Method for making lead and tin alloy protruding point
A production method and lead-tin technology, which are applied in semiconductor/solid-state device manufacturing, electrical components, and electrical solid-state devices, etc., can solve the problems of slow plating rate, long production cycle, and increased labor cost, avoiding bubbles, The effect of improving welding performance and saving costs
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[0043] Aiming at the manufacturing method of the lead-tin alloy bump adopted in the present invention, a detailed description will be given below in conjunction with the accompanying drawings and embodiments.
[0044]In the prior art, materials such as titanium, titanium-tungsten alloy, copper, and nickel are usually selected as the under-bump metal material in the solder bump process, and metal nickel is more commonly used when depositing lead-tin alloy bumps by electroplating.
[0045] When adopting lead-tin alloy as bump solder, and adopting the method for electroplating to deposit lead-tin alloy bump, usually adopt the electroplating solution of methanesulfonic acid system, lead ion concentration (Pb 2+ ) is 40 to 60g / L, tin ions (Sn 2+ ) concentration is 5 to 10g / L, methanesulfonic acid is used as the complexing agent in the solution, and the concentration is 200 to 300g / L. When electroplating lead-tin alloy solder, the current density is 3A / dm 2 up to 10A / dm 2 , the r...
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