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Preparation method of epoxy resin composite material with surface modified spherical SiO2 particles

A surface modification, epoxy resin technology, applied in chemical instruments and methods, other chemical processes, etc., can solve the problems affecting the electrical and mechanical properties of materials, easy water absorption and agglomeration, etc., to achieve excellent mechanical properties, Tg change, Effect of improving thermal stability

Inactive Publication Date: 2008-08-27
JIANGNAN UNIV +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, since the surface of silicon dioxide as a filler is hydrophilic and polar, it is easy to absorb water and agglomerate, filling it into the packaging material will affect the electrical and mechanical properties of the material

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0018] 40 parts by weight of spherical SiO 2 Particles, 10 parts by weight of vinyltriethoxysilane and 5 parts by weight of acid are placed in a reaction kettle in 200 parts by weight of absolute ethanol, and the stirring speed is 1500r / min and the temperature is 60°C. React for 1 hour, and then add 5 parts by weight of glycidyl methacrylate and 0.05 parts by weight of dibenzoyl peroxide initiator to the reactor, and continue at a stirring speed of 300r / min and a temperature of 90°C. React for 3 hours. After the reaction is over, the solution is cooled to room temperature, suction filtered, and dried to prepare surface-modified spherical SiO 2 Particles; with 16 parts by weight of modified silicon dioxide, 84 parts by weight of epoxy resin and 65 parts by weight of epoxy resin curing agent methyltetrahydrophthalic anhydride and 1 part by weight to, right-diaminodiphenyl Mix methane evenly at a stirring speed of 800r / min at room temperature, pump and degas it, pour it into a m...

Embodiment 2

[0020] 40 parts by weight of spherical SiO 2 Particles, 9 parts by weight of γ-chloropropyltrimethoxysilane and 5 parts by weight of acid are placed in a reaction kettle in 200 parts by weight of absolute ethanol, and the stirring speed is 1500r / min, and the temperature is 60°C. Under the conditions of reaction for 1.5 hours, then add 3 parts by weight of glycidyl methacrylate and 0.05 parts by weight of dibenzoyl peroxide initiator to the reaction kettle, and the stirring speed is 300r / min, and the temperature is 90°C. The reaction was continued for 3 hours. After the reaction, the solution was cooled to room temperature, filtered with suction, and dried to prepare surface-modified spherical SiO 2 Particles; with 10 parts by weight of modified silicon dioxide, 90 parts by weight of epoxy resin and 65 parts by weight of epoxy resin curing agent methyltetrahydrophthalic anhydride and 1 part by weight to, right-diaminodiphenyl Methane was mixed evenly at room temperature at a s...

Embodiment 3

[0022] 40 parts by weight of spherical SiO 2 Particles, 11 parts by weight of vinyl tris (β-methoxyethoxy) silane and 5 parts by weight of acid are placed in a reaction kettle in 200 parts by weight of dehydrated alcohol, and at a stirring speed of 1500r / min, the temperature React for 1 hour under the condition of 60°C, then add 4 parts by weight of styrene and 0.08 parts by weight of azobisisobutyronitrile into the reactor, and continue to React for 5 hours. After the reaction is over, the solution is cooled to room temperature, filtered, and dried to prepare surface-modified spherical SiO 2 Particles; with 16 parts by weight of modified silicon dioxide, 84 parts by weight of epoxy resin and 65 parts by weight of epoxy resin curing agent methyltetrahydrophthalic anhydride and 1 part by weight to, right-diaminodiphenyl Mix methane evenly at a stirring speed of 800r / min at room temperature, pump and degas it, pour it into a mold coated with a release agent, and then cure it at...

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Abstract

A preparation process of epoxy resin composite material of surface modified sphere SiO2 particle belongs to the inorganic particle chemical modification and electric appliance encapsulating material field. The process comprises conducting condensation reaction through utilizing silane coupling agent which comprises unsaturated double bond and hydroxyl group on surface of SiO2 under acidic condition, further making unsaturated monomer which is modified to lead in generate free radical copolymerization reaction in situ on the surface of particle under the initiation of free radical initiating agent, preparing modified sphere SiO2 particle whose surface has hydrophobic polymer chain, then dispersing modified sphere SiO2 particle in epoxy resin according to certain proportion, adding stoichiometric curing agent to evenly mix, and preparing epoxy resin composite material which is used as electric appliance encapsulating material. The modified sphere SiO2 particle which is filled in epoxy resin, which can reduce volume shrinking rate in curing process, increase the size ability and heat conductivity property of encapsulating appliances, and significantly increases the mechanical property of epoxy resin composite material.

Description

technical field [0001] A Surface Modified Spherical SiO 2 The invention discloses a method for preparing an epoxy resin composite material of particles, which belongs to the fields of chemical modification of inorganic particles and packaging materials of electronic devices. Surface-modified spherical SiO by filling epoxy resin 2 particles to obtain epoxy resin composites with excellent properties. Using this technology can not only reduce the volume shrinkage during the curing process, but also improve the dimensional stability and thermal conductivity of the cured composite material, due to the modified spherical SiO 2 The affinity between the particles and the epoxy resin is significantly improved, which improves the mechanical properties of the composite material. Background technique [0002] With the development of science and technology, materials with a single property can no longer meet people's needs, and compounding is the development trend of modern materials....

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08K9/04C08K3/36C08K5/09C08K5/18C09K3/10
Inventor 陈明清倪忠斌张明胡颖福田治义水谷继南
Owner JIANGNAN UNIV
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