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Cyanate esters electric packaging material and microwave curing preparation method thereof

A technology of electronic packaging materials and cyanate resins, applied in chemical instruments and methods, other chemical processes, etc., can solve problems affecting the mechanical properties of electronic packaging materials, achieve excellent mechanical properties and dielectric properties, short curing time, The effect of simple preparation process

Active Publication Date: 2009-04-01
南通优尼科化工有限公司 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, excessive use of fillers will affect the mechanical properties of electronic packaging materials

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] First, heat and melt 50 parts of bismaleimide prepolymer, add 100 parts of cyanate resin and heat and stir, react at 80-120°C for 5-30 minutes, then add 0.3 parts treated with coupling agent KH-560 Nano-silica and 20 parts of micro-silica are stirred evenly, poured into a polytetrafluoroethylene mold, vacuumized to remove air bubbles, and then put into a microwave oven for curing. The curing process is a variable power intermittent curing method: curing at 480W for 3 to 30 minutes, 640W for 1 to 10 minutes, and 800W for 1 to 10 minutes. Finally, post-treatment at 150-180° C. for 1-4 hours to obtain cyanate-based electronic packaging materials.

Embodiment 2

[0027] First, heat and melt 50 parts of bismaleimide prepolymer, add 100 parts of cyanate resin and heat and stir, and react at 80-120°C for 5-30 minutes, then add 0.5 parts of Nano-silica and 30 parts of micro-silica are stirred evenly, poured into a polytetrafluoroethylene mold, vacuumed to remove air bubbles, and then put into a microwave for curing. The curing process is a variable power intermittent curing method: curing at 480W for 3 to 30 minutes, 640W for 1 to 10 minutes, and 800W for 1 to 10 minutes. Finally, post-treatment at 150-180° C. for 1-4 hours to obtain cyanate-based electronic packaging materials.

Embodiment 3

[0029] First, heat and melt 50 parts of bismaleimide prepolymer, add 100 parts of cyanate resin and heat and stir, and react at 80-120°C for 5-30 minutes, then add 0.5 parts of Nano silicon dioxide and 40 parts of micron silicon dioxide are stirred evenly, poured into a preheated polytetrafluoroethylene mold, vacuumized to remove air bubbles, and then put into a microwave for curing. The curing process is a variable power intermittent curing method: curing at 480W for 3 to 30 minutes, 640W for 1 to 10 minutes, and 800W for 1 to 10 minutes. Finally, post-treatment at 150-180° C. for 1-4 hours to obtain cyanate-based electronic packaging materials.

[0030] The performance indicators of the cyanate ester electronic packaging material prepared by the microwave curing method prepared in this implementation are as follows:

[0031] Tensile strength ≥ 50Mpa; impact strength ≥ 10kJ / m 2

[0032] Bending strength ≥ 90Mpa; Bending modulus ≥ 15Gpa;

[0033] Heat distortion temperatur...

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Abstract

The invention relates to an ethylene rhodanate electronic packing material and a microwave solidification preparation method thereof, which is technically characterized by comprising the following components: ethylene rhodanate resin, bismaleimides prepolymer, nano-silicon dioxide and micron-silicon dioxide and is prepared as follows: the bismaleimides prepolymer which is firstly heated and added with the ethylene rhodanate resin and also with the mixture of the nano- and the micron-silicon dioxide, then the obtained mixture is poured into a preheated polyfluortetraethylene mould; and the mould is vacuumized and then put into a microwave oven for carrying out variable-power intermittent solidification so as to acquire the ethylene rhodanate electronic packing material. The content of reactive diluent allyl ether in the bismaleimides prepolymer of the invention is beneficial to the dispersion of inorganic filler and can play the role of toughening under high temperature. Due to the adoption of the microwave solidification and variable-power intermittent solidification methods for preparing the material, the preparation process is simple, and the obtained material has excellent mechanical and dielectric properties and can be used as the integrated circuit boards or packing materials in the electronic field.

Description

technical field [0001] The invention relates to a cyanate-based electronic packaging material and a microwave curing preparation method thereof, which is a cyanate modified by using a bismaleimide resin prepolymer containing allyl ether as a resin matrix. The mixture of nano-silica and micro-silica is used as a filler, and the composite material with excellent mechanical properties, thermal properties and dielectric properties prepared by variable power intermittent microwave curing method can be used as an electronic packaging material. Background technique [0002] Microwave, as a new thermal energy technology instead of the traditional heating method, is a very novel research direction in recent years. Compared with the traditional heating method, microwave has fast heating speed and thermal energy utilization. High efficiency, fast control and other advantages can be realized. It is widely used in the processing of epoxy resin, but there is no report on the preparation ...

Claims

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Application Information

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IPC IPC(8): C08L79/04C08K3/36C08K9/06C08J3/24C09K3/10
Inventor 颜红侠赵景飞马晓燕宁荣昌
Owner 南通优尼科化工有限公司
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