Method for manufacturing backing material for ultrasonic detection probe

A manufacturing method, ultrasonic testing technology, applied in the direction of material selection for piezoelectric devices or electrostrictive devices, material analysis using sound waves/ultrasonic waves/infrasonic waves, analysis of solids using sound waves/ultrasonic waves/infrasonic waves, etc., can solve system problems Difficult to mix evenly, not good, sound attenuation performance reduction and other problems, to achieve the effect of uniform distribution, reduced dosage, and improved sound attenuation coefficient

Active Publication Date: 2008-06-04
SHANTOU INST OF UITRASONIC INSTR CO LTD
View PDF4 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] It can be seen from Table 1 that when the volume percentage of tungsten powder increases from 9.9% to 31.9%, the acoustic impedance rate increases from 4.7×10 6 Pa·s / m rises to 10.8×10 6 Pa·s / m, but the sound attenuation coefficient is reduced from 69dB / cm to 42dB / cm, and the sound attenuation performance of the material has been reduced to the requirement that it is not suitable for the backing
In addition, when the volume percentage of tungsten powder of No. 3 material reaches 31.9%, the molten epoxy system is already very viscous. If the volume percentage of tungsten powder continues to increase, the system is difficult to mix evenly
If a higher impedance backing is to be obtained, and the sound attenuation coefficient is above 80dB / cm, the method of mixing tungsten powder with molten epoxy resin in the prior art is obviously not acceptable

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Method for manufacturing backing material for ultrasonic detection probe

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] The backing material used for the ultrasonic detection probe described in this embodiment is composed of tungsten powder and thermoplastic polyurethane, wherein the tungsten powder accounts for 71.6% by volume of the backing material, and the tungsten powder adopts the particle size produced by Zhuzhou Cemented Carbide Factory. 5μm tungsten powder with a density of 19g / cm 3 ; The thermoplastic polyurethane adopts the product of Shantou Ocean Polyester Company, the grade is 5702, and the density is 1.2g / cm 3 , and the formula is shown in Table 2.

[0033] The formula of the backing material of table 2 embodiment 1

[0034] Backing number

Tungsten powder(g)

Volume content (%)

Polyurethane (g)

No 4

550

71.6

13.75

[0035] The backing material is made by the following steps: first pour 200ml of tetrahydrofuran into an enamel cup, and then put 13.75g of polyurethane into the tetrahydrofuran. Place the enamel cup in a...

Embodiment 2

[0043] The backing material used for the ultrasonic detection probe described in this embodiment is composed of tungsten powder and thermoplastic polyvinyl chloride, wherein the tungsten powder accounts for 32% by volume of the backing material, and the tungsten powder is produced by Zhuzhou Cemented Carbide Factory Tungsten powder with a particle size of 5μm and a density of 19g / cm 3 ; The grade of thermoplastic polyvinyl chloride is PVCS-1300, and the density is 1.4g / cm 3 , and the formula is shown in Table 5.

[0044] The formula of the backing material of table 5 embodiment 2

[0045] Backing number

Tungsten powder(g)

Volume content (%)

PVC (g)

Number 5

550

32

86.13

[0046] The backing material is made by the following steps: first pour 300ml of tetrahydrofuran into an enamel cup, and then put 86.13g of polyvinyl chloride into the tetrahydrofuran. Place the enamel cup in an oven at 40°C overnight to completely disso...

Embodiment 3

[0051] The backing material for the ultrasonic detection probe described in this embodiment is composed of tungsten powder and thermoplastic polyamide, wherein the tungsten powder accounts for 50% by volume of the backing material, and the tungsten powder adopts the particle size produced by Zhuzhou Cemented Carbide Factory 5μm tungsten powder with a density of 19g / cm 3 ;The thermoplastic polyamide with brand name LR-PA-110 of Shanghai Liri Chemical New Material Co., Ltd. is used, with a density of 1.11g / cm 3 , and the formula is shown in Table 7.

[0052] The formula of the backing material of table 7 embodiment 3

[0053] Backing number

[0054] The backing material is made by the following steps: first pour 250ml of tetrahydrofuran into an enamel cup, and then put 32.13g of polyamide into tetrahydrofuran. Place the enamel cup in an oven at 40°C overnight to completely dissolve the polyamide in tetrahydrofuran. Then put 550g of tungsten powder into the solution,...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
particle sizeaaaaaaaaaa
densityaaaaaaaaaa
densityaaaaaaaaaa
Login to view more

Abstract

The invention discloses a backing material for ultrasonic detection probe and manufacturing method thereof, wherein the material comprises tungsten powder and soft thermoplastic resin, the percentage by volume of tungsten powder in the backing material is 32-95%, its preparing method comprises the steps of, (1) dissolving the soft thermoplastic resin into right amount of organic solvent, (2) charging tungsten powder into the solution, (3) stirring and heating the obtained colloidal solution so as to remove the organic solvent through evaporation, thus obtaining composite particles through resin deposition on the surface of the tungsten powder particles, (4) loading the composite particles into die assembly, then heating the resin to glass transition temperature and press forming with hydrostatic machine.

Description

technical field [0001] The invention relates to a method for manufacturing a backing material for an ultrasonic detection probe. Background technique [0002] The backing material of the ultrasonic probe used for industrial non-destructive testing must first have sufficient acoustic attenuation performance to absorb the sound waves emitted by the piezoelectric ceramic sheet. The sound attenuation coefficient must be above 80dB / cm. If the sound attenuation performance is insufficient, it will The generation of back clutter affects the detection; secondly, in order to improve the resolution and detect subtle defects, the ultrasonic probe needs to use a backing material with a high acoustic impedance rate. The value of the acoustic resistivity of a material is the product of the material density and the sound velocity, and the formula is Z=ρc. It can be seen from the formula that the acoustic impedance is proportional to the material density. When the sound velocity does not c...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Patents(China)
IPC IPC(8): G01N29/24G01N29/22H01L41/18H04R17/00G01N29/04
Inventor 吴锦川蔡恒辉
Owner SHANTOU INST OF UITRASONIC INSTR CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap