Process for producing silver-plated copper powder for low-temperature slurry
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- 云南铜业科技发展股份有限公司
- Publication Date
- 2008-10-29
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Figure 1
Abstract
Description
Technical field:
[0001] The invention relates to a preparation method of silver-plated copper powder for low-temperature slurry, which belongs to the technical field of surface treatment. Background technique:
[0002] With the rapid development of the electronics industry and the continuous rise of silver prices, the electronics industry urgently needs a new type of conductive filler that can completely or partially replace silver powder to reduce costs. Silver-plated copper powder, silver-plated nickel powder, silver-plated graphite powder and silver-plated glass microspheres are produced under such a background. Since the price of copper is less than 1 / 50 of the price of silver, and its electrical conductivity is equivalent to that of silver, it is better than nickel, graphite and glass. Therefore, the silver-plated copper powder made of copper as the base material has a very high cost performance; at the same time , evenly plating a layer of silver on the surface of cop...