Chip-type three-dimensional magnetic field sensor
Patent Information
- Authority / Receiving Office
- US · United States
- Current Assignee / Owner
- ZHEJIANG UNIV
- Publication Date
- 2022-07-14
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Abstract
Description
CROSS REFERENCE OF RELATED APPLICATION
[0001] This is a U.S. National Stage under 35 U.S.C 371 of the International Application PCT / CN2020 / 086127, filed Apr. 22, 2020, which claims priority under 35 U.S.C. 119(a-d) to CN 201910391741.X, filed May 13, 2019.BACKGROUND OF THE PRESENT INVENTIONField of Invention
[0002] The present invention relates to the field of integrated optical and magnetic field sensing technology, and more particularly to a chip-type three-dimensional magnetic field sensor.Description of Related Arts
[0003] Magnetic field sensors play an important role in many fields such as daily transportation, geophysics, military defense, and biomedicine. For example, the aircraft adopts magnetic field sensors to realize highly reliable contactless information exchange, so as to ensure the flight safety; all kinds of mine resources such as steel, rare metals and non-ferrous metals are able to be located by magnetic field sensors, thereby greatly reducing the cost of prospecting; by...