Dentistry compound resin material containing telechelic oligomer

A technology of composite resin and oligomer, which is applied in dentistry, dental preparations, dental prostheses, etc., and can solve problems such as unseen industrialization, toxic odor, low polymerization shrinkage and polymerization stress

Inactive Publication Date: 2008-07-23
吉林省登泰克牙科材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to many problems such as high water absorption value, toxicity, and poor compatibility with other adhesives, this type of system has not been industrialized.
[0010] 3M has developed a class of epoxy resin monomers, which have lower polymerization shrinkage and polymerization stress, and have been proven to be feasible, but the overall

Method used

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  • Dentistry compound resin material containing telechelic oligomer
  • Dentistry compound resin material containing telechelic oligomer

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0063]Telechelic Oligomer I (XMAPt-MM100C) 40%, Monomer A- Tetrahydrofurfuryl Acrylate 10%, Monomer B- Bisphenol A Diglycidyl Dimethacrylate 40%, Monomer C- Trihydroxy Methyl propane trimethacrylate 6%, monomer D-30 (poly)ethoxy bisphenol A dimethacrylate 3%, initiator 1%.

Embodiment 2

[0065] Telechelic oligomer I (XMAPt-MM100C) 40%, monomer A-triethylene glycol dimethacrylate 5%, monomer B-di-2-methacrylic ethyl-2,2, 4-Trimethylhexane (base) diurethane (UDMA) 40%, monomer C-trimethylolpropane trimethacrylate 10%, monomer D-trimethylol (poly)ethoxy Bisphenol A dimethacrylate 4%, initiator 1%.

Embodiment 3

[0067] Telechelic oligomer I (XMAPt-MM100C) 50%, monomer A-triethylene glycol dimethacrylate 20%, monomer B-bisphenol A diglycidyl dimethacrylate 20%, Monomer C-dipentaerythritol pentamethacrylate 5%, monomer D-methoxy polyethylene glycol methacrylate 4%, initiator 1%.

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Abstract

The invention relates to a dental composite resin material containing telechelic oligomer pertains to the technical field of dental materials for dental repair or reconstruction. The dental composite resin material is composed of telechelic oligomer, methacrylate monomer, initiator, dye and inorganic filler, the trade name of the telechelic oligomer is XMAPt-MM100C, XMAPt-MM110C, XMAPt - RC100C and XMAPt-RC200C. The inorganic filler contains CaO-SiO2-Al2O3-P2O5-F fluorine-based silicate biological ceramic powder. The dental composite resin material of the invention is the dental material which has biological activity and can be light-cured or self-cured; as the telechelic oligomer is added, the using amount of the inorganic filler is increased, the invention has very low volume shrinkage ratio, the volume shrinkage ratio is lower than the similar products by more than 40 percent; and the cost of the materials is also reduced.

Description

Technical field: [0001] The invention relates to a composite resin material containing telechelic oligomers for tooth restoration or reconstruction. Background technique: [0002] In the past few decades, composite materials made of organic resins and inorganic fillers have been more and more widely used in the repair and reconstruction of oral teeth, gradually replacing traditional silver amalgam, gold alloy and other metal alloys. Modern resin composite materials are similar to real teeth in terms of strength, hardness, wear resistance, polishing, color, etc., and the stability and color resistance of the material have been significantly improved. The use of various organic monomers and different filling materials makes composite materials have more functions than metal materials. For example, fluorine release function, photochromic diagnosis function, light transmission and scattering performance similar to real teeth, etc. It can be predicted that due to the comprehens...

Claims

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Application Information

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IPC IPC(8): A61K6/083
Inventor 马荣堂闫鹏涛谢起俭
Owner 吉林省登泰克牙科材料有限公司
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