Low-power consumption double module integrated humidity sensitive chip with heating function and its manufacture method

A technology that integrates humidity and sensitive chips. It is used in the manufacture of microstructure devices, semiconductor/solid-state device manufacturing, decorative arts, etc. It can solve the problem that it is difficult to make heating resistors directly below the capacitors, humidity sensors do not have heating functions, and semiconductor processes are incompatible, etc. problems, to reduce the impact of rain and solar radiation, improve reliability and stability, and solve the effect of large heating power consumption

Inactive Publication Date: 2008-11-19
NO 49 INST CHINESE ELECTRONICS SCI & TECH GRP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Most of the existing humidity sensors do not have a heating function, and a few humidity sensors with an integrated heating function are mainly based on glass materials and platinum resistance films as heaters. The technology used is not compatible with semiconductor technology, and the heating resistance is not easy. It is made directly under the capacitor, and when it is necessary to quickly measure the humidity in an environment with rapid humidity changes, two sensors are required to be used at the same time, one for working test, and the other for heating and dehumidification, which requires a large heating power, and the two sensors are Discrete assembly, complex assembly and testing

Method used

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  • Low-power consumption double module integrated humidity sensitive chip with heating function and its manufacture method

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specific Embodiment approach 1

[0016] Embodiment 1: The structure of the low power consumption dual-module integrated humidity sensitive chip with heating function described in this embodiment is as follows: there is a thermal isolation through groove 12 on the symmetry axis of the sensor structure substrate 5, and the sensor structure substrate There are two humidity sensor modules on the upper surface of 5. The two humidity sensor modules have the same structure and are symmetrically arranged with the heat isolation through groove 12 as the axis. Each humidity sensor module is the first from bottom to top. The oxide insulating layer 4, the first silicon nitride insulating layer 11, the insulating passivation layer 9, the humidity sensitive medium layer 2 and the porous capacitor upper plate 1, the heating resistor 8 is located on the first oxide insulating layer 4 and the sensor structure substrate 5, the capacitor lower plate 10 is located between the first silicon nitride insulating layer 11 and the insu...

specific Embodiment approach 2

[0032] Embodiment 2. The difference between this embodiment and the dual-module integrated humidity sensitive chip with heating function and low power consumption described in Embodiment 1 is that there are also silicon cups 5-2 and silicon cups on the bottom surface of the microstructure substrate 5. Peripheral fixation.

[0033] In this embodiment, the silicon cup 5-2 added on the bottom surface of the sensor microstructure substrate 5 and the fixed support structure around the silicon cup can not only make small-sized chips, but also reduce heat loss and improve the dehumidification efficiency of the heating resistor used for thermal purification. .

[0034] The lower surface of the peripheral fixed support of the silicon cup described in this embodiment is covered with a second insulating oxide layer 6 and a second insulating silicon nitride layer 7 in sequence, the second insulating oxide layer 6 is a silicon dioxide film, and the The thickness of the second oxide insula...

specific Embodiment approach 3

[0035]Specific implementation mode three: The manufacturing method of the dual-module integrated humidity-sensitive chip with heating function and low power consumption described in this implementation mode is as follows:

[0036] Step 1: Carry out oxidation, coating and anisotropic etching on the monocrystalline silicon wafer to obtain the sensor structure substrate 5;

[0037] Step 2, making two heating resistors 8 on the upper surface of the sensor structure substrate 5, the two heating resistors 8 are symmetrical to the symmetry axis 100 of the sensor structure substrate 5;

[0038] Step 3, making a humidity sensitive capacitor right above the two heating resistors 8;

[0039] Step 4: Fabricate thermal isolation through-slots 12 on the symmetry axis 100 of the monocrystalline silicon thin-film silicon wafer through MEMS micromachining technology, so that the two heating resistors 8 are symmetrically located on both sides of the thermal isolation through-slots 12 .

[0040...

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Abstract

Disclosed is a dual module integrated humidity sensitive chip with heating function and low power consumption as well as a making method thereof, relating to a sensor chip and a making method. The chip and method improve the applicability to environment with fast changing of temperature and humidity of a humidity sensor having the integrated heating function and reduce the power consumption when heating, and the invention provides the dual module integrated humidity sensitive chip with heating function and low power consumption as well as the making method by adopting a mono-crystalline silicon material as a substrate and combining the semiconductor technique and the micro-machining technique. Two humidity sensor modules having the same structure are symmetrically arranged at both sides of a thermal isolation through groove on a symmetric axis of the sensor structured substrate, the bottom parts of the humidity sensor modules are provided with a heating resistor on which a humidity sensitive capacitor is arranged, and the two ends of the heating resistor, and a porous capacitance upper polar plate and a capacitance lower polar plate of the humidity sensitive capacitor are respectively led out by an electrode. The sensor chip of the invention has advantages of good reliability and stability, small volume, low cost and convenient processing in batches, and can be applied to the making of various humidity sensors.

Description

technical field [0001] The invention relates to a structure and a manufacturing method of a sensor, in particular to a semiconductor and micromachining method of a humidity sensor with a heating function. Background technique [0002] Most of the existing humidity sensors do not have a heating function, and a few humidity sensors with an integrated heating function are mainly based on glass materials and platinum resistance films as heaters. The technology used is not compatible with semiconductor technology, and the heating resistance is not easy. It is made directly under the capacitor, and when it is necessary to quickly measure the humidity in an environment with rapid humidity changes, two sensors are required to be used at the same time, one for working test, and the other for heating and dehumidification, which requires a large heating power, and the two sensors are Discrete assembly, assembly and testing are more complex. Contents of the invention [0003] In orde...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01N27/22H01L21/00B81C1/00
Inventor 金建东于海超田雷王平齐虹郑丽司良有王震王永刚尹延昭
Owner NO 49 INST CHINESE ELECTRONICS SCI & TECH GRP
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