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Micro-inductor device in planar magnetic core helical structure and preparation thereof

A technology of helical structure and plane helix, applied in the field of microelectronics, can solve the problems of device performance impact, difficulty in obtaining high-performance micro-inductance devices, etc., and achieve the effects of high operating frequency, avoiding undercutting phenomenon, and improving high-frequency characteristics.

Inactive Publication Date: 2009-07-08
SHANGHAI JIAO TONG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Moreover, in the production process, the author uses a semi-closed magnetic core structure, which produces magnetic flux leakage and affects the performance of the device, so it is difficult to obtain high-performance micro-inductance devices

Method used

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  • Micro-inductor device in planar magnetic core helical structure and preparation thereof
  • Micro-inductor device in planar magnetic core helical structure and preparation thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0049] (1) Sputter a 30nm-thick Cr layer on one side of the cleaned glass substrate (referred to as the B side), throw the positive glue AZ4000 series, the thickness of the photoresist is 3 μm, and then dry the photoresist ; Expose and develop the photoresist on the back, etch the Cr layer in the etching solution, and then remove all the photoresist with acetone; throw polyimide to a thickness of 3 μm, and then perform polyimide drying and curing process , resulting in a double-sided overlay alignment symbol.

[0050] (2) Spray epoxy resin AB glue on the other side of the glass substrate (called A side), and then bond the magnetic core material on the A side of the substrate, and let it dry naturally. The following processes are all carried out on side A;

[0051] (3) Throw away the positive resist, the thickness of the photoresist is 5 μm, dry the photoresist; expose and develop; then etch the magnetic core material in the acid etching solution, remove the photoresist and ep...

Embodiment 2

[0067] (1) Sputter a 50nm-thick Cr layer on one side of the cleaned glass substrate (referred to as the B side), throw the positive glue AZ4000 series, the thickness of the photoresist is 4 μm, and then dry the photoresist ; Expose and develop the photoresist on the back, etch the Cr layer in the etching solution, and then remove all the photoresist with acetone; throw polyimide to a thickness of 4 μm, and then perform polyimide drying and curing process , resulting in a double-sided overlay alignment symbol.

[0068] (2) Spray epoxy resin AB glue on the other side of the glass substrate (called A side), and then bond the magnetic core material on the A side of the substrate, and let it dry naturally. The following processes are all carried out on side A;

[0069] (3) Throw away the positive resist, the thickness of the photoresist is 8 μm, dry the photoresist; expose and develop; then etch the magnetic core material in the acid etching solution, remove the photoresist and ep...

Embodiment 3

[0085] (1) Sputter a layer of 80nm thick Cr layer on one side of the cleaned glass substrate (referred to as the B side), throw the positive glue AZ4000 series, the thickness of the photoresist is 5 μm, and then dry the photoresist ; Expose and develop the photoresist on the back side, etch the Cr layer in the etching solution, and then remove all the photoresist with acetone; throw polyimide with a thickness of 5 μm, and then perform polyimide drying and curing process , resulting in a double-sided overlay alignment symbol.

[0086] (2) Spray epoxy resin AB glue on the other side of the glass substrate (called A side), and then bond the magnetic core material on the A side of the substrate, and let it dry naturally. The following processes are all carried out on side A;

[0087](3) Throw away the positive resist, the thickness of the photoresist is 10 μm, dry the photoresist; expose and develop; then etch the magnetic core material in the acid etching solution, remove the ph...

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Abstract

The invention relates to a micro-inductor with a planar core helical structure, and a preparation method thereof, which belong to the microelectronic technical field. The micro-inductor comprises a substrate, a magnetic core material, an insulating material, a coil with a planar helical structure, pins and lead wires, wherein, the coil with the planar helical structure is wrapped by two layers of core material and separated by polyimide; and a central pin is connected with external pins. The process is as follows: sputtering of a layer of Cr, whirl coating, photoetching, developing, etching and overlay alignment symbols making; bonding of the magnetic core material, whirl coating, photoetching, developing, etching of the magnetic core material; fling, drying and solidifying of polyimide, and polishing; sputtering, whirl coating, photoetching, developing, galvanization, and manufacturing of the coil with a planar helical structure, lead wires and pins; fling, drying and solidifying of polyimide, and polishing; sputtering of a layer of Ti, whirl coating, photoetching, developing and etching; and bonding of the magnetic core material, whirl coating, photoetching, developing, and etching of the magnetic core material. The method greatly reduces the high-frequency loss of the micro-inductor and effectively improves the high-frequency property thereof.

Description

technical field [0001] The invention relates to a micro-inductance device in the field of microelectronic technology and a preparation method thereof, in particular to a planar magnetic core spiral structure micro-inductance device and a preparation method thereof. Background technique [0002] In recent years, miniaturized portable electronic products such as mobile communication products CDMA (Code Division Multiple Access), laptops, network products ADSL (Asymmetric Digital Subscriber Line), microprocessors, digital cameras, flash memory devices, audio, chargers, etc. It is getting more and more attention and welcome from the market. The miniaturization and miniaturization of these portable electronic products must first consider the miniaturization and miniaturization of electronic components. Magnetic devices such as inductive devices and their power transformers, DC-DC converters, oscillators, filters, amplifiers and tuners are indispensable and important components i...

Claims

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Application Information

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IPC IPC(8): H01F17/04H01F27/26H01F27/28H01F27/32H01F41/00
Inventor 周勇冯书谊周志敏雷冲
Owner SHANGHAI JIAO TONG UNIV
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