Method for producing diamond reinforced Cu-matrix compound material by surface metallization and chemical deposition

A copper-based composite material, diamond reinforced technology, applied in metal material coating process, liquid chemical plating, coating and other directions, can solve the problems of large interface thermal resistance, side effects of heat conduction improvement, low interface bonding strength, etc. Good overall performance, strong operability, low thermal expansion effect

Inactive Publication Date: 2008-10-08
TIANJIN UNIV
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Problems solved by technology

At present, the preparation methods of such composite materials mainly adopt high temperature and high pressure method (1420-1470K, 4.5GPa) and infiltration method (squeeze casting method or pressure infiltration method). Poor performance, low interfacial bonding strength, large interfacial thermal resistance
In order to improve the interface bonding, reduce the thermal resistance of the interface, and improve the efficiency of heat conduction, it has been reported that alloy elements that can form strong carbides (Ti, Cr, Mo, etc.) with diamond are added to the matrix copper. This method solves the interface bonding to a certain extent However, due to the introduction of a third element and the formation of carbides, it has a side effect on the improvement of heat conduction, and the formed combination is an island-like combination, not a complete combination, which affects the reinforcement effect and the comprehensive performance of the composite material

Method used

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  • Method for producing diamond reinforced Cu-matrix compound material by surface metallization and chemical deposition
  • Method for producing diamond reinforced Cu-matrix compound material by surface metallization and chemical deposition
  • Method for producing diamond reinforced Cu-matrix compound material by surface metallization and chemical deposition

Examples

Experimental program
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Effect test

example 1

[0029] Pour 10 grams of diamonds with a particle size of 89 to 104 microns into deionized water to make a 100g / L slurry, pour into a mixed acid solution prepared by 150ml of hydrochloric acid and 50ml of nitric acid, and soak for 70 hours; then perform ultrasonic cleaning for 15 minutes , filter out the diamond and wash it to neutral with deionized water, then add the diamond to 1000ml of SnCl with a concentration of 20g / L 2 2H 2 In O solution, sensitize at room temperature for 0.5 hours, filter out the diamond, and wash it with deionized water until neutral; then add 500ml of diamond with a concentration of 0.5g / L PdCl 2 , activated at 70°C, filtered out the diamonds, washed them with deionized water until neutral; finally added 1000ml of Na with a concentration of 40g / L to the diamonds 2 h 2 PO 2 ·H 2 O solution, carry out reduction treatment at normal temperature for 0.5 hours, filter out, wash with deionized water until neutral and set aside.

[0030] Add the followin...

example 2

[0038] Example 2. The processing conditions of the present embodiment are the same as in Example 1, except that the average particle size of the diamond added is changed, and the average particle size of the diamond used is 74-89 μm. The performance of the prepared diamond-reinforced copper-based composite material is: the density is 5.878g / cm 3 , the thermal conductivity is 486W / m·k, and the thermal expansion coefficient is 5.4μm / m·℃.

example 3

[0039] Example 3. The process conditions of the present embodiment are the same as in Example 1, except that the average particle size of the diamond added is changed, and the average particle size of the diamond used is 61-74 μm. The performance of the prepared diamond-reinforced copper-based composite material is: the density is 5.823g / cm 3 , the thermal conductivity is 441W / m·k, and the thermal expansion coefficient is 6.25μm / m·℃.

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Abstract

The invention relates to a method for preparing diamond enhanced copper-based composite material by surface metallization and chemical deposition, which pertains to the preparation technology of copper-based composite materials. The method comprises that: the chemical copper plating treatment is carried out after the pre-treatment of the surface of a diamond, then the chemical deposition method is used for in situ deposition of copper on the copper-plated diamond, and the diamond enhanced copper-based composite material is obtained by initial pressing, sintering and re-pressing treatment. The method has the advantages that: the metallization operation of the surface of the diamond is better, and the process is simple; the invasion of a matrix and an enhanced body in the prepared diamond enhanced copper-based composite material are greatly improved, the composite material is taken as the electronic packaging material, which has great comprehensive performance, wherein, the thermal conductivity is higher than 400W/m.k, the thermal expansion is lower than 7.9 Mum/m.DEG C, and the density can achieve more than 95 percent.

Description

technical field [0001] The invention relates to a method for preparing a diamond-reinforced copper-based composite material by surface metallization and chemical deposition. It belongs to the preparation technology of composite materials. Background technique [0002] At present, the output power of electronic devices in the world is increasing sharply, and the integration level of integrated circuits is getting higher and higher, which leads to increasing requirements on the thermal properties of materials. The thermal performance (thermal conductivity and thermal expansion) of the packaging material can reach a very considerable level according to the design principles of composite materials. It can not only exert the high thermal conductivity and low expansion characteristics of the enhanced phase diamond, but also maintain the good thermal conductivity and electrical conductivity of the matrix copper. . At present, the preparation methods of such composite materials ma...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B22F3/16B22F9/16B22F1/02C23C18/18C23C18/38
Inventor 赵乃勤崔兰王强杜希文师春生
Owner TIANJIN UNIV
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