Lithographic equipment aligning system based on machine vision and alignment method

A technology of machine vision and alignment system, which is applied in parts of TV system, photolithography exposure device, microlithography exposure equipment, etc. It can solve the problems of difficulty in obtaining alignment accuracy and low contrast of marking imaging, and achieve high Alignment accuracy, simple effect of the system

Active Publication Date: 2008-08-13
SHANGHAI MICRO ELECTRONICS EQUIP (GRP) CO LTD
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Problems solved by technology

Since the invention uses bright field imaging, the marking imaging contrast is low, and only a set of strip markings with equal spacing is used, which is limited by factors such as CCD lens distortion, manufacturing errors, and marking process deformation. It is difficult to obtain a higher Alignment accuracy

Method used

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  • Lithographic equipment aligning system based on machine vision and alignment method
  • Lithographic equipment aligning system based on machine vision and alignment method
  • Lithographic equipment aligning system based on machine vision and alignment method

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Embodiment Construction

[0056] Combine below Figure 2 ~ Figure 6 , the specific embodiment of the present invention will be further described in detail.

[0057] figure 2 A structural schematic diagram of an embodiment of a machine vision-based lithography device alignment system provided by the present invention, the alignment system realizes the alignment of the wafer and the substrate table, which includes: a wafer 7 or a substrate table 9 Alignment marks, light source module 300, illumination module, imaging module, image acquisition module, image processing module, and position data acquisition and motion control module arranged in sequence; the alignment marks on the wafer or substrate table are arranged on Between the imaging module and the position data acquisition and motion control module;

[0058] The alignment mark is composed of a group of large-period grating branches for coarse alignment and a single small-period grating branch for fine alignment; the group of large-period grating ...

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Abstract

The invention provides a photoeching device alignment system and a method thereof based on machine vision by using grids with different periods as alignment marks. +-1 level diffracted light dark field images are obtained by an optical lighting system and an imaging system. The images are gathered by a CCD camera and an image gathering card, and image signal processing and alignment operation are performed by an image processing module to obtain an accurate alignment position finally and alignment between the wafer and the base stage is implemented. The whole system is simpler by combining Image processing with alignment marked grid phase information in a precondition of obtaining a rather high alignment precision.

Description

technical field [0001] The invention is applied to a photolithography device in the field of integrated circuit or other micro-device manufacturing, and in particular relates to an alignment system and alignment method based on machine vision to realize precise alignment of a wafer and a substrate table. Background technique [0002] The photolithography apparatus in the prior art is mainly used in the manufacture of integrated circuits (IC) or other micro devices. With a photolithographic apparatus, multilayer masks with different mask patterns can be sequentially imaged under precise alignment on a photoresist-coated wafer, such as a semiconductor wafer or an LCD (liquid crystal) panel. Lithography devices are generally divided into two categories, one is stepping lithography devices, the mask pattern is exposed and imaged on one exposure area of ​​the wafer, and then the wafer moves relative to the mask to move the next exposure area to the mask. Underneath the mask patt...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/20G03F9/00G02B6/02G02B27/00G02B5/18H04N5/225
Inventor 李运锋
Owner SHANGHAI MICRO ELECTRONICS EQUIP (GRP) CO LTD
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