Indium oxide/zinc oxide/magnesium oxide sputtering target and transparent conductive film
A transparent conductive film and sputtering target technology, which is applied in the direction of oxide conductors, sputtering plating, circuits, etc., can solve the problems of difficult sputtering, low conductivity of sputtering targets, and low etchability
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Embodiment 1
[0064] Target 1
[0065] In the average particle size of 1 μm or less 2 o 3 Powder, ZnO powder with an average particle size of 1 μm or less, and MgO powder with an average particle size of 1 μm or less were weighed and mixed in a predetermined ratio, then put into a resin pot, and water was added to conduct a test using hard ZrO. 2 The balls are mixed in a wet ball mill. At this time, the mixing time was set to 20 hours. By this mixing, the obtained mixed slurry was taken out, filtered, dried and granulated. The resulting granulate was put into a forming die and applied 3 ton / cm in a cold isostatic press 2 Formed under high pressure to obtain a molded body.
[0066] Then, the obtained molded body was sintered as shown below. First, in the sintering furnace, place the molded body so that every 0.1m in the sintering furnace 3 Oxygen was inflowed at a rate of 5 l / min. In this atmosphere, the molded body was sintered at 1470° C. for 5 hours. At this time, the temperature...
Embodiment 2
[0082] Target 2
[0083] Except for In with an average particle size of 1 μm or less 2 o 3 powder, ZnO powder with an average particle diameter of 1 μm or less, and MgO powder with an average particle diameter of 1 μm or less in the mixing ratio, the powders were mixed, molded, and sintered by the same method as in Example 1. , a sintered body was obtained. The relative density of the obtained sintered body was obtained by the same method as in Example 1 above. The obtained relative density is shown in FIG. 1 .
[0084] In addition, as in Example 1, the contents of Zn and Mg in the obtained sintered compact were quantitatively analyzed by ICP emission spectrometry, and it was confirmed that the feed composition when mixing the raw material powders was also maintained in the sintered compact. At this time, the values of the specific composition ratios in the sintered body confirmed are shown in FIG. 1 .
[0085] Then, in the same manner as in Example 1, a backing plate w...
Embodiment 3
[0091] Target 3
[0092] Except for In with an average particle size of 1 μm or less 2 o 3 powder, ZnO powder with an average particle diameter of 1 μm or less, and MgO powder with an average particle diameter of 1 μm or less, the powders were mixed and molded in the same manner as in Examples 1 and 2. , and sintered to obtain a sintered body. The relative density of the obtained sintered body was obtained by the same method as in Examples 1 and 2 above. The relative density obtained at this time is shown in FIG. 1 .
[0093] In addition, as in Examples 1 and 2, the contents of Zn and Mg in the obtained sintered body were quantitatively analyzed by ICP emission analysis, and it was confirmed that the feed composition when mixing the raw material powders was also determined in the sintered body. maintain. At this time, the values of the specific composition ratios in the sintered body confirmed are shown in FIG. 1 .
[0094] Then, in the same manner as in Examples 1 and...
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Abstract
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