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Releasable resin composition, molded object thereof, and layered product

A resin composition, mold release technology, applied in the direction of synthetic resin layered products, film/sheet release liners, layered products, etc., can solve the problems of smoke, low thermal stability, foaming, etc.

Active Publication Date: 2008-12-24
NITTO DENKO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, the above-mentioned conventional urethane-based release agents have low thermal stability, and are thermally decomposed during composition preparation or extrusion molding to generate low-molecular-weight impurities, causing problems such as fuming, foaming, and metal roll contamination. , if the release layer and the adhesive layer containing the release agent are stacked against each other, impurities will transfer from the release layer to the adhesive surface of the adhesive layer, and there will be problems such as reduced adhesive performance, so it may not meet the requirements as a release agent

Method used

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  • Releasable resin composition, molded object thereof, and layered product
  • Releasable resin composition, molded object thereof, and layered product

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0057] Hereinafter, although an Example demonstrates this invention more concretely, this invention is not limited to the following Example unless the gist is exceeded.

[0058] Also, hereinafter, "parts" all mean "parts by weight".

[0059] [Analytical method]

[0060] The analysis methods of the mold release agents and thermoplastic polymers used in the following examples are as follows.

[0061](1) Weight-average molecular weight of polymer compound: evaluated by GPC method. The device uses "HLC8020" manufactured by Tosoh Corporation (solvent: tetrahydrofuran, temperature: 40°C, flow rate: 1.0ml / min, column: PLgel 10μm MIXED-B 30cm x 2, detector: RI (built-in the device) )) means that in the obtained molecular weight distribution diagram, the molecular weight ratio polystyrene conversion molecular weight is 3.0×10 3 The weight average molecular weight of the component with a high peak valley (minimum value) in the vicinity.

[0062] (2) 2% and 5% weight reduction temper...

preparation example 1

[0071] Ethylene-acetic alcohol copolymer (manufactured by Kuraray Co., Ltd., trade name "Eval E-171B", ethylene structural unit: 44 mol%, weight average molecular weight: 9.17 × 10 4 ) 100 parts were dispersed in 1160 parts of toluene, while refluxing for 2 hours, the moisture was separated and removed on the way of the reflux device. Then, it was cooled to 40° C., 280 parts of dimethyl sulfoxide was added, and 269 parts of octadecyl isocyanate (manufactured by Hodogaya Chemical Industry Co., Ltd., trade name “Mirionet ○”) was added dropwise while stirring, so that The equivalent ratio of the isocyanate group to the hydroxyl group of the ethylene-vinyl alcohol copolymer was 0.6 equivalent, and the reaction was carried out at 120° C. for 4 hours. During the period, the residual isocyanate groups in the system were quantified with an infrared spectrophotometer (2260cm -1 near), with the disappearance point of the residual components as the end point.

[0072] After completion ...

preparation example 2

[0075] Except for the use of ethylene-vinyl alcohol copolymer (manufactured by Kuraray Co., trade name "Eval E-151B", ethylene structural unit: 44 mol%, weight average molecular weight: 1.23×10 5 ) to replace the ethylene-vinyl alcohol copolymer used in Preparation Example 1, the same operation as Preparation Example 1 to obtain a weight average molecular weight of 1.59 × 10 5 , the total content of impurity [2] and impurity [3] is 0.11% by weight, the addition amount of isocyanate is 34 mol%, and the release agent (A) (A) ( Hereinafter referred to as "release agent (A-2)").

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Abstract

A releasable resin composition which has excellent thermal stability during extrusion molding, etc., does not cause problems such as fuming and foaming during compound preparation or extrusion molding, and does not foul metallic rolls. It can form a release layer which, when contacted with a pressure-sensitive adhesive layer, is free from a problem that an impurity migrates from the release layer to reduce pressure-sensitive adhesive performance. The releasable resin composition comprises a release agent (A) comprising as the main component a polymer having a C8-30 aliphatic group and having a weight-average molecular weight of 10,000-1,000,000 and a thermoplastic polymer (B) comprising constituent units derived from an olefin monomer and / or a polar monomer, the content of the release agent (A) being 0.1-20 parts by weight per 100 parts by weight of the thermoplastic polymer (B). The release agent (A) has a 2 percent weight loss temperature as determined by thermogravimetric analysis in a 260-275 DEG C region, excluding 275 DEG C, and a 5 percent weight loss temperature in a 275-330 DEG C region, excluding 330 DEG C.

Description

technical field [0001] The present invention relates to a releasable resin composition, its molded body, and laminated body. More specifically, it relates to a non-silicone mold release resin composition excellent in thermal stability capable of extrusion molding, a molded article thereof, and a laminate including the molded article. Background technique [0002] Conventionally, as a method for forming a release layer such as a release layer of a separator or a backside treatment layer of an adhesive tape, a method of applying a solution of a release agent to a substrate such as a film or paper and drying it is used. However, in recent years, ansolvation has been studied in consideration of environmental and cost requirements. Among them, a release film obtained by extruding a polyolefin resin with a good balance of physical and chemical properties and excellent film formability, blended with a release agent, is used as a release film having sufficient release performance o...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B29C33/62B29C33/68B32B27/00B32B27/32C08L23/00C09J7/00C09J7/40
CPCB29C33/62B29C33/68C08K5/29C08L23/02C08L23/06C08L23/0846C08L23/0861C08L23/10C09J2423/005C09J7/40C08L23/0853C08L29/02C08L2207/066C08L2666/06C08L2666/20C08L23/00C08L75/04B32B27/32
Inventor 斋藤真纪金井慎一郎关基弘山本谕花木一康林圭治奥村和人
Owner NITTO DENKO CORP
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