Ultrasonic cyanogen-free fast silver coating method

An ultrasonic electroplating and ultrasonic technology, which is applied in chemical instruments and methods, cleaning methods and utensils, cleaning methods using liquids, etc., can solve the problems of small bright current density range of the plating layer, easy formation of white precipitate on the anode, difficulty in anode dissolution, etc. , to achieve the effect of good wear resistance, strong binding force and simple process

Inactive Publication Date: 2008-08-06
SHANGHAI JIAO TONG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

But there are still the following deficiencies: ①The anode is difficult to dissolve, and the anode is easy to generate white precipitates, which pollute the electroplating solution; ②As the electroplating progresses, the cathode forms a gray passivation film, and the tank pressure rises, which affects the electroplating; ③The bright current of the coating The density range is small, 0.3-1A / dm 2 , and with the extension of electroplating time, the coating tends to turn white

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0013] This embodiment is operated according to the following steps: (1) preparation of composite electroplating solution, (2) ultrasonic degreasing with acetone, (3) pickling to remove oxide film, (4) ultrasonic electroplating. The specific implementation is as follows:

[0014] The parameters of the prepared electroplating solution are: silver methanesulfonate 0.05M / L, succinimide 0.15M / L, boric acid 0.05M / L, pH8.

[0015] Immerse the copper-plated parts in the acetone solution, and degrease them in an ultrasonic cleaning machine for 10 minutes.

[0016] Then the copper plated piece is immersed in the mixed acid to pickle and remove the oxide film, and the composition volume percentage of the mixed acid used is: H 2 SO 4 : 90%, HNO 3 : 5%, HCl: 5%, pickling time is 5 seconds.

[0017] Finally, ultrasonic plating is carried out, the parameters are: current density 1A / dm2, temperature 40°C, ultrasonic frequency 20kHz, ultrasonic power density 5W / cm 2 , the stirring method...

Embodiment 2

[0019] This embodiment is operated according to the following steps: (1) preparation of composite electroplating solution, (2) ultrasonic degreasing with acetone, (3) pickling to remove oxide film, (4) ultrasonic electroplating. The specific implementation is as follows:

[0020] The parameters of the prepared electroplating solution are: silver methanesulfonate 0.15M / L, succinimide 0.75M / L, boric acid 0.15M / L, pH10.

[0021] Immerse the copper-plated parts in the acetone solution, and degrease them in an ultrasonic cleaning machine for 10 minutes.

[0022] Then the copper plated piece is immersed in the mixed acid to pickle and remove the oxide film, and the composition volume percentage of the mixed acid used is: H 2 SO 4 : 80%, HNO 3 : 15%, HCl: 5%, pickling time is 3 seconds.

[0023] Finally, ultrasonic plating is carried out, the parameters are: current density 3A / dm2, temperature 60°C, ultrasonic frequency 30kHz, ultrasonic power density 75W / cm 2 , the stirring met...

Embodiment 3

[0025] This embodiment is operated according to the following steps: (1) preparation of composite electroplating solution, (2) ultrasonic degreasing with acetone, (3) pickling to remove oxide film, (4) ultrasonic electroplating. The specific implementation is as follows:

[0026] The parameters of the prepared electroplating solution are: silver methanesulfonate 0.5M / L, succinimide 1.5M / L, boric acid 0.5M / L, pH10.

[0027] Immerse the copper-plated parts in the acetone solution, and degrease them in an ultrasonic cleaning machine for 10 minutes.

[0028] Then the copper plated piece is immersed in the mixed acid to pickle and remove the oxide film, and the composition volume percentage of the mixed acid used is: H 2 SO 4 : 85%, HNO 3 : 12%, HCl: 3%, pickling time is 7 seconds.

[0029] Finally, ultrasonic plating is carried out, the parameters are: current density 5A / dm2, temperature 80°C, ultrasonic frequency 45kHz, ultrasonic power density 200W / cm 2 , the stirring metho...

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Abstract

An ultraphonic non-cyanide rapid silver plating method belongs to the metal material technology field, which comprises the following steps: preparing compound electrolyte, removing oil by acetone ultraphonic, removing oxydic films by acid pickling, and carrying out ultraphonic electroplating, wherein the electrolyte comprises 0.05-0.5M / L methanesulfonic acid, 0.05-0.5M / L silver nitrate, 0.15-1.5M / L succinimide and 0.1-0.5M / L boric acid, wherein the ultraphonic electroplating has the following parameters: ultrasonic frequency is 20kHz-45kHz, ultrasonic power is 5W / cm2-250W / cm2, range of current density is 0-6A / dm2, temperature is 35-80 DGE C, pH value is 8-11 and electroplating time is10-60min. The method has the advantages of improving the dissolving of the anode white substance by high temperature, eliminating passivating film of the surface of the cathode by the ultraphonic function, enlarging current density, without pre-plating silver or soaking the silver and the method has the advantages of simple technology, safety and poison free, bright mirror face of the obtained silver layer, high hardness and high abradability and a strong binding force with the basal body of the bright silver coating.

Description

technical field [0001] The invention relates to a silver plating process in the technical field of material display coating, in particular to an ultrasonic cyanide-free rapid silver plating method. Background technique [0002] Electroplating silver has always attracted people's attention because of its wide industrial application value. In particular, the development of the electronics industry has an increasing demand for silver for electroplating. The traditional cyanide silver plating solution is extremely toxic, which is not only dangerous to operate, but also causes great harm to the environment. Therefore, cyanide-free silver plating will replace cyanide silver plating. For the field of cyanide-free silver plating, people have successively studied such as thiosulfate silver plating, sulfite silver plating, sulfosalicylic acid silver plating, succinimide silver plating and iminodisulfonate silver plating, etc. Although the cyanide-free electroplating process has achi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D3/46B08B3/12C23G1/02
Inventor 陈哲王浩伟李险峰张亦杰马乃恒
Owner SHANGHAI JIAO TONG UNIV
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