Processing device and suction plate bench

Abstract

The present invention provides a processing device and a sucking disc worktable for preventing occurrence of the phenomena such as tortuosity of the sucking disc worktable due to temperature variation, fracture or deviation from frames of aspiration maintenance parts, even in case of realization of major diameter of crystal plates and the sucking disc worktable. The aspiration maintenance part (21) of the sucking disc worktable (20) is made of a porous ceramic whose main component is zirconium oxide having coefficient of linear thermal expansion of 9.0x10 <-6> DEG C approximately similar to that (10.4x10 <-6> DEG C) of stainless steel forming the frame body (22). Therefore, problems such as tortuosity of the sucking disc worktable due to temperature variation, fracture or deviation from the frames of the aspiration maintenance parts can be eliminated; in case of realization of major diameter of crystal plates and the sucking disc worktable, even temperature variation exists, precision drop of supine surfaces of the sucking disc worktable can be restrained, and crystal plates can be processed with high accuracy.

Description

technical field [0001] The present invention relates to a processing device for processing a wafer and a chuck table used in the processing device for holding the wafer. Background technique [0002] A wafer formed with multiple devices such as IC (Integrated Circuit: Integrated Circuit) and LSI (Large Scale Integration: Large Scale Integrated Circuit) is divided by dividing predetermined lines, and is divided into individual devices by a cutting device, and used for mobile phones, personal computers, etc. Electronic equipment. [0003] The cutting device has: a chuck table holding the wafer; a cutting unit for cutting the wafer held on the chuck table; a cutting feed unit for cutting and feeding the chuck table and the cutting unit oppositely; The table and the cutting unit are indexed and fed by facing each other. This cutting device can efficiently divide the wafer into individual devices. [0004] Here, in order to reliably cut a wafer, it is necessary to control the c...

AI Technical Summary

Problems solved by technology

[0008] However, the existing sucker workbench is made by using alumina ceramics (the coefficient of linear expansion is 6.0×10 -6 / ° C) formed suction to hold the porous suction holding portion of the wafer, and the surrounding suction holding portion is made of stainless steel (coefficient of linear expansion is 10.4×10 -6 / °C) The frame formed is made of epoxy resin, etc., so due to the difference in the linear expansion coefficient of the suction holding part and the frame, there may be bending of the suction cup table or suction holding due to temperature changes. The part is broken, or the suction holding part is detached from the frame.

In particular, when the diameter of the wafer to be held increases and the diameter of the chuck table increases, the degree of bending of the chuck table due to temperature changes increases, and the cutting accuracy during processing decreases, so high-precision processing cannot be performed. chip

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