Electrical contact material with Ti3SiC2 multi-layer compound structure and preparation technique
An electrical contact material and multi-layer composite technology, which is applied in the field of powder metallurgy materials, can solve the problems of low cost, high cost, and needs to be improved, and achieve the effect of good conductivity and high strength
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Embodiment 1
[0052] Surface layer: Ti3SiC2, thickness 120μm;
[0053] Auxiliary layer: diamond 0.8%, silver balance, thickness 200μm;
[0054] Substrate: pure copper, thickness 1.4mm;
[0055] Welding layer: tin 3.5%, silver 5.0%, zinc 2.0%, phosphorus 4.3%, copper balance, thickness 0.1mm.
Embodiment 2
[0057] Surface layer: Ti3SiC2, thickness 400μm;
[0058] Auxiliary layer: zinc oxide 8.0%, silver balance, thickness 400μm;
[0059] Substrate: lanthanum 2%, copper balance, thickness 1.1mm;
[0060] Welding layer: tin 4.0%, silver 5.0%, zinc 2.2%, phosphorus 4.5%, copper balance, thickness 0.1mm.
Embodiment 3
[0062] Surface layer: Ti3SiC2, thickness 200μm;
[0063] Auxiliary layer: tin oxide 8.0%, indium oxide 4.0%, silver balance, thickness 250μm;
[0064] Substrate: diamond 1.3%, lanthanum 0.5%, copper balance, thickness 1.1mm;
[0065] Welding layer: tin 4.5%, silver 5.2%, zinc 2.0%, phosphorus 5.0%, copper balance, thickness 0.1mm.
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