Photo sensitive resin compositon, optical spacer, protective film, coloring pattern, display device and substrate thereof

A technology of photosensitive resin and composition, applied in the field of photosensitive resin composition, can solve problems such as difficulty in obtaining spacer shape and film thickness, etc.

Active Publication Date: 2009-07-01
FUJIFILM CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, existing materials at 1500J/m 2 It is difficult to obtain a good spacer shape and film thickness with the following exposure amount
[0005] In addition, the requirements for the controllability of the shape and film thickness of spacers have become more and more stringent in recent years. For the changes in shape and film thickness caused by process changes

Method used

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  • Photo sensitive resin compositon, optical spacer, protective film, coloring pattern, display device and substrate thereof
  • Photo sensitive resin compositon, optical spacer, protective film, coloring pattern, display device and substrate thereof
  • Photo sensitive resin compositon, optical spacer, protective film, coloring pattern, display device and substrate thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0285] Hereinafter, although an Example demonstrates this invention more concretely, unless the summary is exceeded, this invention is not limited to a following Example. In addition, "part" is based on mass unless otherwise indicated.

[0286] In addition, the weight average molecular weight is measured using gel permeation chromatography (GPC). For GPC, HLC-8020GPC (manufactured by TOSOH Co., Ltd.) was used. Three TSKgel and Super Multipore HZ-H (manufactured by TOSOH Co., Ltd., 4.6 mmID×15 cm) were used as columns, and THF (tetrahydrofuran) was used as an eluent. In addition, as conditions, the sample concentration was set to 4.5% by mass, the flow rate was set to 0.35 ml / min, the sample injection volume was set to 10 μl, and the measurement temperature was set to 40° C., and the measurement was performed using an IR detector. In addition, the calibration curve is "Standard sample TSK standard, polystyrene" manufactured by TOSOH Corporation: "F-40", "F-20", "F-4", "F-1", "...

Synthetic example 1

[0290] (Synthesis of Exemplary Compound PD-52)

[0291] 7.48 parts of 1-methoxy-2-propanol (manufactured by MFG, Nippon Emulsifier Co., Ltd.) was previously added to the reaction vessel, the temperature was raised to 90°C, and the reaction vessel was added dropwise to the reaction vessel at 90°C over 2 hours under a nitrogen atmosphere. 3.1 parts of styrene (St), 4.28 parts of tricyclopentenyl methacrylate (TCPD-M manufactured by Hitachi Chemical Industry Co., Ltd.; x), 11.7 parts of methacrylic acid (MAA; y), and an azo polymerization initiator (Wako Pure Chemical Industries, Ltd., V-601) 2.08 parts and 55.2 parts of 1-methoxy-2-propanol. After dripping, it was made to react for 4 hours, and the acrylic resin solution was obtained.

[0292] Next, 0.15 parts of hydroquinone monomethyl ether and 0.34 parts of tetraethylammonium bromide were added to the above-mentioned acrylic resin solution, and then 26.4 parts of glycidyl methacrylate (GLM, manufactured by Tokyo Chemical Ind...

Synthetic example 2

[0297] (Synthesis of Exemplary Compound PU-52)

[0298] 7.48 parts of 1-methoxy-2-propanol (manufactured by MFG, Nippon Emulsifier Co., Ltd.) was previously added to the reaction vessel, the temperature was raised to 90°C, and the reaction vessel was added dropwise to the reaction vessel at 90°C over 2 hours under a nitrogen atmosphere. 3.1 parts of styrene (St), 4.28 parts of tricyclopentenyl methacrylate (TCPD-M manufactured by Hitachi Chemical Industry Co., Ltd.; x), 11.7 parts of methacrylic acid (MAA; y), and an azo polymerization initiator (Wako Pure Chemical Industries, Ltd., V-601) 2.08 parts and 55.2 parts of 1-methoxy-2-propanol. After dripping, it was made to react for 4 hours, and the acrylic resin solution was obtained.

[0299] Next, 0.15 parts of hydroquinone monomethyl ether and 0.34 parts of tetraethylammonium bromide were added to the above-mentioned acrylic resin solution, and then 26.4 parts of glycidyl methacrylate (GLM, manufactured by Tokyo Chemical Ind...

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Abstract

The present invention relates to a photosensitive resin compound, an optical spacer, a protective film, a coloring pattern, a display device and a substrate thereof. The photosensitive resin compound provided by the invention comprises the following components: (A) a resin which is provided with branched structure and/or alicyclic ring structure on the side chain, acidic group and substituted alkyl that is provided with two ethylenic linkage type unsaturated bonds, (B) a polymeric compound which is provided with ethylenic linkage type unsaturated bond, and (C) a photopolymerization initiatingagent. The photosensitive resin compound can form a pattern structure or protective film which has the advantages of high sensitivity, excellent storability in liquid state, excellent ageing stability and mechanical characteristic of photosensitive film after film forming.

Description

technical field [0001] The present invention relates to a photosensitive resin composition, a photo spacer, a method for forming the same, a protective film, a colored pattern, a substrate for a display device, and a display device. Background technique [0002] In recent years, the increase in the size of mother glass substrates has progressed due to the increase in the area of ​​liquid crystal display devices and the improvement in productivity. As far as the conventional substrate size (about 680×880mm) is concerned, since the substrate size is smaller than the mask size, it can be dealt with by the method of collective exposure. However, with the increase in the size of equipment in recent years, the need for large substrates (for example, about 1500 x 1800mm) has been increasing, but it is almost impossible to prepare a mask size equivalent to the above substrate size. way is difficult to deal with. [0003] Therefore, as an exposure method corresponding to a large su...

Claims

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Application Information

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IPC IPC(8): G03F7/028G03F7/00
CPCC08F22/00G03F7/027G03F7/028
Inventor 福重裕一宫宅一仁
Owner FUJIFILM CORP
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