A method of electronic shell package for preparing SiC particle reinforced composite material by using a semi-solid-state technology

An electronic packaging and particle reinforcement technology, which is applied in the field of preparing SiC particle reinforced composite electronic packaging shell technology, can solve the problems of long processing routes and high production costs, and achieve the effects of reducing energy consumption, improving product quality, and expanding application fields

Inactive Publication Date: 2009-03-04
UNIV OF SCI & TECH BEIJING
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0010] The purpose of the present invention is to provide a process for preparing SiC particle-reinforced composite electronic packaging shells with semi-solid technology, which overcomes the long processing route and high production cost of preparing high SiC volume fraction composite electronic packaging shells by powder metallurgy. Problem, using the characteristics of liquid phase and solid phase segregation and separation in semi-solid extrusion forming, to prepare and process high-performance thin-walled and complex-shaped SiC metal matrix composite electronic packaging shells

Method used

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  • A method of electronic shell package for preparing SiC particle reinforced composite material by using a semi-solid-state technology

Examples

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Effect test

Embodiment 1

[0027] Example 1: A semi-solid thixotropic extrusion molding method was used to prepare SiC particle-reinforced A356 aluminum alloy composite electronic packaging shell parts.

[0028] SiC particle (20% volume fraction) reinforced A356 aluminum alloy composite material with a diameter of φ56mm was purchased from Duralcan company (Duralcan company). After distance cutting, the billet is firstly heated rapidly and uniformly to the semi-solid temperature: 580°C with an induction heating furnace. Designing a mold for back-extruding a cup-shaped piece, and processing a forming cavity for an electronic package housing in the horizontal direction at the bottom edge of the die cavity. The heated semi-solid billet is quickly put into the die of the extrusion die with a clamp (the preheating temperature of the die is set to 200° C.). The extrusion speed of the press is adjusted to 120mm / s, a graphite release agent is used, the forming pressure is set to 600KN, and the holding time is s...

Embodiment 2

[0029] Example 2: SiC particles reinforced A356 aluminum alloy composite material electronic package casing parts were prepared by semi-solid rheological extrusion molding method.

[0030] After drying the bulk base metal aluminum alloy A356 at 100°C, it was heated and melted in a resistance furnace. The melting temperature was set at 640° C., and the alloy was kept for 30 minutes after it was completely melted. Add fine SiC particles with a volume fraction of 25% to the alloy liquid after heat preservation and standing. In order to prevent the aggregation of SiC particles, it should be added gradually in several times during the adding process, and sprinkled on the surface of the molten metal, stirring evenly while adding, and controlling the cooling to a semi-solid temperature of 579°C. Designing a mold for back-extruding a cup-shaped piece, and processing a forming cavity for an electronic package housing in the horizontal direction at the bottom edge of the die cavity. T...

Embodiment 3

[0031] Example 3: SiC particle-reinforced brass alloy CuZn31Al2 composite material electronic package shell parts were prepared by semi-solid rheological extrusion molding method.

[0032] After the bulk matrix metal brass alloy CuZn31Al2 is dried at 100°C, it is heated and melted in a resistance furnace. The melting temperature was set at 970°C, and the alloy was kept for 30 minutes after it was completely melted. Add fine SiC particles with a volume fraction of 26% to the alloy liquid after heat preservation and standing. In order to prevent the aggregation of SiC particles, it should be added gradually in several times during the adding process, and sprinkled on the surface of the molten metal, stirring evenly while adding, and controlling the cooling to a semi-solid temperature of 960°C. Designing a mold for back-extruding a cup-shaped piece, and processing a forming cavity for an electronic package housing in the horizontal direction at the bottom edge of the die cavity....

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Abstract

The present invention relates to a technological process for preparing SiC granules reinforced composite material electronic packaging shell body by utilizing semi-solid process. Said technological process includes the following steps: making block-like matrix metal alloy undergo the process of heat treatment at 80deg.C-120deg.C, in a resistance furnace heating said metal alloy and making it be molten, after the metal alloy is completely molten, heat-insulating and standing still for 20-30 min, then adding SiC granules whose volume percentage content is 10%-30% into the alloy liquor under the condition of uniformly stirring, at the same time controlling cooling temperature to semi-solid temperature zone so as to obtain granules rein forced composite material semi-solid slurry material, designing forming cavity of electronic packaging shell body, and press forming so as to obtain the invented product.

Description

technical field [0001] The invention belongs to the technical field of electronic packaging, and in particular provides a process for preparing SiC particle-reinforced composite material electronic packaging shells by semi-solid technology. Background technique [0002] With the advancement of modern science and technology, the requirements for material science and engineering technology are increasing day by day. The development of new high-performance composite materials and their advanced processing technology has become an urgent problem for high-tech enterprises to solve. This phenomenon is more reflected in the field of electronic packaging. obvious. The rapid development of aerospace and electronic communication requires electronic components to have higher integration, faster operation speed and larger capacity, which makes the complexity and density of components in electronic devices and electronic devices increase day by day. It will inevitably lead to an increas...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B22D18/02B21C23/02C22C1/10
Inventor 王开坤
Owner UNIV OF SCI & TECH BEIJING
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