Polyamide acid imide obtained by end-group exchange and preparation thereof

A technology of polyamide-imide and terminal group, which is applied in the field of polyamide-imide and its preparation, can solve the problems of low-molecular-weight end-group-blocked PAI, affect the growth of PAI molecular chain, and limit the application of PAI, so as to broaden the use Range, storage stability, simple polymerization process effect
CN101434701AInactive Publication Date: 2009-05-20SICHUAN UNIV
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
SICHUAN UNIV
Publication Date
2009-05-20
Estimated Expiration
Not applicable · inactive patent

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Abstract

The invention discloses polyamide imide which is obtained by the exchange of terminal groups. The structural general formula of the polyamide imide is showed on the right, wherein, X in the formula is the remanent part of diisocyanate removed diisocyanato; the R' is the remanent structure of a compound containing active hydrogen removed hydrogen and the limiting viscosity number thereof is 0.1dL / g to 0.4dL / g. The invention also discloses a preparation method of the polyamide imide. As the polyamide imide provided by the invention which is obtained by the exchange of terminal groups not only has a great variety of terminal groups, thus being capable of obtaining polyamide imide which cannot be obtained through direct terminating method, but also has a higher molecular weight, stable storage and is characterized by simple preparation and low cost, and the polyamide imide disclosed by the invention can greatly widen the application range of the polyamide imide.
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Description

technical field

[0001] The invention belongs to the technical field of polyamide-imide and its preparation method, and in particular relates to a polyamide-imide obtained by terminal group exchange and its preparation method. Background technique

[0002] Polyimide (PI) is a class of high-performance polymers containing imide rings in the main chain, among which the research on fully aromatic polyimide has attracted much attention. Due to its excellent thermal stability, mechanical properties, chemical inertness, dielectric properties, and radiation resistance, PI has been widely used in aerospace, electronics industries, etc. in commercial forms such as films, coatings, fibers, plastics, adhesives, and resin-based composites. High-tech fields have been widely used. However, due to its rigid molecular structure and strong intermolecular forces, traditional aromatic polyimides are usually insoluble and infusible, which brings great difficulties to the processing of materials...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
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