Semi-conducting material thermoelectricity performance test system

A technology of thermoelectric performance and testing system, applied in the direction of single semiconductor device testing, semiconductor/solid-state device testing/measurement, material thermal development, etc., can solve the problems of inability to test Seebeck coefficient and electrical conductivity, etc., achieving convenient operation and wide application range , the effect of strong adaptability

Inactive Publication Date: 2008-02-13
HARBIN INST OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] The present invention provides a semiconductor material thermoelectric performance testing system to solve the proble

Method used

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  • Semi-conducting material thermoelectricity performance test system
  • Semi-conducting material thermoelectricity performance test system
  • Semi-conducting material thermoelectricity performance test system

Examples

Experimental program
Comparison scheme
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Example Embodiment

[0006] Specific embodiment 1: Refer to Figure 1 and Figure 2. This embodiment consists of heating furnace 1, connecting tube 2, No. 1 four-hole lead tube 3, current positive lead 4-1, current negative lead 4-2, voltage positive lead 5. -1. Voltage negative lead 5-2, No. 2 four-hole lead tube 6, heating resistance wire 7, hot-end thermocouple 8, cold-end thermocouple 9, No. 1 measuring instrument 10 and No. 2 measuring instrument 11, connecting tube One end of 2 is connected to the heating furnace 1. The first four-hole lead tube 3 and the second four-hole lead tube 6 both pass through the connecting tube 2 and extend into the heating furnace 1. Current positive lead 4-1, current negative lead 4-2. The voltage positive lead 5-1 and the voltage negative lead 5-2 are both set in the No. 1 four-hole lead tube 3. The hot-end thermocouple 8 and the cold-end thermocouple 9 are both set in the No. 2 four-hole lead tube 6. Inside, the second four-hole lead tube 6 is provided with a loading...

Example Embodiment

[0007] Specific embodiment two: referring to Fig. 1 and Fig. 2, this embodiment adds a PC 12 on the basis of specific embodiment 1. The signal transmission terminal of the first measuring instrument 10 and the signal transmission terminal of the second measuring instrument 11 are respectively connected with The first signal transmission terminal of the PC 12 is connected to the second signal transmission terminal. According to the calculation formula of conductivity and Seebeck coefficient, an automatic measurement program is compiled and stored in the PC 12. The PC 12 automatically records the program, and calculates the conductivity and Seebeck coefficient values ​​according to the formula. The result can be displayed directly on the display of the PC 12. on. The other composition and connection relationship are the same as in the first embodiment.

Example Embodiment

[0008] Specific embodiment three: referring to Figure 1 and Figure 2, this embodiment adds a protective atmosphere bottle 13, a gas scrubber 14 and an air duct 15 on the basis of the first embodiment. The air duct 15 is arranged in the connecting pipe 2 and the guide The air outlet of the air pipe 15 is connected with the heating furnace 1, the air inlet of the air duct 15 is connected with the air outlet of the gas scrubber 14, and the air inlet of the scrubber 14 is connected with the air outlet of the protective atmosphere bottle 13. The protective atmosphere in the protective atmosphere bottle 13 is charged into the heating furnace 1 through the gas scrubber 14 to prevent high-temperature oxidation of the sample to be tested. The protective atmosphere can be argon. The other composition and connection relationship are the same as in the first embodiment.

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Abstract

A thermoelectric performance testing system of semiconductor materials relates to a device for testing the electrical performance and thermoelectric performance of semiconductor materials, so as to solve the problem of the prior thermoelectric performance testing system unable to test Seebeck coefficient and conductivity. A connecting tube of the invention is connected with a heating furnace; a first quadripuntal lead bushing and a second quadripuntal lead bushing both penetrate the connecting tube and extend into the heating furnace; a current anode lead, a current cathode lead, a pressure anode lead and a pressure cathode lead are all arranged in the first quadripuntal lead bushing; a hot-end thermocouple and a cold-end thermocouple are both arranged in the second quadripuntal lead bushing; the second quadripuntal lead bushing is provided with an object slot; a heating resistance wire is wound on the central part of the second quadripuntal lead bushing arranged in the heating furnace; the current anode lead and the current cathode lead are connected with a first measuring device; the pressure anode lead and the pressure cathode lead are connected with a second measuring device; and the hot-end thermocouple and the cold-end thermo-couple are both connected with the second measuring device.

Description

technical field [0001] The invention relates to a device for testing the electrical properties and thermoelectric properties of semiconductor materials, belonging to the fields of applied electronic technology and thermal engineering technology. Background technique [0002] The thermoelectric effect means that when there is a temperature difference between the two ends of the thermoelectric material sample, a voltage will be generated at both ends of the sample. Thermoelectric power generation is an energy conversion scheme based on the thermoelectric effect, which statically converts thermal energy and electrical energy through the movement of carriers. Temperature difference power generation has no pollution, no noise, stable performance, and long life. Whether it is used as a power source for power generation or as a refrigerator for refrigeration, it has advantages that other methods do not have. It is used in computer technology, aerospace technology, superconducting t...

Claims

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Application Information

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IPC IPC(8): G01R31/26G01R31/28H01L21/66G01K7/02G01N25/20G01R27/02
Inventor 陈刚裴健周楠刘璞生陆冬青
Owner HARBIN INST OF TECH
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