE INVENTION1. Field of the Invention[0001]The present invention relates to the field of communications, and in particular, to a highly integrated multi-channel optical transceiver module and an active optical cable (AOC) based on silicon photonic chip.2. Description of the Related Art[0002]With the rapid development of technologies such as big data, cloud computing, Internet of Things, and 5G mobile communications, network data traffic grows rapidly accordingly. In this case, interconnection among broadband access, metropolitan area networks, backbone networks, and data centers requires significant increases in requirements of bandwidths and rates in data communication. Currently, the global fiber-optic communication industry is developing towards high integration and low power consumption. Optical communications devices are upstream products in the optical communications industry, and play critical roles in the field of data communication. Therefore, how to implemen...

AI Technical Summary

Benefits of technology

This solution reduces component count by over 50% compared to conventional devices, enables batch production, and simplifies the production process, resulting in lower costs and higher reliability with enhanced compatibility and scalability.

Problems solved by technology

In these processes, intensive human labor is required.

Consequently, there are a series of disadvantages such as high costs, large sizes, low reliability, and limited performance.

In another aspect, from the perspective of process standards, due to the lack of a universal process standard, optical device companies adopt a “small workshop” operation and development model to save costs, resulting in low product yields, low production, and a compatibility problem between different products.

Such a “vertical integration” business model causes an imbalance between an investment scale and an output, and causes high capital investment and operation costs of each manufacturer, and no scale effect is achieved.

Therefore, optical devices have high costs, low production, and unsatisfying profit of single production lines.

Moreover, there is no flexibility and the tolerance to fluctuating market demand is low.

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