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Palladium complex and catalyst-imparting treatment solution using the same

A technology of palladium complexes and catalysts, applied in physical/chemical process catalysts, metal/metal oxide/metal hydroxide catalysts, catalyst activation/preparation, etc., can solve the problems of lack of selective adsorption

Inactive Publication Date: 2008-12-17
EBARA-UDYLITE CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] However, in the above-mentioned method, palladium chloride, which is usually used as a catalyst metal for electroless plating, is also adsorbed to parts other than carboxyl groups, and there is a problem of lack of selective adsorption. Therefore, it is necessary to develop a technology that enables the catalyst metal to selectively adsorb on anionic groups such as carboxyl groups to implement electroless plating.

Method used

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  • Palladium complex and catalyst-imparting treatment solution using the same
  • Palladium complex and catalyst-imparting treatment solution using the same
  • Palladium complex and catalyst-imparting treatment solution using the same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0057] Synthesis of palladium complex (I):

[0058] (1) Palladium-double lysine complex ([Pd(Lys) 2 ] 2+ ):

[0059] Palladium chloride (manufactured by Toyo Chemical Industry Co., Ltd., special grade) 0.21 g and L-lysine hydrochloride (manufactured by Wako Pure Chemical Industries, Ltd., special grade) 0.52 g were added to 500 mL of pure water, and potassium hydroxide (Wako Junyaku Co., Ltd., special grade) was adjusted to pH = 6.0, and stirred at 70°C for 1 hour to obtain a catalyst-imparting treatment liquid of 250 mg / L in terms of metal palladium.

[0060] (2) Palladium-double arginine complex ([Pd(Arg) 2 ] 2+ ):

[0061] Palladium chloride (manufactured by Toyo Chemical Industry Co., Ltd., special grade) 0.21 g and L-arginine hydrochloride (manufactured by Wako Pure Chemical Industries, Ltd., special grade) 0.59 g were added to 500 mL of pure water, and potassium hydroxide (Wako Junyaku Co., Ltd., special grade) was adjusted to pH = 6.0, and stirred at 70°C for 1 ho...

Embodiment 2

[0074] The structure of the palladium-amino acid complex:

[0075] Generally known [Pd(Ala) 2 ] has a planar four-coordination structure in which both the amino group and the carboxyl group are coordinated to form a 5-membered ring chelate-coordinated as shown below.

[0076] [chemical 6]

[0077]

[0078] For [Pd(Lys) 2 ] 2+ , [Pd(Ser) 2 ] and [Pd(Glu) 2 ] 2- These three palladium-amino acid complexes are believed to have amino, hydroxyl, and carboxyl groups on the side chains of amino acids as ligands, and the functional groups on these side chains may coordinate with palladium. Therefore, in order to confirm these functional groups Whether it is coordinated with palladium or in a free state, various palladium complexes were determined by ultraviolet-visible absorption spectrum. UV-2500PC (manufactured by Shimadzu Corporation) was used for the ultraviolet-visible absorption spectrum measurement. The measurement conditions were measurement cell length: 1 cm, and temp...

Embodiment 3

[0081] Adsorptivity of palladium complex (I) to carboxyl groups:

[0082] In the palladium complex (I), whether the free amino groups and guanidine groups belonging to cationic groups interact with the carboxyl groups on the resin surface is based on the use of other non-basic palladium-amino acid complexes synthesized in Comparative Example 1. , the amount of adsorption of palladium complexes on the resin surface and the precipitation of electroless plating are judged.

[0083] Polyimide resin (KAPTON 100-EN: manufactured by Toray-DuPont Co., Ltd.) was carboxylated by the following procedure, and a sequential plasma emission spectrometer (manufactured by Shimadzu Corporation) was used. ) Determining the precipitation of electroless nickel when treated with various palladium-amino acid complexes and the amount of palladium adsorption after reduction treatment. The working procedure is as follows, and the measurement results are shown in Table 1.

[0084] [Operation process] ...

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Abstract

The object is to provide a technique for forming a selective metal coating film on a non-conductive resin by allowing a catalyst metal to adsorb selectively onto an anionic group (e.g., a carboxyl group) on the resin. Thus, disclosed are: a palladium complex represented by the formula (I) below or a structural isomer thereof; a catalyst-imparting treatment solution for electroless plating, comprising the palladium complex or the isomer as an active ingredient; and a method for formation of a metal plating coating film on a non-conductive resin, comprising the steps of subjecting a non-conductive resin having an anionic group formed on its surface to a catalyst-imparting treatment with the catalyst-imparting treatment solution and then performing reduction treatment, electroless metal plating and electrolytic plating. (I) wherein L represents an alkylene group; and R represents an amino group or a guanidyl group.

Description

technical field [0001] The present invention relates to a palladium complex and a catalyst-imparting treatment solution using the complex, and more specifically, to a palladium complex formed of basic amino acid and palladium and using the palladium complex to make non- A catalyst imparting treatment solution capable of selectively adsorbing palladium on the surface of the conductive resin. Background technique [0002] In recent years, along with miniaturization and higher performance of electronic equipment, higher wiring density and higher performance of printed wiring boards are required. Polyimide resin has been practically used as a base film for flexible printed circuit boards or TAP tapes due to its excellent properties such as heat resistance, electrical insulation, mechanical strength, and flexibility. Most imide resins are used in the form of copper-clad polyimide substrates that are coated with copper on the surface. [0003] Examples of the method for producin...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C18/28C07C229/08C07C229/22C07C229/24C07C229/26C07C279/14C07F15/00
CPCB01J23/44B01J37/0215C23C18/1653C23C18/30C23C18/2086C23C18/22C07F15/00C23C18/28
Inventor 高德诚滨田实香
Owner EBARA-UDYLITE CO LTD
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