Halogen-free flame-proof epoxy resin composition and bonding sheet and copper clad laminate prepared thereby

A technology of epoxy resin and composition, applied in the fields of halogen-free flame retardant epoxy resin composition, adhesive sheet for printed circuit and copper clad laminate, can solve the problem of poor heat resistance of the board, high brittleness of the board, and processing problems. To solve problems such as poor performance, it can achieve the effect of low water absorption, good processing performance and low thermal expansion coefficient.

Active Publication Date: 2009-03-04
GUANGDONG SHENGYI SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] At present, the main technical approach to realize halogen-free flame retardant copper clad laminates is to use phosphorus-containing epoxy resin as the main resin, and then use dicyandiamide or phenolic resin as the curing agent, but use dicyandiamide as the curing agent for phosphorus-containing epoxy resin. The board has poor heat resistance and high water absorption; if phenolic resin is used as the curing agent for phosphorus-containing epoxy resin, the board has high brittleness and poor processability

Method used

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  • Halogen-free flame-proof epoxy resin composition and bonding sheet and copper clad laminate prepared thereby

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0033] Embodiment 1: Weigh 70 parts by weight of bisphenol F type benzoxazine, 30 parts by weight of phenolic resin and 0.1 part by weight of 2-methylimidazole, mix the raw materials with acetone as solvent, and prepare a solid content of 65 % resin solution.

[0034] Dip eight sheets of 7628E glass fiber cloth into the resin solution for gluing, bake in an oven at 170°C for 8 minutes to make a semi-cured adhesive sheet for printed circuit.

[0035] Then, the eight printed circuits are superimposed with adhesive sheets, covered with a 35 μm electrolytic copper foil on the upper and lower sides, and hot-pressed in a vacuum press for 90 minutes under the conditions of temperature 190°C and pressure 35Kgf / cm2 to obtain Copper clad laminates for printed circuits with a thickness of 1.6 mm.

Embodiment 2

[0036] Embodiment 2: Weigh 50 parts by weight of bisphenol F type benzoxazine, 20 parts by weight of phenolic resin, 30 parts by weight of silicon dioxide and 0.1 part by weight of 2-methylimidazole, and use acetone as solvent after mixing the raw materials , Prepared into a resin solution with a solid content of 65%.

[0037] The production of the bonding sheet for the printed circuit and the copper-clad laminate is the same as in Example 1.

Embodiment 3

[0038] Embodiment 3: take by weighing 40 parts by weight of bisphenol F type benzoxazine, 10 parts by weight of phenolic resin, 30 parts by weight of silicon dioxide, 20 parts by weight of magnesium hydroxide and 0.2 parts by weight of 2-methylimidazole, the After the raw materials are mixed, acetone is used as a solvent to prepare a resin solution with a solid content of 65%.

[0039] The production of the bonding sheet for the printed circuit and the copper-clad laminate is the same as in Example 1.

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Abstract

The invention relates to a zero-halogen flame-retardant epoxy resin compound as well as a bonding sheet and a copper clad laminate manufactured by using the zero-halogen flame-retardant epoxy resin compound. The resin compound consists of a compound and a solvent; the compound includes: bisphenol F-shaped benzoxazole, a phenolic resin and fittings. The copper clad laminate manufactured by using the resin compound includes a laminate and tinsel coated on one side or two sides of the laminate; the laminate includes a plurality of bonding sheets which are mutually bonded; the bonding sheets are manufactured by adopting the zero-halogen flame-retardant epoxy resin compound. The resin compound does not contain the halogen and has excellent flame-retardant performance; the bonding sheets and the copper clad laminate manufactured by using the resin compound have the advantages of high heat-resistance, high reliability, hard flaming performance, low water absorption rate and low heat expansion coefficient as well as excellent processing performance.

Description

technical field [0001] The invention relates to an epoxy resin composition, an adhesive sheet and a copper-clad laminate made of it, in particular to a halogen-free flame-retardant epoxy resin composition, and an adhesive for printed circuits made of it. sheets and copper clad laminates. Background technique [0002] Traditional copper-clad laminates for printed circuits use brominated epoxy resins, and the bromine element in them achieves the purpose of flame retardancy. However, in the past ten years, researchers from Switzerland, Germany, Japan and other countries have successively detected carcinogens such as dioxins and dibenzofurans in the combustion products of electronic and electrical equipment wastes containing halogens such as bromine and chlorine. Halogen products generate a lot of smoke during the combustion process and release highly corrosive hydrogen halides. At the same time, as human beings pay more and more attention to environmental protection, on July ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08L79/02C08L61/06C08K3/22C08K3/34C08K3/36C08K3/26C08K5/3492C08J5/24B32B15/092B32B15/20H05K1/03
Inventor 王猛王碧武何岳山茹敬宏苏世国
Owner GUANGDONG SHENGYI SCI TECH
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