Method for making magnetosensitive device based on soft magnetic multilayer huge magnetoimpedance effect
A technology of giant magneto-impedance and manufacturing method, applied in the field of sensors, can solve the problems of wire and thin strip welding, easily broken wire and thin strip, difficult installation, etc., and achieve the effects of linearization, improved magnetic field sensitivity and low cost
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Publication Date
- 2008-11-05
- Estimated Expiration
- Not applicable · inactive patent
Abstract
Description
Technical field
[0001] The invention relates to a manufacturing method of a magnetic sensitive device, in particular to a manufacturing method of a magnetic sensitive device based on the giant magneto-impedance effect of a soft magnetic multilayer film, and belongs to the technical field of sensors. technical background
[0002] With the rapid development of microelectronics technology, some new, miniaturized, high-performance, high-sensitivity and fast-response new magnetic sensors are needed to monitor the environment in automotive electronics, robotics, bioengineering, and automation control. Surrounding parameters such as: magnetic field, speed, rotation speed, displacement, angle, torque, etc. Magnetic sensors currently being used or developed on the market include Hall effect sensors, anisotropic magnetoresistance (AMR) effect and giant magnetoresistance (GMR) effect sensors. Hall-effect sensor is currently the most widely used magnetic sensor, which can be used for the mea...
Examples
Embodiment Construction
[0030] It will be further described below in conjunction with the embodiments.
[0031] The manufacturing method of the present invention, specifically:
[0032] (1) The photoresist was thrown on both sides of the cleaned and treated double-sided oxidized silicon substrate, the thickness of the photoresist was 5μm, the drying temperature of the photoresist was 95℃, and the time was 1 hour; single-sided (called B side) After exposure and development, use BHF etching solution to etch silicon dioxide at an etching temperature of 40°C, and then remove the photoresist;
[0033] (2) The magnetic sensor development process is carried out on the other side of the silicon wafer (referred to as A side), and the following are all carried out on the A side;
[0034] (3) Sputtering soft magnetic film F, F is FeCuNbSiB, FeCuNbCrSiB film, the thickness of the film is 2-6μm;
[0035] (4) Sputtering Cu bottom layer, the thickness is 100~200nm;
[0036] (5) Positive photoresist, the thickness of th...