Inorganic filler and organic filler-containing curable resin composition, resist film coated printed wiring board, and method for producing the same

A technology of curing resins and inorganic fillers, applied in printed circuit manufacturing, printed circuits, printed circuits, etc., can solve the problems of limitations, insufficient crack resistance of cured films, inability to impart cured films, etc., to achieve high functionality and excellent resistance. cracking effect

Active Publication Date: 2009-04-08
SANEI KAGAKU KK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when a large amount of inorganic filler is mixed with the curable resin composition in any of the above cases, the crack resistance of the obtained cured film is regrettably insufficient
Therefore, th

Method used

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  • Inorganic filler and organic filler-containing curable resin composition, resist film coated printed wiring board, and method for producing the same
  • Inorganic filler and organic filler-containing curable resin composition, resist film coated printed wiring board, and method for producing the same
  • Inorganic filler and organic filler-containing curable resin composition, resist film coated printed wiring board, and method for producing the same

Examples

Experimental program
Comparison scheme
Effect test

Example

Preparation Example 1

Add 250 parts by weight of dipropylene glycol monomethyl ether and 10 parts by weight of tert-butyl peroxy-2-ethylhexanoate to a separable flask equipped with a stirrer, a thermometer, a reflux condenser, a dropping funnel and a nitrogen introduction tube, And heat them to 95°C. Then, a mixture of 170 parts by weight of methacrylic acid, 130 parts by weight of methyl methacrylate, 250 parts by weight of dipropylene glycol monomethyl ether and 10 parts by weight of azobisdimethylvaleronitrile was added drop by drop to it during 4 hours . In addition, they were aged for 5 hours to obtain a methacrylic acid-methyl methacrylate copolymer solution having a carboxyl group. Next, let the mixed gas of 7% oxygen-93% nitrogen pass through the resin solution at the same time, add 200 parts by weight of (3,4-epoxycyclohexyl) methyl methacrylate and 2 parts by weight of triphenylphosphine And 1 part by weight of hydroquinone monomethyl ether, and carry out their addition r...

Example

Preparation Example 2

140 parts by weight of glycidyl methacrylate, 60 parts by weight of methyl methacrylate, and 200 parts by weight of carbitol were added to a separable flask equipped with a reflux condenser, a thermometer, a glass tube for nitrogen replacement, and a stirrer Acetate, 0.4 parts by weight of lauryl mercaptan, and 6 parts by weight of azobis(isobutyronitrile). They were heated in a nitrogen stream and polymerized at 75°C for 5 hours to obtain a 50% copolymer solution. To the above 50% copolymer solution, 0.1 parts by weight of hydroquinone, 74 parts by weight of acrylic acid, and 0.4 parts by weight of dimethylbenzylamine were added, and their addition reaction was performed at 100°C for 24 hours. Then, 90 parts by weight of tetrahydrophthalic anhydride and 158 parts by weight of carbitol acetate were added thereto, and they were reacted at 100° C. for 3 hours to obtain a solid content of 50% and a double bond equivalent of 350 g / mol , An unsaturated group-conta...

Example

[General formula 3]

215 parts by weight of cresol novolak type epoxy resin (N-680 produced by Dainippon Ink & Chemicals, Inc., epoxy equivalent = 215) was put into a four-necked flask equipped with a stirrer and a reflux condenser. 196 parts by weight of propylene glycol monomethyl ether acetate was added thereto and dissolved under heating. Next, 0.46 parts by weight of methylhydroquinone as a polymerization inhibitor and 1.38 parts by weight of triphenylphosphine as a reaction catalyst were added thereto. This mixture was heated at 95-105°C, and 72 parts by weight (1 equivalent) of acrylic acid was gradually added to it drop by drop. They were reacted for about 32 hours to obtain a reaction product with an acid value of 0.9 mgKOH / g. This reaction product (hydroxyl group: 1 equivalent) was cooled to 80-90°C, and 76 parts by weight (0.5 equivalent) of tetrahydrophthalic anhydride was added thereto. They were allowed to react for approximately 8 hours and discharged after cooling. ...

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Abstract

A curable resin composition comprises: (I) 100 parts by-weight of a curable resin; (II) 10 to 1200 parts by weight of an inorganic filler; and (III) 1 to 100 parts by weight of an organic filler having an elastic modulus of 1 to 2000 (MPa) and an average particle diameter of 0.01 to 10 mum, wherein a content weight ratio of the components (II) and (III) is 1 to 41.

Description

technical field [0001] The present invention relates to a curable resin composition usable as a resist ink for printed wiring boards (particularly white printed wiring boards and printed wiring boards for mounting heat generating parts, etc.), resist film-coated printed wiring Plates and methods of making them. Background technique [0002] Curable resin compositions containing (filled with) various functionalized inorganic fillers are generally known. For example, there are known thermosetting resins containing a colorant (titanium oxide) and a fluorescent agent as reflective inorganic fillers to improve the reflectivity of a white laminate of printed wiring substrates in the short-wavelength region of visible light (patent File 1). [0003] Alternatively, there are known thermosetting resin varnishes that contain a highly thermally conductive material (aluminum oxide, etc.) as a thermally radiating inorganic filler to apply high thermal radiation to the covering in...

Claims

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Application Information

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IPC IPC(8): C08L51/00C08L63/00C08F290/00C08K9/00C08K3/22G03F7/028G03F7/004H05K1/03
CPCC08F20/28C08K3/013C08L101/00G03F7/0382G03F7/0385G03F7/0388G03F7/0757H05K3/287H05K2201/0209H05K2201/0212
Inventor 久能敏光畔柳安宏臼井幸弘小船井诚
Owner SANEI KAGAKU KK
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