Dentistry compound resin material containing telechelic oligomer

Abstract

The invention relates to a dental composite resin material containing telechelic oligomer pertains to the technical field of dental materials for dental repair or reconstruction. The dental composite resin material is composed of telechelic oligomer, methacrylate monomer, initiator, dye and inorganic filler, the trade name of the telechelic oligomer is XMAPt-MM100C, XMAPt-MM110C, XMAPt - RC100C and XMAPt-RC200C. The inorganic filler contains CaO-SiO2-Al2O3-P2O5-F fluorine-based silicate biological ceramic powder. The dental composite resin material of the invention is the dental material which has biological activity and can be light-cured or self-cured; as the telechelic oligomer is added, the using amount of the inorganic filler is increased, the invention has very low volume shrinkage ratio, the volume shrinkage ratio is lower than the similar products by more than 40 percent; and the cost of the materials is also reduced.

Description

Technical field: [0001] The invention relates to a composite resin material containing telechelic oligomers for tooth restoration or reconstruction. Background technique: [0002] In the past few decades, composite materials made of organic resins and inorganic fillers have been more and more widely used in the repair and reconstruction of oral teeth, gradually replacing traditional silver amalgam, gold alloy and other metal alloys. Modern resin composite materials are similar to real teeth in terms of strength, hardness, wear resistance, polishing, color, etc., and the stability and color resistance of the material have been significantly improved. The use of various organic monomers and different filling materials makes composite materials have more functions than metal materials. For example, fluorine release function, photochromic diagnosis function, light transmission and scattering performance similar to real teeth, etc. It can be predicted that due to the comprehens...

AI Technical Summary

Problems solved by technology

Due to many problems such as high water absorption value, toxicity, and poor compatibility with other adhesives, this type of system has not been industrialized.

[0010] 3M has developed a class of epoxy resin monomers, which have lower polymerization shrinkage and polymerization stress, and have been proven to be feasible, but the overall performance still cannot exceed the usual methacrylate composite resin

And require a very high conversion rate, otherwise the performance of the product is poor

[0011] The latest type of new low-shrinkage monomer is (Thio-Ene), but its application is limited due to its toxicity and odor, and it is still in the research and development stage

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