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Semi-conducting material thermoelectricity performance test system

A technology of thermoelectric performance and testing system, applied in the direction of single semiconductor device testing, semiconductor/solid-state device testing/measurement, material thermal development, etc., can solve the problems of inability to test Seebeck coefficient and electrical conductivity, etc., achieving convenient operation and wide application range , the effect of strong adaptability

Inactive Publication Date: 2008-02-13
HARBIN INST OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The present invention provides a semiconductor material thermoelectric performance testing system to solve the problem that the existing thermoelectric performance testing device cannot test the Seebeck coefficient and electrical conductivity

Method used

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  • Semi-conducting material thermoelectricity performance test system
  • Semi-conducting material thermoelectricity performance test system
  • Semi-conducting material thermoelectricity performance test system

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Experimental program
Comparison scheme
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specific Embodiment approach 1

[0006] Specific embodiment 1: Referring to Fig. 1 and Fig. 2, this embodiment consists of a heating furnace 1, a connecting pipe 2, a No. 1 four-hole lead pipe 3, a positive current lead 4-1, a negative current lead 4-2, and a positive voltage lead 5 -1. Voltage negative lead wire 5-2, No. 2 four-hole lead tube 6, heating resistance wire 7, hot end thermocouple 8, cold end thermocouple 9, No. 1 measuring instrument 10 and No. 2 measuring instrument 11, connecting tube One end of 2 is connected to the heating furnace 1, the No. 1 four-hole lead tube 3 and the No. 2 four-hole lead tube 6 pass through the connecting tube 2 and extend into the heating furnace 1, the current positive lead 4-1, the current negative lead 4-2. Both the voltage positive lead wire 5-1 and the voltage negative lead wire 5-2 are set in the No. 1 four-hole lead tube 3, and the hot-end thermocouple 8 and the cold-end thermocouple 9 are set in the No. 2 four-hole lead tube 6 Inside, the No. 2 four-hole lead ...

specific Embodiment approach 2

[0007] Specific embodiment two: referring to Fig. 1, Fig. 2, present embodiment has increased PC machine 12 on the basis of specific embodiment one, the signal transmission end of No. 1 measuring instrument 10, the signal transmitting end of No. 2 measuring instrument 11 are respectively connected with The first signal transmission end of the PC 12 is connected to the second signal transmission end. According to the calculation formula of conductivity and Seebeck coefficient, the automatic measurement program is compiled and stored in PC 12, and the program is automatically recorded by PC 12, and the conductivity and Seebeck coefficient values ​​are calculated according to the formula, and the obtained results can be intuitively displayed on the display of PC 12 superior. Other compositions and connections are the same as in the first embodiment.

specific Embodiment approach 3

[0008] Specific embodiment three: referring to Fig. 1, Fig. 2, present embodiment has increased protective atmosphere bottle 13, scrubber bottle 14 and air guide tube 15 on the basis of specific embodiment one, and air guide tube 15 is arranged in connecting pipe 2, guides The gas outlet of gas pipe 15 is communicated with heating furnace 1, and the gas inlet of air guide pipe 15 is connected with the gas outlet of gas washing bottle 14, and the gas inlet of gas washing bottle 14 is connected with the gas outlet of protective atmosphere bottle 13. The protective atmosphere in the protective atmosphere bottle 13 is filled into the heating furnace 1 through the gas washing bottle 14, which can prevent the high-temperature oxidation of the sample to be tested, and the filled protective atmosphere can be selected from argon. Other compositions and connections are the same as in the first embodiment.

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Abstract

A thermoelectric performance testing system of semiconductor materials relates to a device for testing the electrical performance and thermoelectric performance of semiconductor materials, so as to solve the problem of the prior thermoelectric performance testing system unable to test Seebeck coefficient and conductivity. A connecting tube of the invention is connected with a heating furnace; a first quadripuntal lead bushing and a second quadripuntal lead bushing both penetrate the connecting tube and extend into the heating furnace; a current anode lead, a current cathode lead, a pressure anode lead and a pressure cathode lead are all arranged in the first quadripuntal lead bushing; a hot-end thermocouple and a cold-end thermocouple are both arranged in the second quadripuntal lead bushing; the second quadripuntal lead bushing is provided with an object slot; a heating resistance wire is wound on the central part of the second quadripuntal lead bushing arranged in the heating furnace; the current anode lead and the current cathode lead are connected with a first measuring device; the pressure anode lead and the pressure cathode lead are connected with a second measuring device; and the hot-end thermocouple and the cold-end thermo-couple are both connected with the second measuring device.

Description

technical field [0001] The invention relates to a device for testing the electrical properties and thermoelectric properties of semiconductor materials, belonging to the fields of applied electronic technology and thermal engineering technology. Background technique [0002] The thermoelectric effect means that when there is a temperature difference between the two ends of the thermoelectric material sample, a voltage will be generated at both ends of the sample. Thermoelectric power generation is an energy conversion scheme based on the thermoelectric effect, which statically converts thermal energy and electrical energy through the movement of carriers. Temperature difference power generation has no pollution, no noise, stable performance, and long life. Whether it is used as a power source for power generation or as a refrigerator for refrigeration, it has advantages that other methods do not have. It is used in computer technology, aerospace technology, superconducting t...

Claims

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Application Information

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IPC IPC(8): G01R31/26G01R31/28H01L21/66G01K7/02G01N25/20G01R27/02
Inventor 陈刚裴健周楠刘璞生陆冬青
Owner HARBIN INST OF TECH
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