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Positive photosensitive polyimide containing silazane chain structure and preparation method thereof

A technology of photosensitive polyimide and chain structure, which is applied in the direction of photomechanical equipment, photographic process of patterned surface, optics, etc., can solve the problems of easy foaming of the coating film, poor film-forming property, and small adhesion, and achieve Strong adhesion, good film-forming property, strong adhesion effect

Inactive Publication Date: 2009-02-11
UNIV OF ELECTRONICS SCI & TECH OF CHINA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the huge rigid diazonaphthoquinone sulfonate group on the side chain of the molecule makes the adhesion of polyamic acid or polyimide on SiN, AlN and other substrates weak, and the film-forming property is poor. Easy to foam or even crack

Method used

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  • Positive photosensitive polyimide containing silazane chain structure and preparation method thereof
  • Positive photosensitive polyimide containing silazane chain structure and preparation method thereof
  • Positive photosensitive polyimide containing silazane chain structure and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

specific Embodiment approach 1

[0034] With stirrer and N 2 Add 8.7g of pyromellitic dianhydride and 23ml of N-methylpyrrolidone into the 100ml three-necked flask of the protective device, and stir to dissolve. Add 10ml of N-methylpyrrolidone and 8.0g of 4,4-diaminodiphenyl ether in sequence into a 50ml dropping funnel, shake well until completely dissolved, then add dropwise to pyromellitic acid at a rate of 1-2 drops / second In the dianhydride solution, the reaction was stirred for 6 hours after the dropwise addition was completed. Under vigorous stirring, the reaction solution was poured into 100ml of absolute ethanol, and the solid precipitated after standing still. The obtained solid was filtered, and the filter cake was rinsed with absolute ethanol for 3 times, and then vacuum-dried to obtain 13.2 g of pale yellow solid polyamic acid.

[0035] With stirrer and N 2 Add 4.2 g of polyamic acid, 3.0 g of chlorosilylamino-o-diazonaphthoquinone and 40 ml of N-methylpyrrolidone into a 100 ml brown three-neck...

specific Embodiment approach 2

[0036] With stirrer and N 2 Add 4.4g of pyromellitic dianhydride and 20ml of N,N-dimethylformamide into the 100ml three-necked flask of the protective device, and stir to dissolve. Add 10ml of N,N-dimethylformamide and 4.0g of 4,4'-diaminodiphenylmethane in sequence to a 50ml dropping funnel, shake well until completely dissolved, then add dropwise at a rate of 1-2 drops / second to the homogeneous In the pyromellitic dianhydride solution, stir and react for 4 hours after the dropwise addition is completed. Under vigorous stirring, the reaction solution was poured into 100ml of absolute ethanol, and the solid was precipitated after standing. The obtained solid was filtered, and the filter cake was rinsed with absolute ethanol for 3 times, and then vacuum-dried to obtain 6.1 g of light yellow solid polyamic acid.

[0037] With stirrer and N 2 Add 4.0 g of polyamic acid, 2.8 g of chlorosilylamino-o-diazonaphthoquinone and 40 ml of N-methylpyrrolidone into a 100 ml brown three-ne...

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Abstract

The invention discloses a positive photosensitive polyimide containing a silicon-amine chain structure and a preparation method thereof, which pertains to the technical field of material and relates to a high polymer material with high heat resistance and a sensitization function. The positive photosensitive polyimide containing the silicon-amine chain structure is an organic fiber-shaped polymer material of which the main material is composed of polyamic acid with lateral chains of different polymerization degrees containing photosensitive groups. tetracarboxylic dianhydride and diamine are taken as raw materials, dissolved with an organic solvent, and reacts at room temperature with stirring; reagent is filtered, washed and dried to obtain the polyamic acid; the polyamic acid and chlorosilane amido diazonaphthoquinone are dissolved in an organic solvent and reacts at room temperature with stirring, reagent is filtered, washed and dried to obtain the positive photosensitive polyimide containing the silicon-amine chain structure. The positive photosensitive polyimide containing a silicon-amine chain structure has strong adhesion, good film forming ability, and high resolution ratio and heat resistance. The positive photosensitive polyimide can be used in photolithographic processes of optical devices, optoelectronic devices, microelectronic devices and other devices.

Description

technical field [0001] A positive photosensitive polyimide containing a silicon ammonia chain structure and a preparation method thereof belong to the field of material technology, and relate to high heat-resistant photosensitive functional polymer materials and a preparation method thereof. Background technique [0002] The excellent thermal stability, mechanical stability and chemical stability of photosensitive polyimide as well as good electrical insulation performance and photosensitive performance make it used as radiation shielding material, sacrificial layer material, insulating dielectric material, buffer material, liquid crystal alignment material, Nonlinear optical materials, optical waveguide materials, ion implantation masks and other polymer functional materials and process materials are widely used in optical devices, optoelectronic devices, microelectronic devices and corresponding device processing technology. Photosensitive polyimide is divided into positiv...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G73/10G03F7/039
Inventor 王涛唐先忠蒋亚东袁凯王军
Owner UNIV OF ELECTRONICS SCI & TECH OF CHINA
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