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System and Method for Reducing Power Losses for Magnetics Integrated in a Printed Circuit Board

a technology of printed circuit board and magnetic device, which is applied in the direction of printed circuit parts, printed circuit non-printed electric components association, inductance, etc., can solve the problems of undesired electrical signals at undesired frequencies, undesired radiated and/or conducted emissions at the output of power converter, and heat loss in choke, so as to reduce the eddy current induced within the coil due to the air gap fringing flux, the effect of reducing the power loss

Pending Publication Date: 2020-11-05
ROCKWELL AUTOMATION TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The patent describes a system and method for integrating a magnetic component into a power converter to minimize power losses. The magnetic component includes a coil on a printed circuit board (PCB) that has multiple layers and traces joined together to form the coil. The dimensions of the traces are varied to reduce eddy currents, which are caused by air-gap fringing flux. The position of the traces is also selected to reduce coupling to leakage fluxes within the magnetic component. A floating conductive layer is added between the coil and the core material to dissipate eddy currents and heat out of the PCB. These features make the magnetic component scalable to power converters of greater power ratings than traditional construction.

Problems solved by technology

While the modulation routine controls the switching devices to convert the power from the first form to the second form, it also generates electrical signals at undesired frequencies.
The high frequency signals may result in undesired radiated and / or conducted emissions at the output of the power converter.
The amount of heat lost in the choke as a result of filtering the high frequency content also increases.
The size and heat dissipation requirements of the choke typically result in a bulky filter component requiring substantial space in a control cabinet and may also require a fan or fluid pumps and hydraulic components to implement air or liquid cooling.
However, such efforts are subject to the same drawbacks as external chokes.
Introduction of the magnetic component within the power converter moves the power losses and heat generation caused by the magnetic component within the power conversion device.
The heat generation limits the application of magnetic components within the power converter to low power devices.
Alternately, the heat generation may require addition of heat sinks, forced air cooling, or liquid cooling increasing the size and cost of the power converter.

Method used

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  • System and Method for Reducing Power Losses for Magnetics Integrated in a Printed Circuit Board
  • System and Method for Reducing Power Losses for Magnetics Integrated in a Printed Circuit Board
  • System and Method for Reducing Power Losses for Magnetics Integrated in a Printed Circuit Board

Examples

Experimental program
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first embodiment

[0038]Turning initially to FIG. 1, a magnetic component 10 integrated into a circuit board 20 is illustrated. The PCB 20 is a multi-layer board where a coil 50 is defined by multiple loops of circuit traces on the PCB. With reference also to FIG. 2, a first opening 24 extends through the PCB 20 which is configured to receive a center portion of a core 80. A pair of side openings 29 also extend through the PCB 20 with a first side opening 29 positioned to one side of the first opening 24 and a second side opening 29 positioned on the opposite side of the first opening 24. An “E-shaped” member 84 of the core 80 may be inserted into the openings with a central portion 81 of the core 80 extending through the first opening 24 and a pair of side members 83 of the core 80 extending through the side openings 29. Although not visible in FIG. 1, a second member of the core, such as an “I-shaped” member 82 of the core 80 may be positioned on the reverse side of the PCB 20. Clips 27 extending u...

second embodiment

[0047]With reference next to FIG. 11, the magnetic component 10 varies the position of traces 52 in the PCB 20. Once again, for ease of illustration, the PCB 20 is not shown. FIG. 11 includes only sectional views of the E-shaped member 84 and I-shaped member 82 of the core 80 as well as sectional views of traces 52 on the PCB 20. However, traces 52 illustrated in the same row in FIG. 11 are on a single layer of the PCB 20. Each of the traces 52 has a uniform width and an axis 70 defined extending vertically through a midpoint of the trace 52. The traces 52 on the lowest layer have a first axis 70A, and the traces 52 on each subsequent layer extending upward through the PCB have a corresponding axis (70B-70K) defined. The axes are illustrated only in the column of inner traces 54, however, it is understood that each column of traces has a unique set of axes. The second axis 70B, defined in the trace 52 immediately above the trace having the first axis 70A, is offset from the first ax...

third embodiment

[0048]Turning then to FIG. 12, the magnetic component 10 varies both the width and the position of traces 52 in the PCB 20. Once again, for ease of illustration, the PCB 20 is not shown. FIG. 12 includes only sectional views of the E-shaped member 84 and I-shaped member 82 of the core 80 as well as sectional views of traces 52 on the PCB 20. However, traces 52 illustrated in the same row in FIG. 12 are on a single layer of the PCB 20. Each column of traces 52 includes a gradual offset of the axes between traces 52 in adjacent layers such that the trace 52 in the upper most layer of each column is offset away from the central portion 81 of the E-shaped member 84 further than the trace 52 in the lowest layer of the respective column in a manner similar to that discussed above with respect to FIG. 11. Additionally, the widths of the traces 52 are varied to reduce the cross-sectional area of traces present near the air gap 85. The widths of traces 52 in a column nearest the central port...

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PUM

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Abstract

A system and method for integrating a magnetic component within a power converter includes a coil integrated on a PCB. The PCB includes multiple layers and traces on each layer to form a single coil or to form multiple coils on the magnetic component. The PCB further includes at least one opening in the PCB through which a core component may pass, such that the magnetic component is defined by the coils and the core material. To reduce eddy currents built up within the traces, the dimensions of traces on a layer are varied and the position of traces between layers of the PCB are varied. The widths and locations of individual traces are selected to reduce coupling of the trace to leakage fluxes within the magnetic component. A floating conductive layer may also be provided to still further reduce the magnitude of eddy currents induced within the coil.

Description

BACKGROUND INFORMATION[0001]The subject matter disclosed herein relates generally to reducing power losses in magnetic devices for use in power conversion devices and, more specifically, to a system for reducing power losses in a magnetic device integrated in a printed circuit board (PCB) for use in the power conversion device.[0002]As is known to those skilled in the art, power conversion devices receive power in a first form at an input to the device and provide power in a second form at an output from the device. The power may be received or delivered as either alternating current (AC) or direct current (DC) at varying amplitudes of voltage and / or current. Common power conversion devices include an AC-to-DC converter, a DC-to-AC converter, a boost converter, a buck converter, a multi-level converter, a voltage regulator, and the like. When the power conversion device uses a switching element to perform the power conversion, it may also be referred to as a switched-mode power conv...

Claims

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Application Information

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IPC IPC(8): H01F27/28H01F27/34H05K1/18H02M1/12
CPCH01F27/2885H01F27/2804H05K1/181H05K2201/0792H02M1/12H01F2027/2809H01F27/346H05K2201/08H01F17/0013H01F17/0033H01F2017/008H01F2027/348H01F2027/2819H05K1/165H05K2201/09672H05K2201/086H05K3/4644H01F5/003H01F17/0006
Inventor SIZOV, GENNADIVRANKOVIC, ZORANSKIBINSKI, GARY L.
Owner ROCKWELL AUTOMATION TECH