Leadless bismuth oxide sealing glass for sealing electron device and preparation method thereof

Abstract

The invention relates to lead-free bismuth oxide solder glass for sealing an electronic device and a preparation method thereof. The solder glass comprises the following components by weight percentage: 40 to 65 percent of Bi2O3, 10 to 40 percent of B2O3, 5 to 25 percent of BaO, 1 to 10 percent of ZnO, 1 to 10 percent of Al2O3, 0.1 to 10 percent of TiO2, 0.1 to 10 percent of CaO, 0.1 to 10 percent of CeO2, 0.1 to 5 percent of Sb2O3, and 0.1 to 5 percent of Cr2O3. The preparation method comprises the following steps: (1) weighing raw materials; (2) mixing the raw materials; (3) preheating the raw materials; (4) adding the mixture into a quartz crucible to melt, and preserving heat; (5) pelleting the molten glass by a pelleting machine; and (6) ball-milling, sieving, detecting and packaging the glass. The bismuth oxide solder glass contains no lead, has the characteristics of good air tightness, good sealing fluidity and wide expansion coefficient adjustment range; and the expansion coefficient of the glass is between 60*10<-7> and 100*10<-7> / DEG C, and the firing temperature is between 500 and 570 DEG C, and the glass is suitable for sealing of glass, ceramic, metal, semiconductors, and the like.

Description

technical field [0001] The invention belongs to the field of lead-free solder glass and its preparation, in particular to a lead-free bismuth oxide solder glass used for sealing electronic devices and a preparation method thereof. Background technique [0002] Electric vacuum glass and electronic glass include electric light source, electron tube, cathode ray tube (CRT), display (LCD, FPD) glass, and other types of electronic device substrates (such as optical discs, magnetic disk substrates). There are many glass components used in electric light sources, electron tubes, cathode ray tubes, and displays. [0003] In electric vacuum tungsten group, molybdenum group and other low expansion coefficient glasses, as well as sealing glasses commonly used in electric light sources and electron tubes, the low-alkali borosilicate system is usually used as the basic component, and lead glasses are generally not used, only a few containing PbO, such as The DW 216 and DW 217 of the tung...

AI Technical Summary

Problems solved by technology

The softening temperature of the glass is 400-430°C, and the coefficient of thermal expansion is 145-170×10 -7 / °C, although the softening temperature of the glass is suitable for low-melt sealing, but the content of alkali metal oxides is high, resulting in poor chemical stability and electrical properties. In addition, the glass has a large thermal expansion coefficient and cannot be used for medium and The seal with low expansion coefficient contains a small amount of lead at the same time, so it cannot meet the requirements of lead-free

In addition, due to the noble metal ZrO 2 The content is relatively high, so there is also no advantage in terms of cost

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