Process for producing silver-plated copper powder for low-temperature slurry

A technology of silver-plated copper powder and slurry, which is applied in liquid chemical plating, metal material coating process, coating, etc., can solve the problems of low cumulative formation constant and unsuitable comprehensive performance of silver-plated copper powder, etc., and achieve replacement Effects of Reaction Rate Reduction, Excellent Electrical Conductivity, and Antioxidant Performance
CN101294281AActive Publication Date: 2008-10-29云南铜业科技发展股份有限公司 +1

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
云南铜业科技发展股份有限公司
Publication Date
2008-10-29

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Abstract

The invention relates to a method for preparing silver-coated copper powder used for low-temperature paste, which belongs to the technology field of surface treatment. The method comprises the following steps: copper powder balls are ground to D50, namely 10 to 20 micron, oxidizing layers are removed through acid washing, then deionized water is used to ensure the copper powder to be washed to be neutral, water and dispersant are added for even stirring, acidic silver-contained solution is added in the copper powder paste so that cyanide-free chemical silvering reaction is performed, and after the reaction is completed, the silver-coated copper powder product provided with 20 to 45 percent of silver content and used for low-temperature paste can be obtained through cleaning, surface modification, drying and sieving treatment. The method has the advantages of high silvering efficiency, even coating, simple process and low production cost. The electric volume resistivity of the silver-coated copper powder prepared by the method is 2 to 3*10-4 omega cm, and the silver-coated copper powder can be partly or fully replace the pure silver powder in the low-temperature electronic paste field.
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Description

Technical field:

[0001] The invention relates to a preparation method of silver-plated copper powder for low-temperature slurry, which belongs to the technical field of surface treatment. Background technique:

[0002] With the rapid development of the electronics industry and the continuous rise of silver prices, the electronics industry urgently needs a new type of conductive filler that can completely or partially replace silver powder to reduce costs. Silver-plated copper powder, silver-plated nickel powder, silver-plated graphite powder and silver-plated glass microspheres are produced under such a background. Since the price of copper is less than 1 / 50 of the price of silver, and its electrical conductivity is equivalent to that of silver, it is better than nickel, graphite and glass. Therefore, the silver-plated copper powder made of copper as the base material has a very high cost performance; at the same time , evenly plating a layer of silver on the surface of cop...

Claims

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