573results about "Three-component magnetometers" patented technology

A sensor assembly includes a first magneto-resistive field sensor in a first surface-mountable package, which measures first and second components of a magnetic field projected onto respective different first and second axes with respect to a spatial orientation of the sensor and to produce first position signals indicative of the measured first and second components. A second magneto-resistive field sensor in a second surface-mountable package measures at least a third component of the magnetic field projected onto at least a third axis with respect to the spatial orientation of the sensor, and to produce second position signals indicative of the measured third component. A substrate assembly orients the first field sensor in a first spatial orientation and to orient the second field sensor in a second spatial orientation so that the third axis is oriented out of a plane containing the first and second axes.

The present invention provides a method to compensate for the sensitivity drift of a magnetic field sensor for sensing a magnetic field. The magnetic field sensor comprises at least four electrodes. The method comprises a first step where a first set of two electrodes is used to bias the sensor and a second set of two electrodes is used to sense an output signal of the magnetic field sensor, and a second step where the second set of two electrodes is used to bias the sensor and the first set of two electrodes is used to sense an output signal of the magnetic field sensor. The method is characterized in that at least one of the first or the second step is subdivided in at least a first sub-step and a second sub-step. A reference magnetic field has first magnetic field parameters, e.g. a first amplitude and / or direction, in the first sub-step and second magnetic field parameters, a second amplitude and / or direction, in the second sub-step. An output signal is sensed in the first and in the second step, and within the first or the second step an output signal is sensed in the first and the second sub-step.

Methods and apparatus for vertical chip-on-board sensor packages can comprise a vertical sensor circuit component comprising a first face, a second face, a bottom edge, a top edge, two side edges, input / output (I / O) pads and at least one sensitive direction wherein the I / O pads are arranged near the bottom edge. Such vertical die chip-on-board sensor packages can also comprise one or more horizontal sensor circuit components comprising a top face, a printed circuit board (PCB) mounting face, a vertical sensor circuit component interface edge, two or more other edges, and one or more sensitive directions wherein the vertical sensor circuit component interface edge supports the vertical sensor circuit component along the Z axis and conductively or non-conductively connects to the vertical sensor circuit component. The methods and apparatus provided include a multi-axis magnetometer for measuring the magnetic field intensity along three orthogonal axes comprising one or more magnetic field sensing circuit components mounted by their PCB mounting face to a PCB and a vertical magnetic sensor circuit component mounted to the PCB such that the vertical magnetic sensor circuit component is attached to and supported by the magnetic field sensing circuit component.

An apparatus-based method is disclosed for calibration of a 3D field sensor. The method comprises accessing a plurality of samples, where the samples are from the 3D field sensor. Each sample represents a magnitude and an orientation of a three-dimensional field sensed by the 3D field sensor. Using the plurality of samples, a plurality of parameters is determined of an ellipsoid. The determination of the plurality of parameters is performed so that the ellipsoid fits the plurality of samples. A transformation is determined that transforms the ellipsoid into a sphere. The transformation is applied to a sample to create a transformed sample. Apparatus and signal bearing media are also disclosed.

The invention discloses a magnetic tunnel junction (MTJ) triaxial magnetic field sensor, which comprises an X-axis bridge magnetic field sensor with the X axis as the sensitive direction, a Y-axis bridge magnetic field sensor with the Y axis as the sensitive direction, a Z-axis bridge magnetic field sensor with the Z axis as the sensitive direction and an application specific integrated circuit (ASIC) chip connected and matched with the X-axis bridge magnetic field sensor, the Y-axis bridge magnetic field sensor and the Z-axis bridge magnetic field sensor. The Z-axis magnetic field sensor comprises a substrate and an MTJ element prepared on the substrate, the Z-axis magnetic field sensor clings to and covers the ASIC chip to form a clinging side, an included angle is formed between the clinging side and the lateral side adjacent to the clinging side on the Z-axis magnetic field sensor, the included angle is an acute angle or an obtuse angle, and the X axis, the Y axis and the Z axis are intersected with each other in orthogonality mode. By means of the structure, the MTJ triaxial magnetic field sensor is high in integrated degree, higher in sensitivity, low in power consumption, better in linearity, wide in dynamic range, better in temperature characteristics and strong in anti-jamming capability.